JPWO2024111593A1 - - Google Patents
Info
- Publication number
- JPWO2024111593A1 JPWO2024111593A1 JP2024560166A JP2024560166A JPWO2024111593A1 JP WO2024111593 A1 JPWO2024111593 A1 JP WO2024111593A1 JP 2024560166 A JP2024560166 A JP 2024560166A JP 2024560166 A JP2024560166 A JP 2024560166A JP WO2024111593 A1 JPWO2024111593 A1 JP WO2024111593A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Soldering of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022187688 | 2022-11-24 | ||
| PCT/JP2023/041861 WO2024111593A1 (ja) | 2022-11-24 | 2023-11-21 | 接合方法およびレーザ加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111593A1 true JPWO2024111593A1 (https=) | 2024-05-30 |
Family
ID=91196154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024560166A Pending JPWO2024111593A1 (https=) | 2022-11-24 | 2023-11-21 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250276393A1 (https=) |
| EP (1) | EP4624086A1 (https=) |
| JP (1) | JPWO2024111593A1 (https=) |
| KR (1) | KR20250090335A (https=) |
| WO (1) | WO2024111593A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62144871A (ja) * | 1985-12-20 | 1987-06-29 | Hitachi Ltd | はんだ付け方法 |
| JPH0688933B2 (ja) | 1987-07-17 | 1994-11-09 | 住友化学工業株式会社 | 光学活性第一菊酸類のラセミ化法 |
| JPH0422591A (ja) * | 1990-05-08 | 1992-01-27 | Fuji Electric Co Ltd | レーザー半田付け装置 |
| JP2503584Y2 (ja) | 1990-06-21 | 1996-07-03 | 日本電気株式会社 | レ―ザはんだ付け用プリント基板 |
| JP3156732B2 (ja) | 1992-03-12 | 2001-04-16 | 東ソー・クォーツ株式会社 | 不透明石英ガラス |
| JP2007194462A (ja) | 2006-01-20 | 2007-08-02 | Toko Inc | チップ部品の実装構造および方法 |
| JP2008254018A (ja) * | 2007-04-04 | 2008-10-23 | Olympus Corp | レーザ接合装置 |
| JP2009105266A (ja) * | 2007-10-24 | 2009-05-14 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
| JP3156732U (ja) | 2009-10-29 | 2010-01-14 | 柏友照明科技股▲フン▼有限公司 | リフローによる半田付けが可能で且つ放熱効果を高めるｌｅｄのパッケージ構造 |
| WO2017195625A1 (ja) * | 2016-05-11 | 2017-11-16 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2020072208A (ja) * | 2018-11-01 | 2020-05-07 | 三菱電機株式会社 | 半導体装置、電力変換装置及び半導体装置の製造方法 |
| JP2020184577A (ja) * | 2019-05-08 | 2020-11-12 | 三菱電機株式会社 | 半導体装置の製造方法および接合材供給治具ならびにその製造方法 |
| WO2021235196A1 (ja) | 2020-05-21 | 2021-11-25 | パナソニックＩｐマネジメント株式会社 | チップ部品の実装構造 |
-
2023
- 2023-11-21 JP JP2024560166A patent/JPWO2024111593A1/ja active Pending
- 2023-11-21 KR KR1020257016446A patent/KR20250090335A/ko active Pending
- 2023-11-21 WO PCT/JP2023/041861 patent/WO2024111593A1/ja not_active Ceased
- 2023-11-21 EP EP23894598.4A patent/EP4624086A1/en active Pending
-
2025
- 2025-05-20 US US19/213,329 patent/US20250276393A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250276393A1 (en) | 2025-09-04 |
| EP4624086A1 (en) | 2025-10-01 |
| KR20250090335A (ko) | 2025-06-19 |
| WO2024111593A1 (ja) | 2024-05-30 |