KR20250087587A - 반도체 장치의 제조 방법 - Google Patents

반도체 장치의 제조 방법 Download PDF

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Publication number
KR20250087587A
KR20250087587A KR1020257014192A KR20257014192A KR20250087587A KR 20250087587 A KR20250087587 A KR 20250087587A KR 1020257014192 A KR1020257014192 A KR 1020257014192A KR 20257014192 A KR20257014192 A KR 20257014192A KR 20250087587 A KR20250087587 A KR 20250087587A
Authority
KR
South Korea
Prior art keywords
resin layer
laminate
manufacturing
group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257014192A
Other languages
English (en)
Korean (ko)
Inventor
유키 미야모토
해밀 최
유키히로 이와나가
마사유키 와다
게이이치 사카모토
마사히토 와타나베
히데카즈 곤도
고이치 사이토
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250087587A publication Critical patent/KR20250087587A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H01L21/02118—
    • H01L21/02282—
    • H01L21/304—
    • H01L21/31133—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020257014192A 2022-10-11 2023-10-06 반도체 장치의 제조 방법 Pending KR20250087587A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-163413 2022-10-11
JP2022163413 2022-10-11
PCT/JP2023/036619 WO2024080257A1 (ja) 2022-10-11 2023-10-06 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR20250087587A true KR20250087587A (ko) 2025-06-16

Family

ID=90669630

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257014192A Pending KR20250087587A (ko) 2022-10-11 2023-10-06 반도체 장치의 제조 방법

Country Status (6)

Country Link
US (1) US20250285921A1 (https=)
JP (1) JPWO2024080257A1 (https=)
KR (1) KR20250087587A (https=)
CN (1) CN119096331A (https=)
TW (1) TW202435301A (https=)
WO (1) WO2024080257A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034379A (ja) 2008-07-30 2010-02-12 Toyobo Co Ltd バックグラインドテープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016086158A (ja) * 2014-10-22 2016-05-19 セントラル硝子株式会社 ウエハ加工用積層体、ウエハ加工用仮接着材および薄型ウエハの製造方法
JP6429982B1 (ja) * 2017-12-05 2018-11-28 古河電気工業株式会社 マスク一体型表面保護テープ
JP7850704B2 (ja) * 2021-03-25 2026-04-23 日東電工株式会社 表面保護シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034379A (ja) 2008-07-30 2010-02-12 Toyobo Co Ltd バックグラインドテープ

Also Published As

Publication number Publication date
JPWO2024080257A1 (https=) 2024-04-18
WO2024080257A1 (ja) 2024-04-18
TW202435301A (zh) 2024-09-01
US20250285921A1 (en) 2025-09-11
CN119096331A (zh) 2024-12-06

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000