CN121153104A - 膜形成用组合物、基板的制造方法及膜形成用组合物的制造方法 - Google Patents

膜形成用组合物、基板的制造方法及膜形成用组合物的制造方法

Info

Publication number
CN121153104A
CN121153104A CN202480033666.9A CN202480033666A CN121153104A CN 121153104 A CN121153104 A CN 121153104A CN 202480033666 A CN202480033666 A CN 202480033666A CN 121153104 A CN121153104 A CN 121153104A
Authority
CN
China
Prior art keywords
film
forming composition
general formula
atoms
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480033666.9A
Other languages
English (en)
Chinese (zh)
Inventor
铁村美月
武久彩香
公文创一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of CN121153104A publication Critical patent/CN121153104A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/18Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
CN202480033666.9A 2023-05-31 2024-05-29 膜形成用组合物、基板的制造方法及膜形成用组合物的制造方法 Pending CN121153104A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023090176 2023-05-31
JP2023-090176 2023-05-31
PCT/JP2024/019656 WO2024248021A1 (ja) 2023-05-31 2024-05-29 膜形成用組成物、基板の製造方法、および膜形成用組成物の製造方法

Publications (1)

Publication Number Publication Date
CN121153104A true CN121153104A (zh) 2025-12-16

Family

ID=93658061

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480033666.9A Pending CN121153104A (zh) 2023-05-31 2024-05-29 膜形成用组合物、基板的制造方法及膜形成用组合物的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024248021A1 (https=)
KR (1) KR20260015280A (https=)
CN (1) CN121153104A (https=)
TW (1) TW202503015A (https=)
WO (1) WO2024248021A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663160B2 (ja) 2009-09-28 2015-02-04 東京応化工業株式会社 表面処理剤及び表面処理方法
SG185632A1 (en) 2010-06-07 2012-12-28 Central Glass Co Ltd Liquid chemical for foaming protecting film
KR102306472B1 (ko) * 2016-06-13 2021-09-29 후지필름 가부시키가이샤 액체 조성물이 수용된 수용 용기 및 액체 조성물의 보관 방법
US10593538B2 (en) * 2017-03-24 2020-03-17 Fujifilm Electronic Materials U.S.A., Inc. Surface treatment methods and compositions therefor
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
KR20230015958A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물

Also Published As

Publication number Publication date
KR20260015280A (ko) 2026-02-02
WO2024248021A1 (ja) 2024-12-05
TW202503015A (zh) 2025-01-16
JPWO2024248021A1 (https=) 2024-12-05

Similar Documents

Publication Publication Date Title
KR20140083046A (ko) 보호막 형성용 약액의 조제 방법
EP4535406A1 (en) Substrate processing method, and substrate manufacturing method
US20250066621A1 (en) Composition for film formation and method for manufacturing substrate
JP7727202B2 (ja) 半導体基板の表面処理方法、及び表面処理剤組成物
JP5716527B2 (ja) 撥水性保護膜形成用薬液と該薬液を用いたウェハの洗浄方法
CN121153104A (zh) 膜形成用组合物、基板的制造方法及膜形成用组合物的制造方法
US20250343040A1 (en) Substrate processing method and substrate production method
TWI886106B (zh) 斜角部處理劑組合物及晶圓之製造方法
JP7727203B2 (ja) 半導体基板の表面処理方法、及び表面処理剤組成物
WO2026063320A1 (ja) ウェハの製造方法、加熱蒸散用の表面処理組成物、表面処理組成物の使用方法、蒸気組成物および蒸気組成物の製造方法
US11282709B2 (en) Chemical agent for forming water repellent protective film and surface treatment method for wafers
TWI918655B (zh) 半導體基板的表面處理方法
KR20250132506A (ko) 기재의 처리 방법 및 기재의 제조 방법
TWI918656B (zh) 半導體基板的表面處理方法
TW202607805A (zh) 半導體裝置的製造方法、基材及矽化組成物
WO2025182440A1 (ja) 基材の製造方法、および含Ge酸化物用エッチング液

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination