KR20240045361A - 폴리아미드이미드 중합체를 함유하는 점도 감소 조성물 - Google Patents

폴리아미드이미드 중합체를 함유하는 점도 감소 조성물 Download PDF

Info

Publication number
KR20240045361A
KR20240045361A KR1020247009945A KR20247009945A KR20240045361A KR 20240045361 A KR20240045361 A KR 20240045361A KR 1020247009945 A KR1020247009945 A KR 1020247009945A KR 20247009945 A KR20247009945 A KR 20247009945A KR 20240045361 A KR20240045361 A KR 20240045361A
Authority
KR
South Korea
Prior art keywords
pai
polymer
formula
aromatic
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247009945A
Other languages
English (en)
Korean (ko)
Inventor
알 윌리엄 틸포드
제러드 펠리시어
델프 소피 갈리나
사만다 아르미센
앙또니 보꼬
Original Assignee
솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. filed Critical 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨.
Publication of KR20240045361A publication Critical patent/KR20240045361A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247009945A 2021-08-26 2022-08-22 폴리아미드이미드 중합체를 함유하는 점도 감소 조성물 Pending KR20240045361A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21306153 2021-08-26
EP21306153.4 2021-08-26
PCT/EP2022/073318 WO2023025720A1 (en) 2021-08-26 2022-08-22 Reduced viscosity compositions containing polyamideimide polymers

Publications (1)

Publication Number Publication Date
KR20240045361A true KR20240045361A (ko) 2024-04-05

Family

ID=77666453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247009945A Pending KR20240045361A (ko) 2021-08-26 2022-08-22 폴리아미드이미드 중합체를 함유하는 점도 감소 조성물

Country Status (6)

Country Link
US (1) US20250145854A1 (https=)
EP (1) EP4392478A1 (https=)
JP (1) JP2024532335A (https=)
KR (1) KR20240045361A (https=)
CN (1) CN118139911A (https=)
WO (1) WO2023025720A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116247375A (zh) * 2023-03-17 2023-06-09 江苏北星新材料科技有限公司 一种芳纶复合锂电池隔膜及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120826A (en) * 1990-12-21 1992-06-09 Hoechst Celanese Corp. Polyamide-imide polymers having fluorine-containing linking groups
US5124428A (en) * 1991-05-31 1992-06-23 Amoco Corporation Amide-imide resin for production of heat-resistant fiber
SG10201709161SA (en) * 2013-05-17 2017-12-28 Fujifilm Electronic Mat Usa Inc Novel polymer and thermosetting composition containing same
US9815941B2 (en) 2014-04-17 2017-11-14 Cymer-Dayton, Llc Low toxicity solvent system for polyamdieimide and polyamide amic acid resin manufacture
US9725617B2 (en) 2014-04-17 2017-08-08 Fujifilm Hunt Chemicals U.S.A., Inc. Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating
JP5854159B2 (ja) * 2015-02-13 2016-02-09 日産化学工業株式会社 高分岐ポリマー
CN112204074B (zh) * 2018-11-05 2024-01-26 株式会社Lg化学 聚酰胺树脂、其制备方法以及包含其的聚酰胺膜和树脂层合体
CN111662452A (zh) * 2019-03-08 2020-09-15 鞍山七彩化学股份有限公司 一种聚酰胺-酰亚胺树脂连续生产装置及连续生产方法
CN110760062A (zh) * 2019-10-15 2020-02-07 李南文 一种光学膜、透明基板、图像显示装置以及太阳能电池

Also Published As

Publication number Publication date
JP2024532335A (ja) 2024-09-05
CN118139911A (zh) 2024-06-04
EP4392478A1 (en) 2024-07-03
WO2023025720A1 (en) 2023-03-02
US20250145854A1 (en) 2025-05-08

Similar Documents

Publication Publication Date Title
JP7384546B2 (ja) ポリイミド高分子組成物とその製造方法、及びそれを用いたポリイミドフィルムの製造方法
CA1068427A (en) Water soluble polyamide acid precursors of polyimides
CN106947080B (zh) 聚酰亚胺薄膜制备用组合物及其制备方法以及利用其的聚酰亚胺薄膜的制备方法
WO2010050491A1 (ja) ポリイミド前駆体溶液組成物
TWI773889B (zh) 用以提高聚醯亞胺膜的接著性的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置
JP6427904B2 (ja) ポリイミド前駆体組成物、ポリイミド成形体の製造方法、及びポリイミド成形体
JP5040336B2 (ja) アミック酸構造の繰返単位の一部がイミド構造になっている共重合体、およびその製造方法
EP4441121A1 (en) Coating compositions containing polyamideimide polymers
KR20240045361A (ko) 폴리아미드이미드 중합체를 함유하는 점도 감소 조성물
JP6152688B2 (ja) ポリアミック酸溶液組成物、及びそれを用いたポリイミド膜の製造方法
JP6427905B2 (ja) ポリイミド前駆体組成物、ポリイミド成形体の製造方法、及びポリイミド成形体
EP0304913A2 (en) Terminal-modified imide oligomer and solution composition of the same
JPH06192420A (ja) ポリイミド溶液組成物及びその製造方法
JP2025538669A (ja) 溶媒可溶性ポリイミド
JP6427903B2 (ja) ポリイミド前駆体組成物、ポリイミド成形体の製造方法、及びポリイミド成形体
JP2722008B2 (ja) ポリイミド樹脂組成物及びその製造方法
JP4918875B2 (ja) アミック酸構造の繰返単位の一部がイミド構造になっている共重合体、およびその製造方法
US20240002601A1 (en) Polyamic acid composition, and polyimide comprising same
JPH10152647A (ja) ポリイミド系コーティング材料
TWI916731B (zh) 聚醯胺酸組合物、聚醯亞胺前體、及聚醯亞胺薄膜
JP7742740B2 (ja) ポリアミド酸組成物及びその製造方法
EP3766940A1 (en) Thermoplastic composition and method of preparing the same
WO2025205213A1 (ja) ポリイミド、ポリイミド樹脂組成物及びポリイミド膜
TW202528444A (zh) 包含環保溶劑的聚醯亞胺組合物及由其製造的用於顯示器的聚醯亞胺清漆
CN118613529A (zh) 含有聚酰胺酰亚胺聚合物的涂层组合物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

R13 Change to the name of applicant or owner recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R13-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)