JPWO2019044506A1 - 基板処理システム、および基板処理方法 - Google Patents

基板処理システム、および基板処理方法 Download PDF

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Publication number
JPWO2019044506A1
JPWO2019044506A1 JP2019539343A JP2019539343A JPWO2019044506A1 JP WO2019044506 A1 JPWO2019044506 A1 JP WO2019044506A1 JP 2019539343 A JP2019539343 A JP 2019539343A JP 2019539343 A JP2019539343 A JP 2019539343A JP WO2019044506 A1 JPWO2019044506 A1 JP WO2019044506A1
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Japan
Prior art keywords
substrate
unit
frame
carry
main transport
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Ceased
Application number
JP2019539343A
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English (en)
Japanese (ja)
Inventor
田村　武
武 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2019044506A1 publication Critical patent/JPWO2019044506A1/ja
Priority to JP2021113047A priority Critical patent/JP7133686B2/ja
Priority to JP2022135737A priority patent/JP7434463B2/ja
Priority to JP2024017062A priority patent/JP2024036600A/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2019539343A 2017-08-28 2018-08-15 基板処理システム、および基板処理方法 Ceased JPWO2019044506A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021113047A JP7133686B2 (ja) 2017-08-28 2021-07-07 基板処理システム、および基板処理方法
JP2022135737A JP7434463B2 (ja) 2017-08-28 2022-08-29 基板搬送システム、および基板搬送方法
JP2024017062A JP2024036600A (ja) 2017-08-28 2024-02-07 マウント装置およびマウント方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017163600 2017-08-28
JP2017163600 2017-08-28
PCT/JP2018/030350 WO2019044506A1 (ja) 2017-08-28 2018-08-15 基板処理システム、および基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021113047A Division JP7133686B2 (ja) 2017-08-28 2021-07-07 基板処理システム、および基板処理方法

Publications (1)

Publication Number Publication Date
JPWO2019044506A1 true JPWO2019044506A1 (ja) 2020-09-10

Family

ID=65525535

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2019539343A Ceased JPWO2019044506A1 (ja) 2017-08-28 2018-08-15 基板処理システム、および基板処理方法
JP2021113047A Active JP7133686B2 (ja) 2017-08-28 2021-07-07 基板処理システム、および基板処理方法
JP2022135737A Active JP7434463B2 (ja) 2017-08-28 2022-08-29 基板搬送システム、および基板搬送方法
JP2024017062A Pending JP2024036600A (ja) 2017-08-28 2024-02-07 マウント装置およびマウント方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2021113047A Active JP7133686B2 (ja) 2017-08-28 2021-07-07 基板処理システム、および基板処理方法
JP2022135737A Active JP7434463B2 (ja) 2017-08-28 2022-08-29 基板搬送システム、および基板搬送方法
JP2024017062A Pending JP2024036600A (ja) 2017-08-28 2024-02-07 マウント装置およびマウント方法

Country Status (5)

Country Link
JP (4) JPWO2019044506A1 (zh)
KR (2) KR102649682B1 (zh)
CN (2) CN111052341A (zh)
TW (1) TWI772493B (zh)
WO (1) WO2019044506A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7358014B2 (ja) * 2019-10-29 2023-10-10 株式会社ディスコ 加工装置
WO2023176611A1 (ja) * 2022-03-14 2023-09-21 株式会社荏原製作所 基板研磨装置、基板研磨方法、研磨装置および研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186682A (ja) * 2002-11-18 2004-07-02 Tokyo Electron Ltd 絶縁膜形成装置
JP2005297457A (ja) * 2004-04-14 2005-10-27 Lintec Corp 貼付装置及び貼付方法
JP2007214457A (ja) * 2006-02-10 2007-08-23 Tokyo Seimitsu Co Ltd ウェーハ加工装置及び方法
JP2007324516A (ja) * 2006-06-05 2007-12-13 Tokyo Seimitsu Co Ltd ワーク処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163082A (ja) * 1997-11-28 1999-06-18 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板搬送方法
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
JP2002343756A (ja) 2001-05-21 2002-11-29 Tokyo Seimitsu Co Ltd ウェーハ平面加工装置
JP4748901B2 (ja) * 2001-09-06 2011-08-17 日東電工株式会社 半導体ウエハのマウント方法およびこれに用いるカセット
JP2004193189A (ja) * 2002-12-09 2004-07-08 Matsushita Electric Ind Co Ltd 半導体装置の生産管理システム
JP2004363165A (ja) * 2003-06-02 2004-12-24 Tokyo Seimitsu Co Ltd ウェーハ処理装置およびウェーハ処理方法
JP2006278630A (ja) * 2005-03-29 2006-10-12 Lintec Corp ウエハ転写装置
JP4841262B2 (ja) * 2006-02-13 2011-12-21 株式会社東京精密 ウェーハ処理装置
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP4859814B2 (ja) 2007-11-06 2012-01-25 株式会社東京精密 ウェーハ処理装置
JP6100484B2 (ja) * 2012-08-09 2017-03-22 リンテック株式会社 搬送装置および搬送方法
JP6235279B2 (ja) * 2013-09-18 2017-11-22 株式会社ディスコ ウエーハの加工方法
JP2015119085A (ja) * 2013-12-19 2015-06-25 株式会社ディスコ デバイスウェーハの加工方法
JP6283573B2 (ja) * 2014-06-03 2018-02-21 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2016001677A (ja) * 2014-06-12 2016-01-07 株式会社ディスコ ウエーハの加工方法
JP6636696B2 (ja) * 2014-12-25 2020-01-29 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP6625857B2 (ja) * 2015-10-14 2019-12-25 株式会社ディスコ ウェーハ加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186682A (ja) * 2002-11-18 2004-07-02 Tokyo Electron Ltd 絶縁膜形成装置
JP2005297457A (ja) * 2004-04-14 2005-10-27 Lintec Corp 貼付装置及び貼付方法
JP2007214457A (ja) * 2006-02-10 2007-08-23 Tokyo Seimitsu Co Ltd ウェーハ加工装置及び方法
JP2007324516A (ja) * 2006-06-05 2007-12-13 Tokyo Seimitsu Co Ltd ワーク処理装置

Also Published As

Publication number Publication date
KR20240038173A (ko) 2024-03-22
CN111052341A (zh) 2020-04-21
KR20200039008A (ko) 2020-04-14
JP7133686B2 (ja) 2022-09-08
JP2022169731A (ja) 2022-11-09
JP2024036600A (ja) 2024-03-15
KR102649682B1 (ko) 2024-03-21
JP7434463B2 (ja) 2024-02-20
CN116435236A (zh) 2023-07-14
WO2019044506A1 (ja) 2019-03-07
TW201921463A (zh) 2019-06-01
TWI772493B (zh) 2022-08-01
JP2021170659A (ja) 2021-10-28

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