TW202430304A - 疊合基板、基板處理方法及基板處理系統 - Google Patents

疊合基板、基板處理方法及基板處理系統 Download PDF

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Publication number
TW202430304A
TW202430304A TW112148380A TW112148380A TW202430304A TW 202430304 A TW202430304 A TW 202430304A TW 112148380 A TW112148380 A TW 112148380A TW 112148380 A TW112148380 A TW 112148380A TW 202430304 A TW202430304 A TW 202430304A
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TW
Taiwan
Prior art keywords
substrate
film
adhesion
wafer
forming
Prior art date
Application number
TW112148380A
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English (en)
Chinese (zh)
Inventor
山下陽平
中村洋介
荒川亮太
柴和宏
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202430304A publication Critical patent/TW202430304A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Recrystallisation Techniques (AREA)
  • Photovoltaic Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW112148380A 2022-12-26 2023-12-13 疊合基板、基板處理方法及基板處理系統 TW202430304A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-208470 2022-12-26
JP2022208470 2022-12-26

Publications (1)

Publication Number Publication Date
TW202430304A true TW202430304A (zh) 2024-08-01

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ID=91717731

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TW112148380A TW202430304A (zh) 2022-12-26 2023-12-13 疊合基板、基板處理方法及基板處理系統

Country Status (5)

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JP (1) JPWO2024142947A1 (https=)
KR (1) KR20250129030A (https=)
CN (1) CN120303773A (https=)
TW (1) TW202430304A (https=)
WO (1) WO2024142947A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027740B2 (ja) * 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP6216727B2 (ja) * 2014-05-08 2017-10-18 東京応化工業株式会社 支持体分離方法
CN115335965B (zh) * 2020-03-24 2025-10-14 东京毅力科创株式会社 基板处理方法和基板处理装置
KR102903522B1 (ko) 2020-04-02 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
TW202236925A (zh) * 2021-01-15 2022-09-16 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN117157739A (zh) * 2021-03-31 2023-12-01 日产化学株式会社 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法

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Publication number Publication date
JPWO2024142947A1 (https=) 2024-07-04
CN120303773A (zh) 2025-07-11
KR20250129030A (ko) 2025-08-28
WO2024142947A1 (ja) 2024-07-04

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