JPWO2023281778A1 - - Google Patents

Info

Publication number
JPWO2023281778A1
JPWO2023281778A1 JP2023533047A JP2023533047A JPWO2023281778A1 JP WO2023281778 A1 JPWO2023281778 A1 JP WO2023281778A1 JP 2023533047 A JP2023533047 A JP 2023533047A JP 2023533047 A JP2023533047 A JP 2023533047A JP WO2023281778 A1 JPWO2023281778 A1 JP WO2023281778A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533047A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023281778A1 publication Critical patent/JPWO2023281778A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP2023533047A 2021-07-09 2022-01-14 Pending JPWO2023281778A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021114585 2021-07-09
PCT/JP2022/001221 WO2023281778A1 (ja) 2021-07-09 2022-01-14 表面処理銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2023281778A1 true JPWO2023281778A1 (https=) 2023-01-12

Family

ID=84800489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533047A Pending JPWO2023281778A1 (https=) 2021-07-09 2022-01-14

Country Status (4)

Country Link
JP (1) JPWO2023281778A1 (https=)
KR (1) KR102926047B1 (https=)
CN (1) CN116710601A (https=)
WO (1) WO2023281778A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061736A1 (ja) * 2008-11-25 2010-06-03 日鉱金属株式会社 印刷回路用銅箔
WO2011138876A1 (ja) * 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP2014152352A (ja) * 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
WO2017006739A1 (ja) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP2017036495A (ja) * 2015-08-06 2017-02-16 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2020128589A (ja) * 2019-02-01 2020-08-27 長春石油化學股▲分▼有限公司 表面処理銅箔
WO2020196265A1 (ja) * 2019-03-26 2020-10-01 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
WO2021117339A1 (ja) * 2019-12-13 2021-06-17 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012112009A (ja) 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061736A1 (ja) * 2008-11-25 2010-06-03 日鉱金属株式会社 印刷回路用銅箔
WO2011138876A1 (ja) * 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP2014152352A (ja) * 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
WO2017006739A1 (ja) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP2017036495A (ja) * 2015-08-06 2017-02-16 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2020128589A (ja) * 2019-02-01 2020-08-27 長春石油化學股▲分▼有限公司 表面処理銅箔
WO2020196265A1 (ja) * 2019-03-26 2020-10-01 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
WO2021117339A1 (ja) * 2019-12-13 2021-06-17 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
CN116710601A (zh) 2023-09-05
WO2023281778A1 (ja) 2023-01-12
KR102926047B1 (ko) 2026-02-12
KR20230121117A (ko) 2023-08-17
TW202302917A (zh) 2023-01-16

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