KR20250077473A - 수지 조성물, 경화물, 신틸레이터 패널 및 인덕터 - Google Patents

수지 조성물, 경화물, 신틸레이터 패널 및 인덕터 Download PDF

Info

Publication number
KR20250077473A
KR20250077473A KR1020257007972A KR20257007972A KR20250077473A KR 20250077473 A KR20250077473 A KR 20250077473A KR 1020257007972 A KR1020257007972 A KR 1020257007972A KR 20257007972 A KR20257007972 A KR 20257007972A KR 20250077473 A KR20250077473 A KR 20250077473A
Authority
KR
South Korea
Prior art keywords
resin composition
resin
compound
mass
scintillator panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257007972A
Other languages
English (en)
Korean (ko)
Inventor
하야토 나리키요
쇼 미야오
나츠미 오쿠라
Original Assignee
도레이 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20250077473A publication Critical patent/KR20250077473A/ko
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KHANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K4/00Conversion screens for the conversion of the spatial distribution of X-rays or particle radiation into visible images, e.g. fluoroscopic screens

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257007972A 2022-09-26 2023-08-23 수지 조성물, 경화물, 신틸레이터 패널 및 인덕터 Pending KR20250077473A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-152221 2022-09-26
JP2022152221 2022-09-26
PCT/JP2023/030321 WO2024070348A1 (ja) 2022-09-26 2023-08-23 樹脂組成物、硬化物、シンチレータパネルおよびインダクタ

Publications (1)

Publication Number Publication Date
KR20250077473A true KR20250077473A (ko) 2025-05-30

Family

ID=90477301

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257007972A Pending KR20250077473A (ko) 2022-09-26 2023-08-23 수지 조성물, 경화물, 신틸레이터 패널 및 인덕터

Country Status (5)

Country Link
US (1) US20260092142A1 (https=)
JP (1) JPWO2024070348A1 (https=)
KR (1) KR20250077473A (https=)
CN (1) CN119948407A (https=)
WO (1) WO2024070348A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205295A1 (ja) * 2024-03-26 2025-10-02 東レ株式会社 積層体、それを用いたシンチレータパネル、電子部品およびインダクタ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200327A1 (ja) 2020-03-30 2021-10-07 東レ株式会社 シンチレータパネルおよびシンチレータパネルの製造方法
WO2022024860A1 (ja) 2020-07-31 2022-02-03 東レ株式会社 シンチレータパネル、それを用いた放射線検出器、ラインカメラおよび放射線検査装置ならびにそれを用いたインライン検査方法および検査方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010520947A (ja) * 2007-03-14 2010-06-17 ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー Abs様物品を製造するための光硬化性組成物
JP2009244779A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp ネガ型レジスト組成物及びパターン形成方法
CN101776844A (zh) * 2009-01-14 2010-07-14 北京光创物成材料科技有限公司 一种用于立体成像的光固化组份
JP6247858B2 (ja) * 2013-08-01 2017-12-13 富士フイルム株式会社 パターン形成方法、及びこれを用いた電子デバイスの製造方法
JP2021155466A (ja) * 2020-03-25 2021-10-07 東レ株式会社 樹脂組成物、硬化膜、硬化膜の製造方法、有機el表示装置
JP2022130324A (ja) * 2021-02-25 2022-09-06 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP7844244B2 (ja) * 2021-05-07 2026-04-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
CN115703921B (zh) * 2021-08-13 2025-05-30 常州强力先端电子材料有限公司 光固化组合物及光刻胶

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200327A1 (ja) 2020-03-30 2021-10-07 東レ株式会社 シンチレータパネルおよびシンチレータパネルの製造方法
WO2022024860A1 (ja) 2020-07-31 2022-02-03 東レ株式会社 シンチレータパネル、それを用いた放射線検出器、ラインカメラおよび放射線検査装置ならびにそれを用いたインライン検査方法および検査方法

Also Published As

Publication number Publication date
CN119948407A (zh) 2025-05-06
JPWO2024070348A1 (https=) 2024-04-04
US20260092142A1 (en) 2026-04-02
WO2024070348A1 (ja) 2024-04-04

Similar Documents

Publication Publication Date Title
KR102381904B1 (ko) 감방사선 수지 조성물 및 전자 부품
CN114270261A (zh) 感光性树脂组合物、感光性树脂膜、多层印刷配线板和半导体封装体、以及多层印刷配线板的制造方法
JP5989929B1 (ja) 硬化性樹脂組成物
WO2019181444A1 (ja) シンチレータパネル、放射線検出器、およびシンチレータパネルの製造方法
EP3978544B1 (en) Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board
JP2025020272A (ja) 重合性不飽和基含有アルカリ可溶性樹脂及びその製造方法、並びに感光性樹脂組成物及びその硬化物
TWI844766B (zh) 閃爍器面板及閃爍器面板之製造方法
KR20250077473A (ko) 수지 조성물, 경화물, 신틸레이터 패널 및 인덕터
KR102554514B1 (ko) 감광성 수지 조성물
JP7844098B2 (ja) 硬化膜付き基板の製造方法、硬化膜付き基板、感光性樹脂組成物、感光性樹脂組成物を硬化してなる硬化膜および硬化膜または硬化膜付き基板を有する表示装置
CN116931372A (zh) 感光性树脂组合物
JP5300020B2 (ja) カルボキシル基含有樹脂、カルボキシル基含有樹脂組成物及びその硬化物
KR20230098173A (ko) 중합성 불포화기 함유 알칼리 가용성 수지, 그것을 필수 성분으로 하는 감광성 수지 조성물 및 그 경화물
JP2024150011A (ja) 感光性樹脂組成物、感光性エレメント、プリント配線板、及びプリント配線板の製造方法
WO2025126939A1 (ja) 感光性樹脂組成物膜、硬化物、それを用いたシンチレータパネルおよび半導体装置
JPWO2019188897A1 (ja) 重合性不飽和基含有アルカリ可溶性樹脂の製造方法、重合性不飽和基含有アルカリ可溶性樹脂、それを必須成分とする感光性樹脂組成物、およびその硬化膜
JP7654944B2 (ja) 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
WO2025205295A1 (ja) 積層体、それを用いたシンチレータパネル、電子部品およびインダクタ
JP2006208853A (ja) 感光性樹脂組成物及び感光性エレメント
JP2017145379A (ja) 硬化性樹脂組成物
KR20230028266A (ko) 감광성 수지 조성물, 드라이 필름, 프린트 배선판, 및 프린트 배선판의 제조 방법
JP2021054970A (ja) 重合性不飽和基含有アルカリ可溶性樹脂、その製造方法、感光性樹脂組成物、及びその硬化膜。
KR20250167016A (ko) 수지 조성물, 투명 재료, 투명 필름, 스크린 인쇄용 판재, 스크린 인쇄용 스텐실 및 감광성 레지스트 필름
KR20170109264A (ko) 화학증폭형 포지티브 감광형 유기절연막 수지 조성물 및 이로부터 제조된 절연막
JP2024046877A (ja) 樹脂組成物、樹脂組成物被膜、樹脂組成物フィルム、硬化膜、およびこれらを用いた半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000