KR20250036850A - 기판 보유 지지 장치, 기판 제조 장치 및 기판 제조 방법 - Google Patents

기판 보유 지지 장치, 기판 제조 장치 및 기판 제조 방법 Download PDF

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Publication number
KR20250036850A
KR20250036850A KR1020257004036A KR20257004036A KR20250036850A KR 20250036850 A KR20250036850 A KR 20250036850A KR 1020257004036 A KR1020257004036 A KR 1020257004036A KR 20257004036 A KR20257004036 A KR 20257004036A KR 20250036850 A KR20250036850 A KR 20250036850A
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KR
South Korea
Prior art keywords
substrate
holding
fluid
roller
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257004036A
Other languages
English (en)
Korean (ko)
Inventor
마사유키 사타케
마사유키 나카니시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20250036850A publication Critical patent/KR20250036850A/ko
Pending legal-status Critical Current

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Classifications

    • H01L21/683—
    • H01L21/67051—
    • H01L21/6715—
    • H01L21/68764—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257004036A 2022-07-13 2023-06-15 기판 보유 지지 장치, 기판 제조 장치 및 기판 제조 방법 Pending KR20250036850A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022112217A JP2024010749A (ja) 2022-07-13 2022-07-13 基板保持装置、基板製造装置、および基板製造方法
JPJP-P-2022-112217 2022-07-13
PCT/JP2023/022255 WO2024014223A1 (ja) 2022-07-13 2023-06-15 基板保持装置、基板製造装置、および基板製造方法

Publications (1)

Publication Number Publication Date
KR20250036850A true KR20250036850A (ko) 2025-03-14

Family

ID=89536422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257004036A Pending KR20250036850A (ko) 2022-07-13 2023-06-15 기판 보유 지지 장치, 기판 제조 장치 및 기판 제조 방법

Country Status (5)

Country Link
JP (1) JP2024010749A (https=)
KR (1) KR20250036850A (https=)
CN (1) CN119522473A (https=)
TW (1) TW202403935A (https=)
WO (1) WO2024014223A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022038834A (ja) 2020-08-27 2022-03-10 株式会社荏原製作所 基板処理方法、および基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3944368B2 (ja) * 2001-09-05 2007-07-11 株式会社荏原製作所 基板処理装置及び基板処理方法
JP2015126033A (ja) * 2013-12-25 2015-07-06 株式会社ディスコ 洗浄装置および加工装置
JP2019165152A (ja) * 2018-03-20 2019-09-26 エイブリック株式会社 半導体装置及び半導体装置の製造方法及び半導体集積回路装置の製造方法
TWI837277B (zh) * 2019-01-24 2024-04-01 日商東京威力科創股份有限公司 加工裝置及加工方法
JP7491774B2 (ja) * 2020-08-24 2024-05-28 株式会社荏原製作所 基板保持回転機構、基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022038834A (ja) 2020-08-27 2022-03-10 株式会社荏原製作所 基板処理方法、および基板処理装置

Also Published As

Publication number Publication date
JP2024010749A (ja) 2024-01-25
TW202403935A (zh) 2024-01-16
CN119522473A (zh) 2025-02-25
WO2024014223A1 (ja) 2024-01-18

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