KR20240099151A - 경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름 - Google Patents

경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름 Download PDF

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Publication number
KR20240099151A
KR20240099151A KR1020247010995A KR20247010995A KR20240099151A KR 20240099151 A KR20240099151 A KR 20240099151A KR 1020247010995 A KR1020247010995 A KR 1020247010995A KR 20247010995 A KR20247010995 A KR 20247010995A KR 20240099151 A KR20240099151 A KR 20240099151A
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South Korea
Prior art keywords
curable resin
resin composition
formula
imide oligomer
curing agent
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Pending
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KR1020247010995A
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English (en)
Korean (ko)
Inventor
사야카 와키오카
게이고 오와시
겐타로우 호우조우
유우 나카무라
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20240099151A publication Critical patent/KR20240099151A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020247010995A 2021-11-16 2022-11-16 경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름 Pending KR20240099151A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021186451 2021-11-16
JPJP-P-2021-186451 2021-11-16
PCT/JP2022/042510 WO2023090347A1 (ja) 2021-11-16 2022-11-16 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム

Publications (1)

Publication Number Publication Date
KR20240099151A true KR20240099151A (ko) 2024-06-28

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KR1020247010995A Pending KR20240099151A (ko) 2021-11-16 2022-11-16 경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름

Country Status (4)

Country Link
JP (1) JPWO2023090347A1 (https=)
KR (1) KR20240099151A (https=)
CN (1) CN118215700A (https=)
WO (1) WO2023090347A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09302070A (ja) 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JP2003193016A (ja) 2001-12-26 2003-07-09 Hitachi Chem Co Ltd 高耐熱高放熱接着フィルム
JP2005113059A (ja) 2003-10-09 2005-04-28 Shin Etsu Chem Co Ltd 硬化性樹脂組成物および導電性接着剤
JP2019065126A (ja) 2017-09-29 2019-04-25 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JP2019108516A (ja) 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
JP2019123834A (ja) 2018-01-19 2019-07-25 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2632724B2 (ja) * 1989-01-20 1997-07-23 宇部興産株式会社 水酸基末端変性イミドオリゴマー
CN103370371A (zh) * 2011-02-01 2013-10-23 Dic株式会社 热固化型树脂组合物、其固化物及印刷电路板用层间粘接薄膜
JP6594799B2 (ja) * 2016-02-26 2019-10-23 リンテック株式会社 熱伝導性接着剤組成物、熱伝導性接着剤シートおよび積層体の製造方法
CN115197421A (zh) * 2017-01-27 2022-10-18 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
WO2018221217A1 (ja) * 2017-05-31 2018-12-06 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
CN207149306U (zh) * 2017-08-31 2018-03-27 江西中荣信合石墨烯科技股份有限公司 一种石墨烯导线
JP2019108517A (ja) * 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09302070A (ja) 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JP2003193016A (ja) 2001-12-26 2003-07-09 Hitachi Chem Co Ltd 高耐熱高放熱接着フィルム
JP2005113059A (ja) 2003-10-09 2005-04-28 Shin Etsu Chem Co Ltd 硬化性樹脂組成物および導電性接着剤
JP2019065126A (ja) 2017-09-29 2019-04-25 日立化成株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JP2019108516A (ja) 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
JP2019123834A (ja) 2018-01-19 2019-07-25 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板

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CN118215700A (zh) 2024-06-18
WO2023090347A1 (ja) 2023-05-25
JPWO2023090347A1 (https=) 2023-05-25

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Patent event date: 20240401

Patent event code: PA01051R01D

Comment text: International Patent Application

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