JPWO2023204140A1 - - Google Patents
Info
- Publication number
- JPWO2023204140A1 JPWO2023204140A1 JP2024516230A JP2024516230A JPWO2023204140A1 JP WO2023204140 A1 JPWO2023204140 A1 JP WO2023204140A1 JP 2024516230 A JP2024516230 A JP 2024516230A JP 2024516230 A JP2024516230 A JP 2024516230A JP WO2023204140 A1 JPWO2023204140 A1 JP WO2023204140A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0645—Preparation by carboreductive nitridation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0648—After-treatment, e.g. grinding, purification
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/40—Particle morphology extending in three dimensions prism-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022069926 | 2022-04-21 | ||
| JP2022069926 | 2022-04-21 | ||
| PCT/JP2023/015037 WO2023204140A1 (ja) | 2022-04-21 | 2023-04-13 | 窒化ホウ素粉末、及び、その製造方法、並びに、放熱シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023204140A1 true JPWO2023204140A1 (https=) | 2023-10-26 |
| JP7788543B2 JP7788543B2 (ja) | 2025-12-18 |
Family
ID=88420071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024516230A Active JP7788543B2 (ja) | 2022-04-21 | 2023-04-13 | 窒化ホウ素粉末、及び、その製造方法、並びに、放熱シート |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250270435A1 (https=) |
| JP (1) | JP7788543B2 (https=) |
| KR (1) | KR20250006108A (https=) |
| CN (1) | CN119053547A (https=) |
| WO (1) | WO2023204140A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117683258B (zh) * | 2023-11-21 | 2024-09-06 | 哈尔滨理工大学 | 一种羟基化氮化硼填料-聚酰亚胺绝缘复合薄膜的制备方法及应用 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812440A (ja) * | 1994-06-30 | 1996-01-16 | Nkk Corp | 窒化ホウ素含有材料およびその製造方法 |
| JP2006240947A (ja) * | 2005-03-07 | 2006-09-14 | Denki Kagaku Kogyo Kk | 窒化硼素質焼結体の製造方法 |
| JP2017036415A (ja) * | 2015-08-12 | 2017-02-16 | 三菱化学株式会社 | 放熱樹脂シート及び該放熱樹脂シートを含むデバイス |
| JP2018108970A (ja) * | 2017-01-05 | 2018-07-12 | デンカ株式会社 | 六方晶窒化ホウ素粉末及び化粧料 |
| JP2018165241A (ja) * | 2017-03-28 | 2018-10-25 | デンカ株式会社 | 六方晶窒化ホウ素粉末、その製造方法、及び化粧料 |
| JP2019043792A (ja) * | 2017-08-31 | 2019-03-22 | デンカ株式会社 | 六方晶窒化ホウ素粉末及び化粧料 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7069485B2 (ja) | 2017-12-27 | 2022-05-18 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材 |
-
2023
- 2023-04-13 US US18/857,807 patent/US20250270435A1/en active Pending
- 2023-04-13 CN CN202380034657.7A patent/CN119053547A/zh active Pending
- 2023-04-13 KR KR1020247037606A patent/KR20250006108A/ko active Pending
- 2023-04-13 WO PCT/JP2023/015037 patent/WO2023204140A1/ja not_active Ceased
- 2023-04-13 JP JP2024516230A patent/JP7788543B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812440A (ja) * | 1994-06-30 | 1996-01-16 | Nkk Corp | 窒化ホウ素含有材料およびその製造方法 |
| JP2006240947A (ja) * | 2005-03-07 | 2006-09-14 | Denki Kagaku Kogyo Kk | 窒化硼素質焼結体の製造方法 |
| JP2017036415A (ja) * | 2015-08-12 | 2017-02-16 | 三菱化学株式会社 | 放熱樹脂シート及び該放熱樹脂シートを含むデバイス |
| JP2018108970A (ja) * | 2017-01-05 | 2018-07-12 | デンカ株式会社 | 六方晶窒化ホウ素粉末及び化粧料 |
| JP2018165241A (ja) * | 2017-03-28 | 2018-10-25 | デンカ株式会社 | 六方晶窒化ホウ素粉末、その製造方法、及び化粧料 |
| JP2019043792A (ja) * | 2017-08-31 | 2019-03-22 | デンカ株式会社 | 六方晶窒化ホウ素粉末及び化粧料 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7788543B2 (ja) | 2025-12-18 |
| KR20250006108A (ko) | 2025-01-10 |
| CN119053547A (zh) | 2024-11-29 |
| US20250270435A1 (en) | 2025-08-28 |
| WO2023204140A1 (ja) | 2023-10-26 |
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