KR20250023340A - Led 용 봉지제 - Google Patents

Led 용 봉지제 Download PDF

Info

Publication number
KR20250023340A
KR20250023340A KR1020247035387A KR20247035387A KR20250023340A KR 20250023340 A KR20250023340 A KR 20250023340A KR 1020247035387 A KR1020247035387 A KR 1020247035387A KR 20247035387 A KR20247035387 A KR 20247035387A KR 20250023340 A KR20250023340 A KR 20250023340A
Authority
KR
South Korea
Prior art keywords
led
compound
per molecule
encapsulating agent
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247035387A
Other languages
English (en)
Korean (ko)
Inventor
신야 우치노
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20250023340A publication Critical patent/KR20250023340A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
KR1020247035387A 2022-06-20 2023-06-16 Led 용 봉지제 Pending KR20250023340A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022098857 2022-06-20
JPJP-P-2022-098857 2022-06-20
PCT/JP2023/022448 WO2023248952A1 (ja) 2022-06-20 2023-06-16 Ｌｅｄ用封止剤

Publications (1)

Publication Number Publication Date
KR20250023340A true KR20250023340A (ko) 2025-02-18

Family

ID=89379940

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247035387A Pending KR20250023340A (ko) 2022-06-20 2023-06-16 Led 용 봉지제

Country Status (5)

Country Link
JP (1) JPWO2023248952A1 (https=)
KR (1) KR20250023340A (https=)
CN (1) CN119096373A (https=)
TW (1) TW202411307A (https=)
WO (1) WO2023248952A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121298131B (zh) * 2025-12-11 2026-02-06 长春理工大学 一种用于led封装胶密封性的检测方法、设备及介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212694A (ja) 2018-05-31 2019-12-12 株式会社ジャパンディスプレイ 表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495653B1 (en) * 1998-04-17 2002-12-17 Sanyo Chemical Industries, Ltd. Curable composition and cured article thereof
JP2009193995A (ja) * 2008-02-12 2009-08-27 Citizen Holdings Co Ltd Ｌｅｄ光源およびその色度調整方法
CN113993956B (zh) * 2019-05-31 2023-11-07 陶氏东丽株式会社 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019212694A (ja) 2018-05-31 2019-12-12 株式会社ジャパンディスプレイ 表示装置

Also Published As

Publication number Publication date
TW202411307A (zh) 2024-03-16
JPWO2023248952A1 (https=) 2023-12-28
WO2023248952A1 (ja) 2023-12-28
CN119096373A (zh) 2024-12-06

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241023

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application