JPWO2024142328A1 - - Google Patents
Info
- Publication number
- JPWO2024142328A1 JPWO2024142328A1 JP2024567103A JP2024567103A JPWO2024142328A1 JP WO2024142328 A1 JPWO2024142328 A1 JP WO2024142328A1 JP 2024567103 A JP2024567103 A JP 2024567103A JP 2024567103 A JP2024567103 A JP 2024567103A JP WO2024142328 A1 JPWO2024142328 A1 JP WO2024142328A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/03—Manufacture or treatment using mass transfer of LEDs, e.g. by using liquid suspensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/019—Removal of at least a part of a substrate on which semiconductor layers have been formed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/048404 WO2024142328A1 (ja) | 2022-12-27 | 2022-12-27 | 移送装置及び移送方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024142328A1 true JPWO2024142328A1 (https=) | 2024-07-04 |
| JPWO2024142328A5 JPWO2024142328A5 (https=) | 2025-08-26 |
Family
ID=91716821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567103A Pending JPWO2024142328A1 (https=) | 2022-12-27 | 2022-12-27 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2024142328A1 (https=) |
| KR (1) | KR20250128973A (https=) |
| CN (1) | CN120418937A (https=) |
| DE (1) | DE112022008132T5 (https=) |
| TW (1) | TW202427663A (https=) |
| WO (1) | WO2024142328A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7744770B2 (en) * | 2004-06-23 | 2010-06-29 | Sony Corporation | Device transfer method |
| JP2018060993A (ja) * | 2016-09-29 | 2018-04-12 | 東レエンジニアリング株式会社 | 転写方法、実装方法、転写装置、及び実装装置 |
| KR102475755B1 (ko) | 2019-10-02 | 2022-12-09 | 에이피시스템 주식회사 | 칩 전사 방법 및 장치 |
| WO2021193135A1 (ja) * | 2020-03-23 | 2021-09-30 | 東レエンジニアリング株式会社 | 実装方法、実装装置、および転写装置 |
| EP4375002A4 (en) | 2021-07-20 | 2025-07-09 | Shinetsu Chemical Co | SCANNING-TYPE REDUCTION PROJECTION OPTICAL SYSTEM AND LASER MACHINING APPARATUS USING SAME |
-
2022
- 2022-12-27 JP JP2024567103A patent/JPWO2024142328A1/ja active Pending
- 2022-12-27 KR KR1020257020433A patent/KR20250128973A/ko active Pending
- 2022-12-27 CN CN202280102819.1A patent/CN120418937A/zh active Pending
- 2022-12-27 WO PCT/JP2022/048404 patent/WO2024142328A1/ja not_active Ceased
- 2022-12-27 DE DE112022008132.5T patent/DE112022008132T5/de active Pending
-
2023
- 2023-12-20 TW TW112149836A patent/TW202427663A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250128973A (ko) | 2025-08-28 |
| DE112022008132T5 (de) | 2025-10-16 |
| WO2024142328A1 (ja) | 2024-07-04 |
| TW202427663A (zh) | 2024-07-01 |
| CN120418937A (zh) | 2025-08-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250618 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250618 |