JPWO2022244828A1 - - Google Patents
Info
- Publication number
- JPWO2022244828A1 JPWO2022244828A1 JP2023522712A JP2023522712A JPWO2022244828A1 JP WO2022244828 A1 JPWO2022244828 A1 JP WO2022244828A1 JP 2023522712 A JP2023522712 A JP 2023522712A JP 2023522712 A JP2023522712 A JP 2023522712A JP WO2022244828 A1 JPWO2022244828 A1 JP WO2022244828A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021085490 | 2021-05-20 | ||
| JP2021085489 | 2021-05-20 | ||
| JP2022041749 | 2022-03-16 | ||
| PCT/JP2022/020749 WO2022244828A1 (ja) | 2021-05-20 | 2022-05-18 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022244828A1 true JPWO2022244828A1 (https=) | 2022-11-24 |
Family
ID=84141675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522712A Pending JPWO2022244828A1 (https=) | 2021-05-20 | 2022-05-18 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022244828A1 (https=) |
| KR (1) | KR20240009937A (https=) |
| TW (1) | TWI808765B (https=) |
| WO (1) | WO2022244828A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025115840A1 (ja) * | 2023-11-30 | 2025-06-05 | 大日本印刷株式会社 | 表面処理銅箔、キャリア付き銅箔、銅張積層板、およびプリント配線基板 |
| TWI884768B (zh) * | 2024-04-16 | 2025-05-21 | 南亞塑膠工業股份有限公司 | 銅箔複合結構及其製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014152352A (ja) * | 2013-02-06 | 2014-08-25 | Sh Copper Products Corp | 複合銅箔および複合銅箔の製造方法 |
| JP6373166B2 (ja) * | 2014-10-30 | 2018-08-15 | Ｊｘ金属株式会社 | 表面処理銅箔及び積層板 |
| CN110072334B (zh) | 2015-01-22 | 2022-04-01 | 三井金属矿业株式会社 | 带载体的极薄铜箔及其制造方法 |
| MY186266A (en) * | 2015-03-31 | 2021-07-01 | Mitsui Mining & Smelting Co Ltd | Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board |
| JP6200042B2 (ja) | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6182584B2 (ja) * | 2015-12-09 | 2017-08-16 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 |
| KR102297790B1 (ko) * | 2017-05-19 | 2021-09-06 | 미쓰이금속광업주식회사 | 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판 |
| WO2020031721A1 (ja) | 2018-08-10 | 2020-02-13 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
-
2022
- 2022-05-18 KR KR1020237038695A patent/KR20240009937A/ko active Pending
- 2022-05-18 WO PCT/JP2022/020749 patent/WO2022244828A1/ja not_active Ceased
- 2022-05-18 JP JP2023522712A patent/JPWO2022244828A1/ja active Pending
- 2022-05-20 TW TW111118930A patent/TWI808765B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI808765B (zh) | 2023-07-11 |
| KR20240009937A (ko) | 2024-01-23 |
| TW202302916A (zh) | 2023-01-16 |
| WO2022244828A1 (ja) | 2022-11-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250328 |