KR20240036108A - 광 반도체 소자 밀봉용 시트 - Google Patents

광 반도체 소자 밀봉용 시트 Download PDF

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Publication number
KR20240036108A
KR20240036108A KR1020247006990A KR20247006990A KR20240036108A KR 20240036108 A KR20240036108 A KR 20240036108A KR 1020247006990 A KR1020247006990 A KR 1020247006990A KR 20247006990 A KR20247006990 A KR 20247006990A KR 20240036108 A KR20240036108 A KR 20240036108A
Authority
KR
South Korea
Prior art keywords
layer
sheet
optical semiconductor
weight
sealing
Prior art date
Application number
KR1020247006990A
Other languages
English (en)
Korean (ko)
Inventor
슈헤이 후쿠토미
슘페이 다나카
다이키 우에노
료코 아사이
다케시 나카노
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20240036108A publication Critical patent/KR20240036108A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laminated Bodies (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Led Device Packages (AREA)
KR1020247006990A 2021-08-06 2022-08-02 광 반도체 소자 밀봉용 시트 KR20240036108A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021130247 2021-08-06
JPJP-P-2021-130247 2021-08-06
JP2022117105A JP7208435B1 (ja) 2021-08-06 2022-07-22 光半導体素子封止用シート
JPJP-P-2022-117105 2022-07-22
PCT/JP2022/029699 WO2023013653A1 (ja) 2021-08-06 2022-08-02 光半導体素子封止用シート

Publications (1)

Publication Number Publication Date
KR20240036108A true KR20240036108A (ko) 2024-03-19

Family

ID=84939291

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247006990A KR20240036108A (ko) 2021-08-06 2022-08-02 광 반도체 소자 밀봉용 시트

Country Status (5)

Country Link
JP (1) JP7208435B1 (ja)
KR (1) KR20240036108A (ja)
CN (1) CN116249620B (ja)
TW (1) TW202315168A (ja)
WO (1) WO2023013653A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7369760B2 (ja) * 2021-12-24 2023-10-26 日東電工株式会社 光半導体素子封止用シート
JP7369761B2 (ja) * 2021-12-24 2023-10-26 日東電工株式会社 光半導体素子封止用シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204905A (ja) 2018-05-24 2019-11-28 大日本印刷株式会社 自発光型表示体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140362A (ja) * 2004-11-15 2006-06-01 Nitto Denko Corp 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法
JP2008235705A (ja) * 2007-03-22 2008-10-02 Toyoda Gosei Co Ltd Ｌｅｄ発光表示装置
JP2010002825A (ja) * 2008-06-23 2010-01-07 Dainippon Printing Co Ltd 近赤外線吸収能を有する反射防止材
JP5388167B2 (ja) * 2008-09-08 2014-01-15 日東電工株式会社 光半導体素子封止用シート及びそれを用いてなる光半導体装置
JP2013077811A (ja) * 2011-09-14 2013-04-25 Nitto Denko Corp 封止シート、その製造方法、発光ダイオード装置およびその製造方法
JP5652410B2 (ja) * 2012-02-03 2015-01-14 信越化学工業株式会社 蛍光体含有層と白色顔料含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置
WO2015141242A1 (ja) * 2014-03-19 2015-09-24 富士フイルム株式会社 機能性積層フィルム、機能性積層フィルムの製造方法、および機能性積層フィルムを含む有機電界発光装置
JP2018041860A (ja) * 2016-09-08 2018-03-15 日東電工株式会社 波長変換シート、シート被覆素子および光半導体装置
WO2018062328A1 (ja) * 2016-09-28 2018-04-05 三菱瓦斯化学株式会社 光学用ポリエステルフィルム及び透明導電性フィルム
US10811396B2 (en) * 2019-01-20 2020-10-20 Lextar Electronics Corporation Display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204905A (ja) 2018-05-24 2019-11-28 大日本印刷株式会社 自発光型表示体

Also Published As

Publication number Publication date
JP2023024317A (ja) 2023-02-16
CN116249620A (zh) 2023-06-09
CN116249620B (zh) 2024-03-08
WO2023013653A1 (ja) 2023-02-09
JP7208435B1 (ja) 2023-01-18
TW202315168A (zh) 2023-04-01

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