KR20250042781A - 수지 조성물, 필름, 편광 시트, 수지 조성물의 제조 방법, 및 필름의 제조 방법 - Google Patents

수지 조성물, 필름, 편광 시트, 수지 조성물의 제조 방법, 및 필름의 제조 방법 Download PDF

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Publication number
KR20250042781A
KR20250042781A KR1020257005517A KR20257005517A KR20250042781A KR 20250042781 A KR20250042781 A KR 20250042781A KR 1020257005517 A KR1020257005517 A KR 1020257005517A KR 20257005517 A KR20257005517 A KR 20257005517A KR 20250042781 A KR20250042781 A KR 20250042781A
Authority
KR
South Korea
Prior art keywords
film
resin composition
mass
less
polyamide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257005517A
Other languages
English (en)
Korean (ko)
Inventor
메구무 고사카
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 filed Critical 미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Publication of KR20250042781A publication Critical patent/KR20250042781A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1525—Four-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020257005517A 2022-08-04 2023-08-01 수지 조성물, 필름, 편광 시트, 수지 조성물의 제조 방법, 및 필름의 제조 방법 Pending KR20250042781A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-124978 2022-08-04
JP2022124978A JP2024021847A (ja) 2022-08-04 2022-08-04 樹脂組成物、フィルム、偏光シート、樹脂組成物の製造方法、および、フィルムの製造方法
PCT/JP2023/028063 WO2024029515A1 (ja) 2022-08-04 2023-08-01 樹脂組成物、フィルム、偏光シート、樹脂組成物の製造方法、および、フィルムの製造方法

Publications (1)

Publication Number Publication Date
KR20250042781A true KR20250042781A (ko) 2025-03-27

Family

ID=89849354

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257005517A Pending KR20250042781A (ko) 2022-08-04 2023-08-01 수지 조성물, 필름, 편광 시트, 수지 조성물의 제조 방법, 및 필름의 제조 방법

Country Status (4)

Country Link
JP (1) JP2024021847A (https=)
KR (1) KR20250042781A (https=)
CN (1) CN119630741A (https=)
WO (1) WO2024029515A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025115722A1 (ja) * 2023-11-27 2025-06-05 三菱瓦斯化学株式会社 樹脂組成物、フィルム、偏光シート、および、サングラス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012131977A (ja) 2010-11-30 2012-07-12 Toray Ind Inc ポリマーアロイとその製造方法および成形品
JP2013001906A (ja) 2011-06-17 2013-01-07 Ems-Patent Ag 半芳香族成形材料及びその使用
JP2015129271A (ja) 2013-12-05 2015-07-16 東レ株式会社 炭素繊維強化ポリアミド樹脂組成物およびそれを成形してなる成形品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2967932B2 (ja) * 1990-02-15 1999-10-25 三井化学株式会社 成型用ポリアミド組成物
JP2975388B2 (ja) * 1990-02-15 1999-11-10 三井化学株式会社 ポリアミド組成物
JP3501810B2 (ja) * 1994-03-11 2004-03-02 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン 二量体脂肪酸からのポリアミド
DE4419592A1 (de) * 1994-06-03 1995-12-07 Bayer Ag Polyamidcompounds mit erhöhter Schmelzeviskosität, Verfahren zur Herstellung und ihre Verwendung
JP2003226818A (ja) * 2001-11-30 2003-08-15 Polyplastics Co 難燃性樹脂組成物
JP2011180266A (ja) * 2010-02-26 2011-09-15 Yamamoto Kogaku Co Ltd 偏光積層体および偏光レンズ、および偏光眼鏡
JP2013109116A (ja) * 2011-11-21 2013-06-06 Konica Minolta Advanced Layers Inc 偏光膜保護フィルムの製造方法、偏光膜保護フィルム、偏光板及びそれを用いた液晶表示装置
JP7350464B2 (ja) * 2017-09-07 2023-09-26 ポリプラ・エボニック株式会社 偏光性シート、及びこれを備えた偏光レンズ
MX2020006574A (es) * 2017-12-20 2020-11-13 Basf Se Compuesto de moldeo de poliamida de alta resistencia al calor.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012131977A (ja) 2010-11-30 2012-07-12 Toray Ind Inc ポリマーアロイとその製造方法および成形品
JP2013001906A (ja) 2011-06-17 2013-01-07 Ems-Patent Ag 半芳香族成形材料及びその使用
JP2015129271A (ja) 2013-12-05 2015-07-16 東レ株式会社 炭素繊維強化ポリアミド樹脂組成物およびそれを成形してなる成形品

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Publication number Publication date
JP2024021847A (ja) 2024-02-16
WO2024029515A1 (ja) 2024-02-08
CN119630741A (zh) 2025-03-14

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Date Code Title Description
PA0105 International application

Patent event date: 20250220

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application