JPWO2023248952A1 - - Google Patents

Info

Publication number
JPWO2023248952A1
JPWO2023248952A1 JP2023547708A JP2023547708A JPWO2023248952A1 JP WO2023248952 A1 JPWO2023248952 A1 JP WO2023248952A1 JP 2023547708 A JP2023547708 A JP 2023547708A JP 2023547708 A JP2023547708 A JP 2023547708A JP WO2023248952 A1 JPWO2023248952 A1 JP WO2023248952A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023547708A
Other languages
Japanese (ja)
Other versions
JPWO2023248952A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248952A1 publication Critical patent/JPWO2023248952A1/ja
Publication of JPWO2023248952A5 publication Critical patent/JPWO2023248952A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
JP2023547708A 2022-06-20 2023-06-16 Pending JPWO2023248952A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022098857 2022-06-20
PCT/JP2023/022448 WO2023248952A1 (ja) 2022-06-20 2023-06-16 Led用封止剤

Publications (2)

Publication Number Publication Date
JPWO2023248952A1 true JPWO2023248952A1 (https=) 2023-12-28
JPWO2023248952A5 JPWO2023248952A5 (https=) 2025-02-27

Family

ID=89379940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023547708A Pending JPWO2023248952A1 (https=) 2022-06-20 2023-06-16

Country Status (5)

Country Link
JP (1) JPWO2023248952A1 (https=)
KR (1) KR20250023340A (https=)
CN (1) CN119096373A (https=)
TW (1) TW202411307A (https=)
WO (1) WO2023248952A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121298131B (zh) * 2025-12-11 2026-02-06 长春理工大学 一种用于led封装胶密封性的检测方法、设备及介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495653B1 (en) * 1998-04-17 2002-12-17 Sanyo Chemical Industries, Ltd. Curable composition and cured article thereof
JP2009193995A (ja) * 2008-02-12 2009-08-27 Citizen Holdings Co Ltd Led光源およびその色度調整方法
JP6985983B2 (ja) 2018-05-31 2021-12-22 株式会社ジャパンディスプレイ 表示装置
CN113993956B (zh) * 2019-05-31 2023-11-07 陶氏东丽株式会社 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件

Also Published As

Publication number Publication date
TW202411307A (zh) 2024-03-16
WO2023248952A1 (ja) 2023-12-28
KR20250023340A (ko) 2025-02-18
CN119096373A (zh) 2024-12-06

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

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Effective date: 20230807

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Effective date: 20260317