JPWO2023248464A1 - - Google Patents
Info
- Publication number
- JPWO2023248464A1 JPWO2023248464A1 JP2024528241A JP2024528241A JPWO2023248464A1 JP WO2023248464 A1 JPWO2023248464 A1 JP WO2023248464A1 JP 2024528241 A JP2024528241 A JP 2024528241A JP 2024528241 A JP2024528241 A JP 2024528241A JP WO2023248464 A1 JPWO2023248464 A1 JP WO2023248464A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/025312 WO2023248464A1 (ja) | 2022-06-24 | 2022-06-24 | 基板収納容器及びリアリテーナ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248464A1 true JPWO2023248464A1 (https=) | 2023-12-28 |
| JPWO2023248464A5 JPWO2023248464A5 (https=) | 2025-06-03 |
Family
ID=89379346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528241A Pending JPWO2023248464A1 (https=) | 2022-06-24 | 2022-06-24 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260082855A1 (https=) |
| JP (1) | JPWO2023248464A1 (https=) |
| KR (1) | KR20250026173A (https=) |
| CN (1) | CN119054062A (https=) |
| TW (1) | TW202401636A (https=) |
| WO (1) | WO2023248464A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025163816A1 (ja) * | 2024-01-31 | 2025-08-07 | ミライアル株式会社 | 基板収納容器 |
| WO2025253846A1 (ja) * | 2024-06-06 | 2025-12-11 | 信越ポリマー株式会社 | 基板収納容器 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776289B1 (en) * | 1996-07-12 | 2004-08-17 | Entegris, Inc. | Wafer container with minimal contact |
| JP4164891B2 (ja) * | 1998-03-03 | 2008-10-15 | 神鋼電機株式会社 | ウェーハ収納容器 |
| US5992638A (en) * | 1998-11-11 | 1999-11-30 | Empak, Inc. | Advanced wafer shipper |
| JP4146718B2 (ja) * | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
| JP2007142192A (ja) * | 2005-11-18 | 2007-06-07 | Miraial Kk | 薄板体収納容器 |
| KR20110002268A (ko) * | 2009-07-01 | 2011-01-07 | 비아이 이엠티 주식회사 | 리테이너와 이를 이용한 웨이퍼 운송용 박스 |
| JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
| WO2016046985A1 (ja) * | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
| JP6326342B2 (ja) * | 2014-09-29 | 2018-05-16 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
| US9881826B2 (en) * | 2014-10-24 | 2018-01-30 | Lam Research Corporation | Buffer station with single exit-flow direction |
| TWI680525B (zh) * | 2014-12-18 | 2019-12-21 | 美商恩特葛瑞斯股份有限公司 | 具有衝擊狀態保護的晶圓容置盒 |
| US11309200B2 (en) * | 2017-02-27 | 2022-04-19 | Miraial Co., Ltd. | Substrate storage container |
| US10937677B2 (en) * | 2018-04-02 | 2021-03-02 | Bum Je WOO | Wafer storage container |
| CN112074944B (zh) * | 2018-04-25 | 2024-07-05 | 未来儿股份有限公司 | 基板收纳容器 |
| JP7313975B2 (ja) * | 2019-08-27 | 2023-07-25 | 信越ポリマー株式会社 | 基板収納容器 |
| JP7414982B2 (ja) * | 2020-05-19 | 2024-01-16 | ミライアル株式会社 | 基板収納容器 |
-
2022
- 2022-06-24 WO PCT/JP2022/025312 patent/WO2023248464A1/ja not_active Ceased
- 2022-06-24 CN CN202280094990.2A patent/CN119054062A/zh active Pending
- 2022-06-24 JP JP2024528241A patent/JPWO2023248464A1/ja active Pending
- 2022-06-24 KR KR1020247041092A patent/KR20250026173A/ko active Pending
- 2022-06-24 US US18/878,482 patent/US20260082855A1/en active Pending
-
2023
- 2023-06-21 TW TW112123433A patent/TW202401636A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250026173A (ko) | 2025-02-25 |
| CN119054062A (zh) | 2024-11-29 |
| WO2023248464A1 (ja) | 2023-12-28 |
| TW202401636A (zh) | 2024-01-01 |
| US20260082855A1 (en) | 2026-03-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250526 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250526 |