KR20250006108A - 질화붕소 분말 및 그 제조 방법, 그리고 방열 시트 - Google Patents

질화붕소 분말 및 그 제조 방법, 그리고 방열 시트 Download PDF

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Publication number
KR20250006108A
KR20250006108A KR1020247037606A KR20247037606A KR20250006108A KR 20250006108 A KR20250006108 A KR 20250006108A KR 1020247037606 A KR1020247037606 A KR 1020247037606A KR 20247037606 A KR20247037606 A KR 20247037606A KR 20250006108 A KR20250006108 A KR 20250006108A
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South Korea
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boron nitride
powder
nitride powder
less
primary particles
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KR1020247037606A
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English (en)
Korean (ko)
Inventor
에이지 이누카이
후쿠마사 가토
고 다케다
하루카 다테오카
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덴카 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0645—Preparation by carboreductive nitridation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/40—Particle morphology extending in three dimensions prism-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247037606A 2022-04-21 2023-04-13 질화붕소 분말 및 그 제조 방법, 그리고 방열 시트 Pending KR20250006108A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-069926 2022-04-21
JP2022069926 2022-04-21
PCT/JP2023/015037 WO2023204140A1 (ja) 2022-04-21 2023-04-13 窒化ホウ素粉末、及び、その製造方法、並びに、放熱シート

Publications (1)

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KR20250006108A true KR20250006108A (ko) 2025-01-10

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KR1020247037606A Pending KR20250006108A (ko) 2022-04-21 2023-04-13 질화붕소 분말 및 그 제조 방법, 그리고 방열 시트

Country Status (5)

Country Link
US (1) US20250270435A1 (https=)
JP (1) JP7788543B2 (https=)
KR (1) KR20250006108A (https=)
CN (1) CN119053547A (https=)
WO (1) WO2023204140A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
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CN117683258B (zh) * 2023-11-21 2024-09-06 哈尔滨理工大学 一种羟基化氮化硼填料-聚酰亚胺绝缘复合薄膜的制备方法及应用

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2019116401A (ja) 2017-12-27 2019-07-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

Family Cites Families (8)

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JP3175483B2 (ja) * 1994-06-30 2001-06-11 日本鋼管株式会社 窒化ホウ素含有材料およびその製造方法
JP2006240947A (ja) * 2005-03-07 2006-09-14 Denki Kagaku Kogyo Kk 窒化硼素質焼結体の製造方法
JP6786778B2 (ja) * 2015-08-12 2020-11-18 三菱ケミカル株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP7002196B2 (ja) * 2017-01-05 2022-01-20 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
JP6745293B2 (ja) * 2017-03-28 2020-08-26 デンカ株式会社 六方晶窒化ホウ素粉末、その製造方法、及び化粧料
JP6734239B2 (ja) * 2017-08-31 2020-08-05 デンカ株式会社 六方晶窒化ホウ素粉末及び化粧料
KR102619752B1 (ko) * 2017-10-13 2023-12-29 덴카 주식회사 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
JP7069314B2 (ja) * 2018-06-29 2022-05-17 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019116401A (ja) 2017-12-27 2019-07-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

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JP7788543B2 (ja) 2025-12-18
CN119053547A (zh) 2024-11-29
JPWO2023204140A1 (https=) 2023-10-26
US20250270435A1 (en) 2025-08-28
WO2023204140A1 (ja) 2023-10-26

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