CN120303773A - 重合基板、基板处理方法以及基板处理系统 - Google Patents

重合基板、基板处理方法以及基板处理系统 Download PDF

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Publication number
CN120303773A
CN120303773A CN202380086060.7A CN202380086060A CN120303773A CN 120303773 A CN120303773 A CN 120303773A CN 202380086060 A CN202380086060 A CN 202380086060A CN 120303773 A CN120303773 A CN 120303773A
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CN
China
Prior art keywords
substrate
adhesion
film
wafer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380086060.7A
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English (en)
Chinese (zh)
Inventor
山下阳平
中村洋介
荒川亮太
柴和宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN120303773A publication Critical patent/CN120303773A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Recrystallisation Techniques (AREA)
  • Photovoltaic Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380086060.7A 2022-12-26 2023-12-13 重合基板、基板处理方法以及基板处理系统 Pending CN120303773A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-208470 2022-12-26
JP2022208470 2022-12-26
PCT/JP2023/044736 WO2024142947A1 (ja) 2022-12-26 2023-12-13 重合基板、基板処理方法及び基板処理システム

Publications (1)

Publication Number Publication Date
CN120303773A true CN120303773A (zh) 2025-07-11

Family

ID=91717731

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380086060.7A Pending CN120303773A (zh) 2022-12-26 2023-12-13 重合基板、基板处理方法以及基板处理系统

Country Status (5)

Country Link
JP (1) JPWO2024142947A1 (https=)
KR (1) KR20250129030A (https=)
CN (1) CN120303773A (https=)
TW (1) TW202430304A (https=)
WO (1) WO2024142947A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027740B2 (ja) * 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP6216727B2 (ja) * 2014-05-08 2017-10-18 東京応化工業株式会社 支持体分離方法
CN115335965B (zh) * 2020-03-24 2025-10-14 东京毅力科创株式会社 基板处理方法和基板处理装置
KR102903522B1 (ko) 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
TW202236925A (zh) * 2021-01-15 2022-09-16 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN117157739A (zh) * 2021-03-31 2023-12-01 日产化学株式会社 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法

Also Published As

Publication number Publication date
TW202430304A (zh) 2024-08-01
JPWO2024142947A1 (https=) 2024-07-04
KR20250129030A (ko) 2025-08-28
WO2024142947A1 (ja) 2024-07-04

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