KR20250011236A - 재료의 전환을 이용한 고체의 분할 - Google Patents

재료의 전환을 이용한 고체의 분할 Download PDF

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Publication number
KR20250011236A
KR20250011236A KR1020257000572A KR20257000572A KR20250011236A KR 20250011236 A KR20250011236 A KR 20250011236A KR 1020257000572 A KR1020257000572 A KR 1020257000572A KR 20257000572 A KR20257000572 A KR 20257000572A KR 20250011236 A KR20250011236 A KR 20250011236A
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KR
South Korea
Prior art keywords
solid
laser
deformation
solid state
laser beam
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257000572A
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English (en)
Korean (ko)
Inventor
리처 잔
크리스티안 베이어
랄프 리에스케
Original Assignee
실텍트라 게엠베하
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Priority claimed from DE102014018720.9A external-priority patent/DE102014018720A1/de
Priority claimed from DE102014018841.8A external-priority patent/DE102014018841A1/de
Priority claimed from DE102015000449.2A external-priority patent/DE102015000449A1/de
Application filed by 실텍트라 게엠베하 filed Critical 실텍트라 게엠베하
Publication of KR20250011236A publication Critical patent/KR20250011236A/ko
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020257000572A 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할 Pending KR20250011236A (ko)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
DE102014017583.9 2014-11-27
DE102014017582.0 2014-11-27
DE102014017583 2014-11-27
DE102014017582 2014-11-27
DE102014018841.8 2014-12-17
DE102014018720.9A DE102014018720A1 (de) 2014-11-27 2014-12-17 Festkörpertrennverfahren mit laserbasierter Vorschädigung
DE102014018841.8A DE102014018841A1 (de) 2014-11-27 2014-12-17 Laserbasiertes Trennverfahren
DE102014018720.9 2014-12-17
DE102015000449.2 2015-01-15
DE102015000449.2A DE102015000449A1 (de) 2015-01-15 2015-01-15 Festkörperteilung mittels Stoffumwandlung
KR1020237033908A KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
PCT/EP2015/077981 WO2016083610A2 (de) 2014-11-27 2015-11-27 Festkörperteilung mittels stoffumwandlung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237033908A Division KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Publications (1)

Publication Number Publication Date
KR20250011236A true KR20250011236A (ko) 2025-01-21

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Application Number Title Priority Date Filing Date
KR1020257000572A Pending KR20250011236A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020227014422A Active KR102587022B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020207001035A Ceased KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020177017549A Active KR101864558B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020237033908A Active KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020187014524A Ceased KR20180059569A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Family Applications After (5)

Application Number Title Priority Date Filing Date
KR1020227014422A Active KR102587022B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020207001035A Ceased KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020177017549A Active KR101864558B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020237033908A Active KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020187014524A Ceased KR20180059569A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Country Status (8)

Country Link
US (3) US11407066B2 (https=)
EP (6) EP4122633B1 (https=)
JP (2) JP6396505B2 (https=)
KR (6) KR20250011236A (https=)
CN (3) CN108838562B (https=)
MY (2) MY199526A (https=)
SG (1) SG11201704275UA (https=)
WO (1) WO2016083610A2 (https=)

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