KR20240040805A - 수지 조성물 및 접착제 - Google Patents

수지 조성물 및 접착제 Download PDF

Info

Publication number
KR20240040805A
KR20240040805A KR1020247007021A KR20247007021A KR20240040805A KR 20240040805 A KR20240040805 A KR 20240040805A KR 1020247007021 A KR1020247007021 A KR 1020247007021A KR 20247007021 A KR20247007021 A KR 20247007021A KR 20240040805 A KR20240040805 A KR 20240040805A
Authority
KR
South Korea
Prior art keywords
resin composition
component
meth
compound
derivatives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247007021A
Other languages
English (en)
Korean (ko)
Inventor
히로타츠 이카라시
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20240040805A publication Critical patent/KR20240040805A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H01L21/52—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020247007021A 2021-08-10 2022-08-01 수지 조성물 및 접착제 Pending KR20240040805A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2021-130492 2021-08-10
JP2021130492 2021-08-10
JPJP-P-2021-132974 2021-08-17
JP2021132974 2021-08-17
PCT/JP2022/029484 WO2023017752A1 (ja) 2021-08-10 2022-08-01 樹脂組成物及び接着剤

Publications (1)

Publication Number Publication Date
KR20240040805A true KR20240040805A (ko) 2024-03-28

Family

ID=85199974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247007021A Pending KR20240040805A (ko) 2021-08-10 2022-08-01 수지 조성물 및 접착제

Country Status (3)

Country Link
JP (1) JPWO2023017752A1 (https=)
KR (1) KR20240040805A (https=)
WO (1) WO2023017752A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP2014077024A (ja) 2011-07-07 2014-05-01 Namics Corp 樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016117832A (ja) * 2014-12-22 2016-06-30 昭和電工株式会社 光硬化性組成物およびその用途
KR102197489B1 (ko) * 2016-06-22 2020-12-31 후지필름 가부시키가이샤 경화성 조성물, 경화막, 컬러 필터, 차광막, 고체 촬상 소자, 화상 표시 장치, 경화막의 제조 방법, 및 다관능 싸이올 화합물
CN112840004B (zh) * 2018-10-17 2022-11-08 纳美仕有限公司 树脂组合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP2014077024A (ja) 2011-07-07 2014-05-01 Namics Corp 樹脂組成物

Also Published As

Publication number Publication date
TW202313911A (zh) 2023-04-01
WO2023017752A1 (ja) 2023-02-16
JPWO2023017752A1 (https=) 2023-02-16

Similar Documents

Publication Publication Date Title
KR102564077B1 (ko) 광 및 열 경화성 수지 조성물
TWI753144B (zh) 硬化性組成物及構造物
JP6675380B2 (ja) 樹脂組成物、接着剤、および封止剤
JP2009051954A (ja) 光および加熱硬化性組成物とその硬化物
KR20210052343A (ko) 경화성 조성물
JP5592081B2 (ja) 液晶滴下工法用シール剤および液晶表示装置の製造方法
WO2020145111A1 (ja) チオール化合物、その合成方法および該チオール化合物の利用
JP7106426B2 (ja) チオール化合物、その合成方法および該チオール化合物の利用
US11827818B2 (en) Photocurable composition and product
KR20240026200A (ko) 수지 조성물 및 접착제
JP2019077683A (ja) チオール化合物、その合成方法および該チオール化合物の利用
CN117651730A (zh) 树脂组合物及粘接剂
JP2023166744A (ja) チオール化合物及びその用途
KR20240040805A (ko) 수지 조성물 및 접착제
JP7217565B1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
TWI920357B (zh) 樹脂組成物及接著劑
WO2023181847A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2023181845A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2023181846A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
KR20240054979A (ko) 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품
KR20240076415A (ko) 수지 조성물의 토출 방법, 전자 부품의 제조 방법, 및 전자 부품
KR20240054978A (ko) 제트 디스펜스용 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품
KR20250097806A (ko) 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품
JP2024064649A (ja) 樹脂組成物、接着剤、封止材、硬化物及び半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902