CN119096373A - Led用密封剂 - Google Patents

Led用密封剂 Download PDF

Info

Publication number
CN119096373A
CN119096373A CN202380035676.1A CN202380035676A CN119096373A CN 119096373 A CN119096373 A CN 119096373A CN 202380035676 A CN202380035676 A CN 202380035676A CN 119096373 A CN119096373 A CN 119096373A
Authority
CN
China
Prior art keywords
led
compound
present
sealing agent
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380035676.1A
Other languages
English (en)
Chinese (zh)
Inventor
内野慎也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN119096373A publication Critical patent/CN119096373A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
CN202380035676.1A 2022-06-20 2023-06-16 Led用密封剂 Pending CN119096373A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-098857 2022-06-20
JP2022098857 2022-06-20
PCT/JP2023/022448 WO2023248952A1 (ja) 2022-06-20 2023-06-16 Led用封止剤

Publications (1)

Publication Number Publication Date
CN119096373A true CN119096373A (zh) 2024-12-06

Family

ID=89379940

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380035676.1A Pending CN119096373A (zh) 2022-06-20 2023-06-16 Led用密封剂

Country Status (5)

Country Link
JP (1) JPWO2023248952A1 (https=)
KR (1) KR20250023340A (https=)
CN (1) CN119096373A (https=)
TW (1) TW202411307A (https=)
WO (1) WO2023248952A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121298131B (zh) * 2025-12-11 2026-02-06 长春理工大学 一种用于led封装胶密封性的检测方法、设备及介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495653B1 (en) * 1998-04-17 2002-12-17 Sanyo Chemical Industries, Ltd. Curable composition and cured article thereof
JP2009193995A (ja) * 2008-02-12 2009-08-27 Citizen Holdings Co Ltd Led光源およびその色度調整方法
JP6985983B2 (ja) 2018-05-31 2021-12-22 株式会社ジャパンディスプレイ 表示装置
CN113993956B (zh) * 2019-05-31 2023-11-07 陶氏东丽株式会社 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件

Also Published As

Publication number Publication date
TW202411307A (zh) 2024-03-16
JPWO2023248952A1 (https=) 2023-12-28
WO2023248952A1 (ja) 2023-12-28
KR20250023340A (ko) 2025-02-18

Similar Documents

Publication Publication Date Title
TWI568799B (zh) A high-reliability hardened silicon oxide composition and an optical semiconductor device using the same
JP5157902B2 (ja) 硬化性組成物および含フッ素硬化物
JP5765237B2 (ja) フルオロポリマーおよび含フッ素硬化性樹脂組成物
JP2021134329A (ja) 紫外線硬化性シリコーン組成物及びこれを利用してなる封止材またはシートフィルム
CN119096373A (zh) Led用密封剂
JP7457686B2 (ja) 有機el表示素子用封止剤
JPWO2011096370A1 (ja) 含フッ素硬化性樹脂組成物
JP5767552B2 (ja) 半導体発光装置及びその製造方法
CN110731127B (zh) 有机el显示元件用密封剂
JP5810060B2 (ja) 半導体発光装置用封止剤、これを用いた半導体発光装置用封止材及び半導体発光装置
KR20240140977A (ko) 자외선 경화성 폴리실록산 조성물 및 댐핑재
CN113166626A (zh) 紫外线固化型有机硅压敏粘合剂组合物及其固化物
JP7474007B2 (ja) 光硬化性シリコーン樹脂組成物
JP5960021B2 (ja) 半導体発光装置用封止剤、これを用いた半導体発光装置用封止材及び半導体発光装置
JP5905332B2 (ja) 半導体発光素子用封止剤、これを用いた硬化膜及び半導体発光装置
KR20250120297A (ko) 자외선 경화성 실리콘 조성물
JP2014189668A (ja) 樹脂、樹脂組成物、これらを用いた光学部材及びその形成剤
CN111574838B (zh) 晶圆级光半导体装置用树脂组合物及使用了该组合物的晶圆级光半导体装置
JP5810012B2 (ja) 硬化性組成物、これを用いた半導体発光装置用封止材及び半導体発光装置
JP2008112908A (ja) 発光素子用封入剤および発光素子
JP7663789B2 (ja) 硬化性樹脂組成物
JP5972747B2 (ja) 半導体発光装置用封止剤、これを用いた半導体発光装置用封止材及び半導体発光装置
EP4502068A1 (en) Ultraviolet curable silicone composition
JP7397666B2 (ja) 有機el表示素子用封止剤
JP2024048448A (ja) 熱および光硬化型シリコーン組成物ならびにその硬化物の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination