KR20240099151A - 경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름 - Google Patents
경화성 수지 조성물, 경화물, 접착제, 및, 접착 필름 Download PDFInfo
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- KR20240099151A KR20240099151A KR1020247010995A KR20247010995A KR20240099151A KR 20240099151 A KR20240099151 A KR 20240099151A KR 1020247010995 A KR1020247010995 A KR 1020247010995A KR 20247010995 A KR20247010995 A KR 20247010995A KR 20240099151 A KR20240099151 A KR 20240099151A
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- KR
- South Korea
- Prior art keywords
- curable resin
- resin composition
- formula
- imide oligomer
- curing agent
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 113
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 239000002313 adhesive film Substances 0.000 title claims abstract description 17
- 239000000047 product Substances 0.000 title 1
- 150000003949 imides Chemical class 0.000 claims abstract description 124
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- 125000003118 aryl group Chemical group 0.000 claims description 50
- 239000003822 epoxy resin Substances 0.000 claims description 39
- 229920000647 polyepoxide Polymers 0.000 claims description 39
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 20
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
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- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 60
- 239000002253 acid Substances 0.000 description 55
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- -1 siloxane compounds Chemical class 0.000 description 30
- 125000001931 aliphatic group Chemical group 0.000 description 28
- 239000002904 solvent Substances 0.000 description 26
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- 229920000642 polymer Polymers 0.000 description 11
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
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- 238000006243 chemical reaction Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 125000004430 oxygen atom Chemical group O* 0.000 description 6
- 230000004580 weight loss Effects 0.000 description 6
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 5
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- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 4
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- 238000011156 evaluation Methods 0.000 description 4
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- Chemical & Material Sciences (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2021186451 | 2021-11-16 | ||
| JPJP-P-2021-186451 | 2021-11-16 | ||
| PCT/JP2022/042510 WO2023090347A1 (ja) | 2021-11-16 | 2022-11-16 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
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| JP (1) | JPWO2023090347A1 (https=) |
| KR (1) | KR20240099151A (https=) |
| CN (1) | CN118215700A (https=) |
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Citations (6)
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|---|---|---|---|---|
| JPH09302070A (ja) | 1996-05-20 | 1997-11-25 | Sumitomo Metal Ind Ltd | 熱硬化性エポキシ樹脂組成物とその用途および硬化剤 |
| JP2003193016A (ja) | 2001-12-26 | 2003-07-09 | Hitachi Chem Co Ltd | 高耐熱高放熱接着フィルム |
| JP2005113059A (ja) | 2003-10-09 | 2005-04-28 | Shin Etsu Chem Co Ltd | 硬化性樹脂組成物および導電性接着剤 |
| JP2019065126A (ja) | 2017-09-29 | 2019-04-25 | 日立化成株式会社 | エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
| JP2019108516A (ja) | 2017-12-15 | 2019-07-04 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール |
| JP2019123834A (ja) | 2018-01-19 | 2019-07-25 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2632724B2 (ja) * | 1989-01-20 | 1997-07-23 | 宇部興産株式会社 | 水酸基末端変性イミドオリゴマー |
| CN103370371A (zh) * | 2011-02-01 | 2013-10-23 | Dic株式会社 | 热固化型树脂组合物、其固化物及印刷电路板用层间粘接薄膜 |
| JP6594799B2 (ja) * | 2016-02-26 | 2019-10-23 | リンテック株式会社 | 熱伝導性接着剤組成物、熱伝導性接着剤シートおよび積層体の製造方法 |
| CN115197421A (zh) * | 2017-01-27 | 2022-10-18 | 积水化学工业株式会社 | 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂 |
| WO2018221217A1 (ja) * | 2017-05-31 | 2018-12-06 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板 |
| CN207149306U (zh) * | 2017-08-31 | 2018-03-27 | 江西中荣信合石墨烯科技股份有限公司 | 一种石墨烯导线 |
| JP2019108517A (ja) * | 2017-12-15 | 2019-07-04 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール |
-
2022
- 2022-11-16 KR KR1020247010995A patent/KR20240099151A/ko active Pending
- 2022-11-16 JP JP2022575236A patent/JPWO2023090347A1/ja active Pending
- 2022-11-16 CN CN202280074832.0A patent/CN118215700A/zh active Pending
- 2022-11-16 WO PCT/JP2022/042510 patent/WO2023090347A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09302070A (ja) | 1996-05-20 | 1997-11-25 | Sumitomo Metal Ind Ltd | 熱硬化性エポキシ樹脂組成物とその用途および硬化剤 |
| JP2003193016A (ja) | 2001-12-26 | 2003-07-09 | Hitachi Chem Co Ltd | 高耐熱高放熱接着フィルム |
| JP2005113059A (ja) | 2003-10-09 | 2005-04-28 | Shin Etsu Chem Co Ltd | 硬化性樹脂組成物および導電性接着剤 |
| JP2019065126A (ja) | 2017-09-29 | 2019-04-25 | 日立化成株式会社 | エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
| JP2019108516A (ja) | 2017-12-15 | 2019-07-04 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール |
| JP2019123834A (ja) | 2018-01-19 | 2019-07-25 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118215700A (zh) | 2024-06-18 |
| WO2023090347A1 (ja) | 2023-05-25 |
| JPWO2023090347A1 (https=) | 2023-05-25 |
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