KR20250134723A - 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Info

Publication number
KR20250134723A
KR20250134723A KR1020257029430A KR20257029430A KR20250134723A KR 20250134723 A KR20250134723 A KR 20250134723A KR 1020257029430 A KR1020257029430 A KR 1020257029430A KR 20257029430 A KR20257029430 A KR 20257029430A KR 20250134723 A KR20250134723 A KR 20250134723A
Authority
KR
South Korea
Prior art keywords
land
body surface
main body
intersection
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257029430A
Other languages
English (en)
Korean (ko)
Inventor
다카유키 오타
도시히코 다케다
가즈노리 오다
마코토 야마키
신야 기우라
마사시 이나가키
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20250134723A publication Critical patent/KR20250134723A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H01L23/46—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H01L23/367—
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Cookers (AREA)
KR1020257029430A 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 Pending KR20250134723A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2022-061295 2022-03-31
JP2022061295 2022-03-31
JP2022061290 2022-03-31
JPJP-P-2022-061290 2022-03-31
KR1020247034623A KR102857158B1 (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
PCT/JP2023/013416 WO2023191000A1 (ja) 2022-03-31 2023-03-30 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020247034623A Division KR102857158B1 (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Publications (1)

Publication Number Publication Date
KR20250134723A true KR20250134723A (ko) 2025-09-11

Family

ID=88202291

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257029430A Pending KR20250134723A (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
KR1020247034623A Active KR102857158B1 (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020247034623A Active KR102857158B1 (ko) 2022-03-31 2023-03-30 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Country Status (6)

Country Link
US (1) US20250169041A1 (https=)
JP (3) JP7537646B2 (https=)
KR (2) KR20250134723A (https=)
CN (1) CN119053830A (https=)
TW (1) TW202346776A (https=)
WO (1) WO2023191000A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218185267U (zh) * 2022-05-13 2023-01-03 深圳麦克韦尔科技有限公司 发热体、雾化器及电子雾化装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221369A1 (ja) 2017-06-01 2018-12-06 古河電気工業株式会社 平面型ヒートパイプ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09184696A (ja) * 1995-12-29 1997-07-15 Fujikura Ltd ヒートパイプ
JP7137783B2 (ja) * 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
JP7206649B2 (ja) * 2018-06-29 2023-01-18 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
JP7591187B2 (ja) * 2020-05-27 2024-11-28 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221369A1 (ja) 2017-06-01 2018-12-06 古河電気工業株式会社 平面型ヒートパイプ

Also Published As

Publication number Publication date
CN119053830A (zh) 2024-11-29
KR20240169006A (ko) 2024-12-02
JP7537646B2 (ja) 2024-08-21
JP2025014057A (ja) 2025-01-28
US20250169041A1 (en) 2025-05-22
JP7584027B2 (ja) 2024-11-15
TW202346776A (zh) 2023-12-01
JP2024150781A (ja) 2024-10-23
WO2023191000A1 (ja) 2023-10-05
JPWO2023191000A1 (https=) 2023-10-05
KR102857158B1 (ko) 2025-09-10

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