KR20250090335A - 접합 방법 및 레이저 가공 장치 - Google Patents

접합 방법 및 레이저 가공 장치 Download PDF

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Publication number
KR20250090335A
KR20250090335A KR1020257016446A KR20257016446A KR20250090335A KR 20250090335 A KR20250090335 A KR 20250090335A KR 1020257016446 A KR1020257016446 A KR 1020257016446A KR 20257016446 A KR20257016446 A KR 20257016446A KR 20250090335 A KR20250090335 A KR 20250090335A
Authority
KR
South Korea
Prior art keywords
bonding
bonding material
laser light
joining
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257016446A
Other languages
English (en)
Korean (ko)
Inventor
게이고 사토
노부야스 마츠모토
다카시 시게마츠
료야 마츠모토
도모미치 야스오카
가즈키 다카다
준 데라다
도시아키 사카이
가즈유키 우메노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20250090335A publication Critical patent/KR20250090335A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
KR1020257016446A 2022-11-24 2023-11-21 접합 방법 및 레이저 가공 장치 Pending KR20250090335A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022187688 2022-11-24
JPJP-P-2022-187688 2022-11-24
PCT/JP2023/041861 WO2024111593A1 (ja) 2022-11-24 2023-11-21 接合方法およびレーザ加工装置

Publications (1)

Publication Number Publication Date
KR20250090335A true KR20250090335A (ko) 2025-06-19

Family

ID=91196154

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257016446A Pending KR20250090335A (ko) 2022-11-24 2023-11-21 접합 방법 및 레이저 가공 장치

Country Status (5)

Country Link
US (1) US20250276393A1 (https=)
EP (1) EP4624086A1 (https=)
JP (1) JPWO2024111593A1 (https=)
KR (1) KR20250090335A (https=)
WO (1) WO2024111593A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503584B2 (ja) 1987-07-17 1996-06-05 住友化学工業株式会社 ラセミ―トランス第一菊酸類の製法
JP3156732B2 (ja) 1992-03-12 2001-04-16 東ソー・クォーツ株式会社 不透明石英ガラス
JP2007194462A (ja) 2006-01-20 2007-08-02 Toko Inc チップ部品の実装構造および方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62144871A (ja) * 1985-12-20 1987-06-29 Hitachi Ltd はんだ付け方法
JPH0422591A (ja) * 1990-05-08 1992-01-27 Fuji Electric Co Ltd レーザー半田付け装置
JP2503584Y2 (ja) 1990-06-21 1996-07-03 日本電気株式会社 レ―ザはんだ付け用プリント基板
JP2008254018A (ja) * 2007-04-04 2008-10-23 Olympus Corp レーザ接合装置
JP2009105266A (ja) * 2007-10-24 2009-05-14 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP3156732U (ja) 2009-10-29 2010-01-14 柏友照明科技股▲フン▼有限公司 リフローによる半田付けが可能で且つ放熱効果を高めるｌｅｄのパッケージ構造
WO2017195625A1 (ja) * 2016-05-11 2017-11-16 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2020072208A (ja) * 2018-11-01 2020-05-07 三菱電機株式会社 半導体装置、電力変換装置及び半導体装置の製造方法
JP2020184577A (ja) * 2019-05-08 2020-11-12 三菱電機株式会社 半導体装置の製造方法および接合材供給治具ならびにその製造方法
WO2021235196A1 (ja) 2020-05-21 2021-11-25 パナソニックＩｐマネジメント株式会社 チップ部品の実装構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503584B2 (ja) 1987-07-17 1996-06-05 住友化学工業株式会社 ラセミ―トランス第一菊酸類の製法
JP3156732B2 (ja) 1992-03-12 2001-04-16 東ソー・クォーツ株式会社 不透明石英ガラス
JP2007194462A (ja) 2006-01-20 2007-08-02 Toko Inc チップ部品の実装構造および方法

Also Published As

Publication number Publication date
US20250276393A1 (en) 2025-09-04
EP4624086A1 (en) 2025-10-01
JPWO2024111593A1 (https=) 2024-05-30
WO2024111593A1 (ja) 2024-05-30

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