KR102926047B1 - 표면 처리 구리박, 동장 적층판 및 프린트 배선판 - Google Patents

표면 처리 구리박, 동장 적층판 및 프린트 배선판

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Publication number
KR102926047B1
KR102926047B1 KR1020237023854A KR20237023854A KR102926047B1 KR 102926047 B1 KR102926047 B1 KR 102926047B1 KR 1020237023854 A KR1020237023854 A KR 1020237023854A KR 20237023854 A KR20237023854 A KR 20237023854A KR 102926047 B1 KR102926047 B1 KR 102926047B1
Authority
KR
South Korea
Prior art keywords
copper foil
treatment layer
treated
layer
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237023854A
Other languages
English (en)
Korean (ko)
Other versions
KR20230121117A (ko
Inventor
유키 마츠오카
쇼헤이 이와사와
이쿠히로 고토
세이야 나카시마
아츠시 미키
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20230121117A publication Critical patent/KR20230121117A/ko
Application granted granted Critical
Publication of KR102926047B1 publication Critical patent/KR102926047B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1020237023854A 2021-07-09 2022-01-14 표면 처리 구리박, 동장 적층판 및 프린트 배선판 Active KR102926047B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021114585 2021-07-09
JPJP-P-2021-114585 2021-07-09
PCT/JP2022/001221 WO2023281778A1 (ja) 2021-07-09 2022-01-14 表面処理銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20230121117A KR20230121117A (ko) 2023-08-17
KR102926047B1 true KR102926047B1 (ko) 2026-02-12

Family

ID=84800489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023854A Active KR102926047B1 (ko) 2021-07-09 2022-01-14 표면 처리 구리박, 동장 적층판 및 프린트 배선판

Country Status (4)

Country Link
JP (1) JPWO2023281778A1 (https=)
KR (1) KR102926047B1 (https=)
CN (1) CN116710601A (https=)
WO (1) WO2023281778A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014152352A (ja) 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
JP2017036495A (ja) 2015-08-06 2017-02-16 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2021117339A1 (ja) 2019-12-13 2021-06-17 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY150825A (en) * 2008-11-25 2014-02-28 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
WO2011138876A1 (ja) * 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP2012112009A (ja) 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法
KR101895745B1 (ko) * 2015-07-03 2018-09-05 미쓰이금속광업주식회사 조면화 처리 동박, 동장 적층판 및 프린트 배선판
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6816193B2 (ja) * 2019-03-26 2021-01-20 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014152352A (ja) 2013-02-06 2014-08-25 Sh Copper Products Corp 複合銅箔および複合銅箔の製造方法
JP2017036495A (ja) 2015-08-06 2017-02-16 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2021117339A1 (ja) 2019-12-13 2021-06-17 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
CN116710601A (zh) 2023-09-05
JPWO2023281778A1 (https=) 2023-01-12
WO2023281778A1 (ja) 2023-01-12
KR20230121117A (ko) 2023-08-17
TW202302917A (zh) 2023-01-16

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