KR20250129030A - 중합 기판, 기판 처리 방법 및 기판 처리 시스템 - Google Patents

중합 기판, 기판 처리 방법 및 기판 처리 시스템

Info

Publication number
KR20250129030A
KR20250129030A KR1020257024444A KR20257024444A KR20250129030A KR 20250129030 A KR20250129030 A KR 20250129030A KR 1020257024444 A KR1020257024444 A KR 1020257024444A KR 20257024444 A KR20257024444 A KR 20257024444A KR 20250129030 A KR20250129030 A KR 20250129030A
Authority
KR
South Korea
Prior art keywords
substrate
adhesion
film
wafer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257024444A
Other languages
English (en)
Korean (ko)
Inventor
요헤이 야마시타
요스케 나카무라
료타 아라카와
카즈히로 시바
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250129030A publication Critical patent/KR20250129030A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/185—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H01L21/268—
    • H01L21/304—
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Recrystallisation Techniques (AREA)
  • Photovoltaic Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257024444A 2022-12-26 2023-12-13 중합 기판, 기판 처리 방법 및 기판 처리 시스템 Pending KR20250129030A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022208470 2022-12-26
JPJP-P-2022-208470 2022-12-26
PCT/JP2023/044736 WO2024142947A1 (ja) 2022-12-26 2023-12-13 重合基板、基板処理方法及び基板処理システム

Publications (1)

Publication Number Publication Date
KR20250129030A true KR20250129030A (ko) 2025-08-28

Family

ID=91717731

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257024444A Pending KR20250129030A (ko) 2022-12-26 2023-12-13 중합 기판, 기판 처리 방법 및 기판 처리 시스템

Country Status (5)

Country Link
JP (1) JPWO2024142947A1 (https=)
KR (1) KR20250129030A (https=)
CN (1) CN120303773A (https=)
TW (1) TW202430304A (https=)
WO (1) WO2024142947A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021199585A1 (ja) 2020-04-02 2021-10-07 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027740B2 (ja) * 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP6216727B2 (ja) * 2014-05-08 2017-10-18 東京応化工業株式会社 支持体分離方法
CN115335965B (zh) * 2020-03-24 2025-10-14 东京毅力科创株式会社 基板处理方法和基板处理装置
TW202236925A (zh) * 2021-01-15 2022-09-16 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN117157739A (zh) * 2021-03-31 2023-12-01 日产化学株式会社 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021199585A1 (ja) 2020-04-02 2021-10-07 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
TW202430304A (zh) 2024-08-01
JPWO2024142947A1 (https=) 2024-07-04
CN120303773A (zh) 2025-07-11
WO2024142947A1 (ja) 2024-07-04

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