KR20250026173A - 기판수납용기 및 리어 리테이너 - Google Patents
기판수납용기 및 리어 리테이너 Download PDFInfo
- Publication number
- KR20250026173A KR20250026173A KR1020247041092A KR20247041092A KR20250026173A KR 20250026173 A KR20250026173 A KR 20250026173A KR 1020247041092 A KR1020247041092 A KR 1020247041092A KR 20247041092 A KR20247041092 A KR 20247041092A KR 20250026173 A KR20250026173 A KR 20250026173A
- Authority
- KR
- South Korea
- Prior art keywords
- opening
- substrate
- lid
- container body
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
-
- H01L21/67383—
-
- H01L21/67386—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/025312 WO2023248464A1 (ja) | 2022-06-24 | 2022-06-24 | 基板収納容器及びリアリテーナ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250026173A true KR20250026173A (ko) | 2025-02-25 |
Family
ID=89379346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247041092A Pending KR20250026173A (ko) | 2022-06-24 | 2022-06-24 | 기판수납용기 및 리어 리테이너 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260082855A1 (https=) |
| JP (1) | JPWO2023248464A1 (https=) |
| KR (1) | KR20250026173A (https=) |
| CN (1) | CN119054062A (https=) |
| TW (1) | TW202401636A (https=) |
| WO (1) | WO2023248464A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025163816A1 (ja) * | 2024-01-31 | 2025-08-07 | ミライアル株式会社 | 基板収納容器 |
| WO2025253846A1 (ja) * | 2024-06-06 | 2025-12-11 | 信越ポリマー株式会社 | 基板収納容器 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776289B1 (en) * | 1996-07-12 | 2004-08-17 | Entegris, Inc. | Wafer container with minimal contact |
| JP4164891B2 (ja) * | 1998-03-03 | 2008-10-15 | 神鋼電機株式会社 | ウェーハ収納容器 |
| US5992638A (en) * | 1998-11-11 | 1999-11-30 | Empak, Inc. | Advanced wafer shipper |
| JP4146718B2 (ja) * | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
| JP2007142192A (ja) * | 2005-11-18 | 2007-06-07 | Miraial Kk | 薄板体収納容器 |
| KR20110002268A (ko) * | 2009-07-01 | 2011-01-07 | 비아이 이엠티 주식회사 | 리테이너와 이를 이용한 웨이퍼 운송용 박스 |
| JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
| WO2016046985A1 (ja) * | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
| JP6326342B2 (ja) * | 2014-09-29 | 2018-05-16 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
| US9881826B2 (en) * | 2014-10-24 | 2018-01-30 | Lam Research Corporation | Buffer station with single exit-flow direction |
| TWI680525B (zh) * | 2014-12-18 | 2019-12-21 | 美商恩特葛瑞斯股份有限公司 | 具有衝擊狀態保護的晶圓容置盒 |
| US11309200B2 (en) * | 2017-02-27 | 2022-04-19 | Miraial Co., Ltd. | Substrate storage container |
| US10937677B2 (en) * | 2018-04-02 | 2021-03-02 | Bum Je WOO | Wafer storage container |
| CN112074944B (zh) * | 2018-04-25 | 2024-07-05 | 未来儿股份有限公司 | 基板收纳容器 |
| JP7313975B2 (ja) * | 2019-08-27 | 2023-07-25 | 信越ポリマー株式会社 | 基板収納容器 |
| JP7414982B2 (ja) * | 2020-05-19 | 2024-01-16 | ミライアル株式会社 | 基板収納容器 |
-
2022
- 2022-06-24 WO PCT/JP2022/025312 patent/WO2023248464A1/ja not_active Ceased
- 2022-06-24 CN CN202280094990.2A patent/CN119054062A/zh active Pending
- 2022-06-24 JP JP2024528241A patent/JPWO2023248464A1/ja active Pending
- 2022-06-24 KR KR1020247041092A patent/KR20250026173A/ko active Pending
- 2022-06-24 US US18/878,482 patent/US20260082855A1/en active Pending
-
2023
- 2023-06-21 TW TW112123433A patent/TW202401636A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023248464A1 (https=) | 2023-12-28 |
| CN119054062A (zh) | 2024-11-29 |
| WO2023248464A1 (ja) | 2023-12-28 |
| TW202401636A (zh) | 2024-01-01 |
| US20260082855A1 (en) | 2026-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E13 | Pre-grant limitation requested |
Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |