CN119054062A - 基板收纳容器以及后部保持构件 - Google Patents

基板收纳容器以及后部保持构件 Download PDF

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Publication number
CN119054062A
CN119054062A CN202280094990.2A CN202280094990A CN119054062A CN 119054062 A CN119054062 A CN 119054062A CN 202280094990 A CN202280094990 A CN 202280094990A CN 119054062 A CN119054062 A CN 119054062A
Authority
CN
China
Prior art keywords
container body
substrate
body opening
holding member
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280094990.2A
Other languages
English (en)
Chinese (zh)
Inventor
久保田幸二
西坂幸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of CN119054062A publication Critical patent/CN119054062A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280094990.2A 2022-06-24 2022-06-24 基板收纳容器以及后部保持构件 Pending CN119054062A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025312 WO2023248464A1 (ja) 2022-06-24 2022-06-24 基板収納容器及びリアリテーナ

Publications (1)

Publication Number Publication Date
CN119054062A true CN119054062A (zh) 2024-11-29

Family

ID=89379346

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280094990.2A Pending CN119054062A (zh) 2022-06-24 2022-06-24 基板收纳容器以及后部保持构件

Country Status (6)

Country Link
US (1) US20260082855A1 (https=)
JP (1) JPWO2023248464A1 (https=)
KR (1) KR20250026173A (https=)
CN (1) CN119054062A (https=)
TW (1) TW202401636A (https=)
WO (1) WO2023248464A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163816A1 (ja) * 2024-01-31 2025-08-07 ミライアル株式会社 基板収納容器
WO2025253846A1 (ja) * 2024-06-06 2025-12-11 信越ポリマー株式会社 基板収納容器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776289B1 (en) * 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
JP4164891B2 (ja) * 1998-03-03 2008-10-15 神鋼電機株式会社 ウェーハ収納容器
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
JP4146718B2 (ja) * 2002-12-27 2008-09-10 ミライアル株式会社 薄板支持容器
JP2007142192A (ja) * 2005-11-18 2007-06-07 Miraial Kk 薄板体収納容器
KR20110002268A (ko) * 2009-07-01 2011-01-07 비아이 이엠티 주식회사 리테이너와 이를 이용한 웨이퍼 운송용 박스
JP6375186B2 (ja) * 2014-09-05 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器、ロードポート装置および基板処理装置
WO2016046985A1 (ja) * 2014-09-26 2016-03-31 ミライアル株式会社 基板収納容器
JP6326342B2 (ja) * 2014-09-29 2018-05-16 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器、ロードポート装置および基板処理装置
US9881826B2 (en) * 2014-10-24 2018-01-30 Lam Research Corporation Buffer station with single exit-flow direction
TWI680525B (zh) * 2014-12-18 2019-12-21 美商恩特葛瑞斯股份有限公司 具有衝擊狀態保護的晶圓容置盒
US11309200B2 (en) * 2017-02-27 2022-04-19 Miraial Co., Ltd. Substrate storage container
US10937677B2 (en) * 2018-04-02 2021-03-02 Bum Je WOO Wafer storage container
CN112074944B (zh) * 2018-04-25 2024-07-05 未来儿股份有限公司 基板收纳容器
JP7313975B2 (ja) * 2019-08-27 2023-07-25 信越ポリマー株式会社 基板収納容器
JP7414982B2 (ja) * 2020-05-19 2024-01-16 ミライアル株式会社 基板収納容器

Also Published As

Publication number Publication date
KR20250026173A (ko) 2025-02-25
JPWO2023248464A1 (https=) 2023-12-28
WO2023248464A1 (ja) 2023-12-28
TW202401636A (zh) 2024-01-01
US20260082855A1 (en) 2026-03-19

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