KR20240087675A - 웨어러블 디바이스 - Google Patents

웨어러블 디바이스 Download PDF

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Publication number
KR20240087675A
KR20240087675A KR1020247007960A KR20247007960A KR20240087675A KR 20240087675 A KR20240087675 A KR 20240087675A KR 1020247007960 A KR1020247007960 A KR 1020247007960A KR 20247007960 A KR20247007960 A KR 20247007960A KR 20240087675 A KR20240087675 A KR 20240087675A
Authority
KR
South Korea
Prior art keywords
heat
heat storage
heat source
housing
wearable device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247007960A
Other languages
English (en)
Korean (ko)
Inventor
겐이치 후지사키
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20240087675A publication Critical patent/KR20240087675A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00—Cases
    • G04B37/0008—Cases for pocket watches and wrist watches
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • H01L23/373—
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020247007960A 2021-10-25 2022-10-13 웨어러블 디바이스 Pending KR20240087675A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-174179 2021-10-25
JP2021174179 2021-10-25
PCT/JP2022/038149 WO2023074380A1 (ja) 2021-10-25 2022-10-13 ウェアラブルデバイス

Publications (1)

Publication Number Publication Date
KR20240087675A true KR20240087675A (ko) 2024-06-19

Family

ID=86158008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247007960A Pending KR20240087675A (ko) 2021-10-25 2022-10-13 웨어러블 디바이스

Country Status (4)

Country Link
US (1) US20240402650A1 (https=)
JP (2) JP7693823B2 (https=)
KR (1) KR20240087675A (https=)
WO (1) WO2023074380A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4738050A1 (en) * 2023-08-02 2026-05-06 Samsung Electronics Co., Ltd. Wearable device comprising insulation structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017081833A1 (ja) 2015-11-10 2017-05-18 ソニー株式会社 電子機器
JP2017152955A (ja) 2016-02-25 2017-08-31 コニカミノルタ株式会社 ヘッドマウントディスプレイ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879294A (https=) * 1972-01-25 1973-10-24
JPS55122191A (en) * 1979-03-14 1980-09-19 Hitachi Ltd Nuclear reactor containment vessel
JPS5882148A (ja) * 1981-11-11 1983-05-17 Showa Denko Kk 熱伝導率測定方法
JPS5934494A (ja) * 1982-08-20 1984-02-24 Tokico Ltd スクロ−ル式流体機械
JPH0657434B2 (ja) * 1987-05-30 1994-08-03 積水化成品工業株式会社 長尺積層板の製造方法
JPH0471276A (ja) * 1990-07-12 1992-03-05 Canon Inc 少劣化太陽電池モジュール
JPH0536892U (ja) * 1991-10-15 1993-05-18 三菱電機株式会社 電子機器の放熱構造
JPH09164710A (ja) * 1995-12-14 1997-06-24 Ricoh Co Ltd 可逆性感熱記録媒体の記録装置
JP3356648B2 (ja) * 1997-04-10 2002-12-16 松下電工株式会社 ヘアーカール器
JP2006317494A (ja) 2005-05-10 2006-11-24 Matsushita Electric Ind Co Ltd 表示装置
JP2007239904A (ja) 2006-03-09 2007-09-20 Matsushita Electric Ind Co Ltd 情報機器
JP5161381B1 (ja) 2011-06-07 2013-03-13 シャープ株式会社 表示装置及びテレビジョン受信機
JP6077928B2 (ja) * 2013-05-20 2017-02-08 富士重工業株式会社 電子機器の収容ケース
JP6442970B2 (ja) 2014-09-01 2018-12-26 セイコーエプソン株式会社 電気光学装置及び電子機器
JP6213386B2 (ja) * 2014-06-16 2017-10-18 株式会社デンソー 電子制御装置
JP6438740B2 (ja) 2014-11-06 2018-12-19 共同技研化学株式会社 蓄熱粘着シートの製造方法
CN108141520A (zh) * 2015-10-27 2018-06-08 索尼公司 电子设备
JP6528664B2 (ja) * 2015-12-08 2019-06-12 コニカミノルタ株式会社 ウェアラブルデバイス
WO2021070562A1 (ja) * 2019-10-07 2021-04-15 富士フイルム株式会社 積層体、電子デバイス
CN114730986B (zh) 2019-11-15 2025-06-03 索尼集团公司 便携式电子设备
JP2021196872A (ja) 2020-06-15 2021-12-27 ウエストユニティス株式会社 ウェアラブル端末

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017081833A1 (ja) 2015-11-10 2017-05-18 ソニー株式会社 電子機器
JP2017152955A (ja) 2016-02-25 2017-08-31 コニカミノルタ株式会社 ヘッドマウントディスプレイ

Also Published As

Publication number Publication date
JP7693823B2 (ja) 2025-06-17
JP2024069236A (ja) 2024-05-21
US20240402650A1 (en) 2024-12-05
JPWO2023074380A1 (https=) 2023-05-04
WO2023074380A1 (ja) 2023-05-04

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St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

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Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902