JPWO2024142947A1 - - Google Patents
Info
- Publication number
- JPWO2024142947A1 JPWO2024142947A1 JP2024567458A JP2024567458A JPWO2024142947A1 JP WO2024142947 A1 JPWO2024142947 A1 JP WO2024142947A1 JP 2024567458 A JP2024567458 A JP 2024567458A JP 2024567458 A JP2024567458 A JP 2024567458A JP WO2024142947 A1 JPWO2024142947 A1 JP WO2024142947A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022208470 | 2022-12-26 | ||
| PCT/JP2023/044736 WO2024142947A1 (ja) | 2022-12-26 | 2023-12-13 | 重合基板、基板処理方法及び基板処理システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024142947A1 true JPWO2024142947A1 (https=) | 2024-07-04 |
Family
ID=91717731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567458A Pending JPWO2024142947A1 (https=) | 2022-12-26 | 2023-12-13 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024142947A1 (https=) |
| KR (1) | KR20250129030A (https=) |
| CN (1) | CN120303773A (https=) |
| TW (1) | TW202430304A (https=) |
| WO (1) | WO2024142947A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4027740B2 (ja) * | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP6216727B2 (ja) * | 2014-05-08 | 2017-10-18 | 東京応化工業株式会社 | 支持体分離方法 |
| CN115335965B (zh) * | 2020-03-24 | 2025-10-14 | 东京毅力科创株式会社 | 基板处理方法和基板处理装置 |
| KR102903522B1 (ko) | 2020-04-02 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
| TW202236925A (zh) * | 2021-01-15 | 2022-09-16 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
| CN117157739A (zh) * | 2021-03-31 | 2023-12-01 | 日产化学株式会社 | 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法 |
-
2023
- 2023-12-13 TW TW112148380A patent/TW202430304A/zh unknown
- 2023-12-13 CN CN202380086060.7A patent/CN120303773A/zh active Pending
- 2023-12-13 WO PCT/JP2023/044736 patent/WO2024142947A1/ja not_active Ceased
- 2023-12-13 KR KR1020257024444A patent/KR20250129030A/ko active Pending
- 2023-12-13 JP JP2024567458A patent/JPWO2024142947A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202430304A (zh) | 2024-08-01 |
| CN120303773A (zh) | 2025-07-11 |
| KR20250129030A (ko) | 2025-08-28 |
| WO2024142947A1 (ja) | 2024-07-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250612 |