KR20240032995A - 칩 온 필름 구조, 디스플레이 장치 및 접합형 디스플레이 장치 - Google Patents

칩 온 필름 구조, 디스플레이 장치 및 접합형 디스플레이 장치 Download PDF

Info

Publication number
KR20240032995A
KR20240032995A KR1020247004584A KR20247004584A KR20240032995A KR 20240032995 A KR20240032995 A KR 20240032995A KR 1020247004584 A KR1020247004584 A KR 1020247004584A KR 20247004584 A KR20247004584 A KR 20247004584A KR 20240032995 A KR20240032995 A KR 20240032995A
Authority
KR
South Korea
Prior art keywords
display panel
chip
circuit
film structure
bonding end
Prior art date
Application number
KR1020247004584A
Other languages
English (en)
Korean (ko)
Inventor
용 판
첸케 슈
Original Assignee
샤먼 익스트럼리 피큐 디스플레이 테크놀로지 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 샤먼 익스트럼리 피큐 디스플레이 테크놀로지 컴퍼니 리미티드 filed Critical 샤먼 익스트럼리 피큐 디스플레이 테크놀로지 컴퍼니 리미티드
Publication of KR20240032995A publication Critical patent/KR20240032995A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020247004584A 2021-12-07 2021-12-17 칩 온 필름 구조, 디스플레이 장치 및 접합형 디스플레이 장치 KR20240032995A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202111484204.3A CN116246543A (zh) 2021-12-07 2021-12-07 覆晶薄膜结构、显示装置及拼接显示装置
CN202111484204.3 2021-12-07
PCT/CN2021/139166 WO2023103039A1 (zh) 2021-12-07 2021-12-17 覆晶薄膜结构、显示装置及拼接显示装置

Publications (1)

Publication Number Publication Date
KR20240032995A true KR20240032995A (ko) 2024-03-12

Family

ID=86628168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247004584A KR20240032995A (ko) 2021-12-07 2021-12-17 칩 온 필름 구조, 디스플레이 장치 및 접합형 디스플레이 장치

Country Status (3)

Country Link
KR (1) KR20240032995A (zh)
CN (1) CN116246543A (zh)
WO (1) WO2023103039A1 (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3242786B2 (ja) * 1994-03-18 2001-12-25 富士通株式会社 液晶表示装置及びその製造方法
WO2012147672A1 (ja) * 2011-04-28 2012-11-01 シャープ株式会社 表示モジュール及び表示装置
CN210112367U (zh) * 2019-01-31 2020-02-21 昆山国显光电有限公司 一种覆晶薄膜基板、电路板及显示设备
CN110989230B (zh) * 2019-12-27 2022-04-05 深圳市华星光电半导体显示技术有限公司 显示装置及电子设备
CN111951697B (zh) * 2020-08-10 2022-02-01 Tcl华星光电技术有限公司 拼接显示屏
CN113260142B (zh) * 2021-05-18 2022-07-22 武汉天马微电子有限公司 一种覆晶薄膜、显示模组及显示装置

Also Published As

Publication number Publication date
WO2023103039A1 (zh) 2023-06-15
CN116246543A (zh) 2023-06-09

Similar Documents

Publication Publication Date Title
US8836204B2 (en) Organic EL illumination device
KR101619832B1 (ko) 발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법
US8884426B2 (en) Semiconductor device including cooler
US8981552B2 (en) Power converter, semiconductor device, and method for manufacturing power converter
KR20120068380A (ko) 표시 장치 및 유기 발광 표시 장치
JP2002368277A (ja) チップ型半導体発光装置
JP2003086737A (ja) 半導体装置
US5698898A (en) Semiconductor apparatus with a multiple element electrode structure
JP5693194B2 (ja) 発光ダイオード
JP3129020B2 (ja) 半導体装置
JP5532021B2 (ja) 発光装置
JP2003017658A (ja) 電力用半導体装置
KR20100095791A (ko) 발광소자 패키지 및 그 제조방법
JPH10335580A (ja) 半導体パッケージおよびこれを用いた半導体モジュール
WO2013065462A1 (ja) 半導体装置及びその製造方法
JP2015076511A (ja) 半導体装置およびその製造方法
JP4945416B2 (ja) 発光モジュール及びその製造方法
KR20110060868A (ko) 방열 기판과 그 제조 방법, 방열 기판을 구비한 발광다이오드 패키지 모듈과 그 제조 방법
JP2006190728A (ja) 電力用半導体装置
KR20240032995A (ko) 칩 온 필름 구조, 디스플레이 장치 및 접합형 디스플레이 장치
CN109801900B (zh) 一种电力用逆变电路装置
TWI714679B (zh) 用於最佳化熱阻、焊點可靠性，及表面貼裝技術處理良率之發光二極體金屬墊配置
CN205428990U (zh) 发光器件
KR101409622B1 (ko) 반도체 패키지
US20140312484A1 (en) Electronic assembly for mounting on electronic board