KR20240038173A - 마운트 장치 및 마운트 방법 - Google Patents
마운트 장치 및 마운트 방법 Download PDFInfo
- Publication number
- KR20240038173A KR20240038173A KR1020247008803A KR20247008803A KR20240038173A KR 20240038173 A KR20240038173 A KR 20240038173A KR 1020247008803 A KR1020247008803 A KR 1020247008803A KR 20247008803 A KR20247008803 A KR 20247008803A KR 20240038173 A KR20240038173 A KR 20240038173A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- unit
- frame
- mount
- peeling
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 claims abstract description 314
- 239000002390 adhesive tape Substances 0.000 claims abstract description 47
- 238000012546 transfer Methods 0.000 claims description 59
- 230000032258 transport Effects 0.000 description 84
- 238000012545 processing Methods 0.000 description 69
- 230000001681 protective effect Effects 0.000 description 64
- 230000008569 process Effects 0.000 description 30
- 238000000227 grinding Methods 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000010030 laminating Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 238000003672 processing method Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000005247 gettering Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2017-163600 | 2017-08-28 | ||
| JP2017163600 | 2017-08-28 | ||
| KR1020207008567A KR102649682B1 (ko) | 2017-08-28 | 2018-08-15 | 기판 처리 시스템 및 기판 처리 방법 |
| PCT/JP2018/030350 WO2019044506A1 (ja) | 2017-08-28 | 2018-08-15 | 基板処理システム、および基板処理方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207008567A Division KR102649682B1 (ko) | 2017-08-28 | 2018-08-15 | 기판 처리 시스템 및 기판 처리 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240038173A true KR20240038173A (ko) | 2024-03-22 |
Family
ID=65525535
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207008567A KR102649682B1 (ko) | 2017-08-28 | 2018-08-15 | 기판 처리 시스템 및 기판 처리 방법 |
| KR1020247008803A KR20240038173A (ko) | 2017-08-28 | 2018-08-15 | 마운트 장치 및 마운트 방법 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207008567A KR102649682B1 (ko) | 2017-08-28 | 2018-08-15 | 기판 처리 시스템 및 기판 처리 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (4) | JPWO2019044506A1 (zh) |
| KR (2) | KR102649682B1 (zh) |
| CN (2) | CN111052341A (zh) |
| TW (1) | TWI772493B (zh) |
| WO (1) | WO2019044506A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7358014B2 (ja) * | 2019-10-29 | 2023-10-10 | 株式会社ディスコ | 加工装置 |
| WO2023176611A1 (ja) * | 2022-03-14 | 2023-09-21 | 株式会社荏原製作所 | 基板研磨装置、基板研磨方法、研磨装置および研磨方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343756A (ja) | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11163082A (ja) * | 1997-11-28 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板搬送方法 |
| JP3560823B2 (ja) * | 1998-08-18 | 2004-09-02 | リンテック株式会社 | ウェハ転写装置 |
| JP4748901B2 (ja) * | 2001-09-06 | 2011-08-17 | 日東電工株式会社 | 半導体ウエハのマウント方法およびこれに用いるカセット |
| JP4435542B2 (ja) * | 2002-11-18 | 2010-03-17 | 東京エレクトロン株式会社 | 絶縁膜形成装置 |
| JP2004193189A (ja) * | 2002-12-09 | 2004-07-08 | Matsushita Electric Ind Co Ltd | 半導体装置の生産管理システム |
| JP2004363165A (ja) * | 2003-06-02 | 2004-12-24 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置およびウェーハ処理方法 |
| JP4371890B2 (ja) * | 2004-04-14 | 2009-11-25 | リンテック株式会社 | 貼付装置及び貼付方法 |
| JP2006278630A (ja) * | 2005-03-29 | 2006-10-12 | Lintec Corp | ウエハ転写装置 |
| JP2007214457A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ウェーハ加工装置及び方法 |
| JP4841262B2 (ja) * | 2006-02-13 | 2011-12-21 | 株式会社東京精密 | ウェーハ処理装置 |
| JP2007235068A (ja) | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
| JP4693696B2 (ja) * | 2006-06-05 | 2011-06-01 | 株式会社東京精密 | ワーク処理装置 |
| JP4859814B2 (ja) | 2007-11-06 | 2012-01-25 | 株式会社東京精密 | ウェーハ処理装置 |
| JP6100484B2 (ja) * | 2012-08-09 | 2017-03-22 | リンテック株式会社 | 搬送装置および搬送方法 |
| JP6235279B2 (ja) * | 2013-09-18 | 2017-11-22 | 株式会社ディスコ | ウエーハの加工方法 |
| JP2015119085A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社ディスコ | デバイスウェーハの加工方法 |
| JP6283573B2 (ja) * | 2014-06-03 | 2018-02-21 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP2016001677A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | ウエーハの加工方法 |
| JP6636696B2 (ja) * | 2014-12-25 | 2020-01-29 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
| JP6625857B2 (ja) * | 2015-10-14 | 2019-12-25 | 株式会社ディスコ | ウェーハ加工方法 |
-
2018
- 2018-08-15 CN CN201880054597.4A patent/CN111052341A/zh active Pending
- 2018-08-15 KR KR1020207008567A patent/KR102649682B1/ko active Application Filing
- 2018-08-15 JP JP2019539343A patent/JPWO2019044506A1/ja not_active Ceased
- 2018-08-15 KR KR1020247008803A patent/KR20240038173A/ko active Application Filing
- 2018-08-15 WO PCT/JP2018/030350 patent/WO2019044506A1/ja active Application Filing
- 2018-08-15 CN CN202310366231.3A patent/CN116435236A/zh active Pending
- 2018-08-21 TW TW107129049A patent/TWI772493B/zh active
-
2021
- 2021-07-07 JP JP2021113047A patent/JP7133686B2/ja active Active
-
2022
- 2022-08-29 JP JP2022135737A patent/JP7434463B2/ja active Active
-
2024
- 2024-02-07 JP JP2024017062A patent/JP2024036600A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343756A (ja) | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111052341A (zh) | 2020-04-21 |
| KR20200039008A (ko) | 2020-04-14 |
| JP7133686B2 (ja) | 2022-09-08 |
| JP2022169731A (ja) | 2022-11-09 |
| JPWO2019044506A1 (ja) | 2020-09-10 |
| JP2024036600A (ja) | 2024-03-15 |
| KR102649682B1 (ko) | 2024-03-21 |
| JP7434463B2 (ja) | 2024-02-20 |
| CN116435236A (zh) | 2023-07-14 |
| WO2019044506A1 (ja) | 2019-03-07 |
| TW201921463A (zh) | 2019-06-01 |
| TWI772493B (zh) | 2022-08-01 |
| JP2021170659A (ja) | 2021-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent |