KR20250145674A - 적층 세라믹 전자부품 - Google Patents

적층 세라믹 전자부품

Info

Publication number
KR20250145674A
KR20250145674A KR1020257030259A KR20257030259A KR20250145674A KR 20250145674 A KR20250145674 A KR 20250145674A KR 1020257030259 A KR1020257030259 A KR 1020257030259A KR 20257030259 A KR20257030259 A KR 20257030259A KR 20250145674 A KR20250145674 A KR 20250145674A
Authority
KR
South Korea
Prior art keywords
spacer
electronic component
ceramic electronic
convex portion
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257030259A
Other languages
English (en)
Korean (ko)
Inventor
타다테루 야마다
요스케 테라시타
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20250145674A publication Critical patent/KR20250145674A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020257030259A 2023-04-14 2024-03-26 적층 세라믹 전자부품 Pending KR20250145674A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-066335 2023-04-14
JP2023066335 2023-04-14
PCT/JP2024/011939 WO2024214531A1 (ja) 2023-04-14 2024-03-26 積層セラミック電子部品

Publications (1)

Publication Number Publication Date
KR20250145674A true KR20250145674A (ko) 2025-10-13

Family

ID=93059042

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257030259A Pending KR20250145674A (ko) 2023-04-14 2024-03-26 적층 세라믹 전자부품

Country Status (4)

Country Link
US (1) US20260018336A1 (https=)
JP (1) JPWO2024214531A1 (https=)
KR (1) KR20250145674A (https=)
WO (1) WO2024214531A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216337A (ja) 2014-05-08 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシター、アレイ型積層セラミックキャパシター、その製造方法、及びその実装基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06188536A (ja) * 1992-12-18 1994-07-08 Mitsubishi Electric Corp 混成集積回路装置
JP3857103B2 (ja) * 2001-10-22 2006-12-13 京セラ株式会社 配線基板
JP2014072241A (ja) * 2012-09-27 2014-04-21 Rohm Co Ltd チップ部品
JP7214950B2 (ja) * 2017-05-04 2023-01-31 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
KR102089703B1 (ko) * 2018-08-07 2020-03-16 삼성전기주식회사 적층형 전자 부품

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216337A (ja) 2014-05-08 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシター、アレイ型積層セラミックキャパシター、その製造方法、及びその実装基板

Also Published As

Publication number Publication date
WO2024214531A1 (ja) 2024-10-17
US20260018336A1 (en) 2026-01-15
JPWO2024214531A1 (https=) 2024-10-17

Similar Documents

Publication Publication Date Title
KR102951434B1 (ko) 적층 세라믹 콘덴서
JP7292958B2 (ja) 電子部品の実装構造体
KR102408016B1 (ko) 칩형 전자 부품
US9502178B2 (en) Monolithic capacitor
JP6714840B2 (ja) 積層セラミック電子部品およびその製造方法
CN106206011B (zh) 多层陶瓷电子组件、其制造方法和具有其的电路板
JP6481446B2 (ja) 積層コンデンサの実装構造体
KR101698167B1 (ko) 적층 세라믹 커패시터
KR102127803B1 (ko) 인터포저 및 이 인터포저를 포함하는 전자 부품
JP7548287B2 (ja) チップ型電子部品、電子部品の実装構造体および電子部品連
JP2018093051A (ja) 電子部品
JP2017069417A (ja) 積層コンデンサ
KR20210130645A (ko) 적층 세라믹 콘덴서
US12237111B2 (en) Multilayer ceramic capacitor
KR20250145674A (ko) 적층 세라믹 전자부품
US11688560B2 (en) Supporting-terminal-equipped capacitor chip
WO2023210465A1 (ja) 積層セラミックコンデンサ及び積層セラミックコンデンサの実装方法
US20260011503A1 (en) Multilayer ceramic electronic component
US20260018340A1 (en) Multilayer ceramic electronic component
CN121548868A (zh) 层叠陶瓷电容器
WO2025263243A1 (ja) 積層セラミックコンデンサ

Legal Events

Date Code Title Description
D11 Substantive examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE)

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902