KR20230112715A - 히터 제어 장치 및 전력 제어 방법 - Google Patents

히터 제어 장치 및 전력 제어 방법 Download PDF

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Publication number
KR20230112715A
KR20230112715A KR1020237022355A KR20237022355A KR20230112715A KR 20230112715 A KR20230112715 A KR 20230112715A KR 1020237022355 A KR1020237022355 A KR 1020237022355A KR 20237022355 A KR20237022355 A KR 20237022355A KR 20230112715 A KR20230112715 A KR 20230112715A
Authority
KR
South Korea
Prior art keywords
heating element
temperature
power
control method
time
Prior art date
Application number
KR1020237022355A
Other languages
English (en)
Korean (ko)
Inventor
시게노부 사키타
고이치 기무라
가츠히로 이타쿠라
Original Assignee
스미토모덴키고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모덴키고교가부시키가이샤 filed Critical 스미토모덴키고교가부시키가이샤
Publication of KR20230112715A publication Critical patent/KR20230112715A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0202—Switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0004—Devices wherein the heating current flows through the material to be heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0019—Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Resistance Heating (AREA)
KR1020237022355A 2021-12-15 2022-09-13 히터 제어 장치 및 전력 제어 방법 KR20230112715A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2021/046389 WO2023112233A1 (ja) 2021-12-15 2021-12-15 ヒータ制御装置、及び電力制御方法
JPPCT/JP2021/046389 2021-12-15
PCT/JP2022/034242 WO2023112410A1 (ja) 2021-12-15 2022-09-13 ヒータ制御装置、及び電力制御方法

Publications (1)

Publication Number Publication Date
KR20230112715A true KR20230112715A (ko) 2023-07-27

Family

ID=86773882

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237022355A KR20230112715A (ko) 2021-12-15 2022-09-13 히터 제어 장치 및 전력 제어 방법

Country Status (3)

Country Link
JP (1) JP7398062B2 (ja)
KR (1) KR20230112715A (ja)
WO (2) WO2023112233A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009074148A (ja) 2007-09-21 2009-04-09 Tokyo Electron Ltd 成膜装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07324756A (ja) * 1994-05-31 1995-12-12 Toshiba Corp 加熱器
JP2000268939A (ja) * 1999-03-17 2000-09-29 Canon Inc ヒータ装置、及びこれを備えた熱定着装置
JP2003123941A (ja) * 2001-10-11 2003-04-25 Canon Inc ヒータ制御方法および画像形成装置
JP4298228B2 (ja) 2002-06-10 2009-07-15 キヤノン株式会社 加熱装置
JP4225047B2 (ja) * 2002-12-13 2009-02-18 オムロン株式会社 電力制御装置および電力制御方法
JP5374109B2 (ja) * 2008-10-17 2013-12-25 株式会社アルバック 加熱真空処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009074148A (ja) 2007-09-21 2009-04-09 Tokyo Electron Ltd 成膜装置

Also Published As

Publication number Publication date
WO2023112410A1 (ja) 2023-06-22
WO2023112233A1 (ja) 2023-06-22
JPWO2023112410A1 (ja) 2023-06-22
JP7398062B2 (ja) 2023-12-14

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