KR20250128973A - 이송 장치 및 이송 방법 - Google Patents

이송 장치 및 이송 방법

Info

Publication number
KR20250128973A
KR20250128973A KR1020257020433A KR20257020433A KR20250128973A KR 20250128973 A KR20250128973 A KR 20250128973A KR 1020257020433 A KR1020257020433 A KR 1020257020433A KR 20257020433 A KR20257020433 A KR 20257020433A KR 20250128973 A KR20250128973 A KR 20250128973A
Authority
KR
South Korea
Prior art keywords
substrate
laser
optical system
transfer
starting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257020433A
Other languages
English (en)
Korean (ko)
Inventor
요시카즈 오타니
히로시 야마오카
다케토 우사미
마사미 구라타
Original Assignee
신에츠 엔지니어링 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에츠 엔지니어링 가부시키가이샤 filed Critical 신에츠 엔지니어링 가부시키가이샤
Publication of KR20250128973A publication Critical patent/KR20250128973A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/03—Manufacture or treatment using mass transfer of LEDs, e.g. by using liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • H01L21/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/019—Removal of at least a part of a substrate on which semiconductor layers have been formed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257020433A 2022-12-27 2022-12-27 이송 장치 및 이송 방법 Pending KR20250128973A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/048404 WO2024142328A1 (ja) 2022-12-27 2022-12-27 移送装置及び移送方法

Publications (1)

Publication Number Publication Date
KR20250128973A true KR20250128973A (ko) 2025-08-28

Family

ID=91716821

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257020433A Pending KR20250128973A (ko) 2022-12-27 2022-12-27 이송 장치 및 이송 방법

Country Status (6)

Country Link
JP (1) JPWO2024142328A1 (https=)
KR (1) KR20250128973A (https=)
CN (1) CN120418937A (https=)
DE (1) DE112022008132T5 (https=)
TW (1) TW202427663A (https=)
WO (1) WO2024142328A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021061396A (ja) 2019-10-02 2021-04-15 エーピー システムズ インコーポレイテッド チップ転写方法及びチップ転写装置
JP7111916B1 (ja) 2021-07-20 2022-08-02 信越化学工業株式会社 再転写方法及びリフト方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744770B2 (en) * 2004-06-23 2010-06-29 Sony Corporation Device transfer method
JP2018060993A (ja) * 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置
WO2021193135A1 (ja) * 2020-03-23 2021-09-30 東レエンジニアリング株式会社 実装方法、実装装置、および転写装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021061396A (ja) 2019-10-02 2021-04-15 エーピー システムズ インコーポレイテッド チップ転写方法及びチップ転写装置
JP7111916B1 (ja) 2021-07-20 2022-08-02 信越化学工業株式会社 再転写方法及びリフト方法

Also Published As

Publication number Publication date
DE112022008132T5 (de) 2025-10-16
WO2024142328A1 (ja) 2024-07-04
TW202427663A (zh) 2024-07-01
CN120418937A (zh) 2025-08-01
JPWO2024142328A1 (https=) 2024-07-04

Similar Documents

Publication Publication Date Title
TWI735695B (zh) 用於在基板間轉移電子元件的方法及設備
JP7130701B2 (ja) 基板上に個別部品を並列に組み立てる方法
TW202036838A (zh) 發光二極體(led)巨量轉移裝置及製造方法
TWI802665B (zh) 雷射轉移裝置和雷射轉移方法
TW201917811A (zh) 發光二極體質量傳遞設備及製造方法
KR20190000582A (ko) 칩 실장장치 및 이를 이용한 칩 실장방법
JP2019530201A (ja) マイクロデバイスのマスクレス並列ピックアンドプレース移載
JP7486521B2 (ja) 集光レンズの高さ調整方法およびチップ転写方法ならびに集光レンズの高さ調整装置およびチップ転写装置
JP7382453B2 (ja) 不良箇所の除去方法
KR20240023396A (ko) 마이크로구조화된 컴포넌트들을 제조하는 방법 및 시스템
US9755190B2 (en) Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
KR20250128973A (ko) 이송 장치 및 이송 방법
JP2021150614A (ja) 実装方法および実装装置
JP2021151666A (ja) 走査型縮小投影光学系及びこれを用いたレーザ加工装置
WO2024157426A1 (ja) 移送方法
US20260040741A1 (en) Method and apparatus for transferring electronic devices
US20250167170A1 (en) Laser transfer of microelectronic device and associated conductive pad
JPWO2024142328A5 (https=)
JP2024095815A (ja) レーザ加工方法、縮小投影光学系、基板の製造方法及びレーザ加工装置
TW202606532A (zh) 電子元件之轉移方法與用於轉移之裝置
JP2025132439A (ja) 素子アレイの製造方法、素子の除去方法、素子アレイのリペア方法、素子の除去装置、および素子アレイのリペア装置
TW202531397A (zh) 移載方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000