KR20240009937A - 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 - Google Patents

조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Download PDF

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Publication number
KR20240009937A
KR20240009937A KR1020237038695A KR20237038695A KR20240009937A KR 20240009937 A KR20240009937 A KR 20240009937A KR 1020237038695 A KR1020237038695 A KR 1020237038695A KR 20237038695 A KR20237038695 A KR 20237038695A KR 20240009937 A KR20240009937 A KR 20240009937A
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KR
South Korea
Prior art keywords
roughened
copper foil
particles
carrier
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237038695A
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English (en)
Korean (ko)
Inventor
히야마 사오리 고이데
마코토 호소카와
나카가와 미호 구리하라
치사토 다사카
아야코 요츠이
다시로 미사토 미조구치
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20240009937A publication Critical patent/KR20240009937A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020237038695A 2021-05-20 2022-05-18 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Pending KR20240009937A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2021-085490 2021-05-20
JPJP-P-2021-085489 2021-05-20
JP2021085490 2021-05-20
JP2021085489 2021-05-20
JPJP-P-2022-041749 2022-03-16
JP2022041749 2022-03-16
PCT/JP2022/020749 WO2022244828A1 (ja) 2021-05-20 2022-05-18 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
KR20240009937A true KR20240009937A (ko) 2024-01-23

Family

ID=84141675

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237038695A Pending KR20240009937A (ko) 2021-05-20 2022-05-18 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Country Status (4)

Country Link
JP (1) JPWO2022244828A1 (https=)
KR (1) KR20240009937A (https=)
TW (1) TWI808765B (https=)
WO (1) WO2022244828A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025115840A1 (ja) * 2023-11-30 2025-06-05 大日本印刷株式会社 表面処理銅箔、キャリア付き銅箔、銅張積層板、およびプリント配線基板
TWI884768B (zh) * 2024-04-16 2025-05-21 南亞塑膠工業股份有限公司 銅箔複合結構及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
JP2018026590A (ja) 2015-08-06 2018-02-15 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2020031721A1 (ja) 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014152352A (ja) * 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
JP6373166B2 (ja) * 2014-10-30 2018-08-15 Ｊｘ金属株式会社 表面処理銅箔及び積層板
MY186266A (en) * 2015-03-31 2021-07-01 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
JP6182584B2 (ja) * 2015-12-09 2017-08-16 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
KR102297790B1 (ko) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
JP2018026590A (ja) 2015-08-06 2018-02-15 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2020031721A1 (ja) 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

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Publication number Publication date
TWI808765B (zh) 2023-07-11
JPWO2022244828A1 (https=) 2022-11-24
TW202302916A (zh) 2023-01-16
WO2022244828A1 (ja) 2022-11-24

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