KR20230096337A - 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 - Google Patents
로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 Download PDFInfo
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- KR20230096337A KR20230096337A KR1020210185725A KR20210185725A KR20230096337A KR 20230096337 A KR20230096337 A KR 20230096337A KR 1020210185725 A KR1020210185725 A KR 1020210185725A KR 20210185725 A KR20210185725 A KR 20210185725A KR 20230096337 A KR20230096337 A KR 20230096337A
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- Prior art keywords
- blowing
- wafer container
- load port
- port module
- unit
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title abstract description 11
- 238000007664 blowing Methods 0.000 claims abstract description 101
- 238000005192 partition Methods 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 22
- 239000007924 injection Substances 0.000 claims description 22
- 238000005507 spraying Methods 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 132
- 239000007789 gas Substances 0.000 description 60
- 238000010586 diagram Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 14
- 238000000926 separation method Methods 0.000 description 12
- 230000000903 blocking effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000000356 contaminant Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210185725A KR20230096337A (ko) | 2021-12-23 | 2021-12-23 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
| JP2022071137A JP7411004B2 (ja) | 2021-12-23 | 2022-04-22 | ロードポートモジュールのウエハ容器の湿度低減装置及びそれを備えた半導体工程装置 |
| TW112135703A TW202403943A (zh) | 2021-12-23 | 2022-04-25 | 裝載埠模組的晶片容器降濕裝置、其半導體製程裝置及半導體製程方法 |
| TW111115657A TWI822011B (zh) | 2021-12-23 | 2022-04-25 | 裝載埠模組的晶片容器降濕裝置及其半導體製程裝置 |
| KR1020230160076A KR20230163967A (ko) | 2021-12-23 | 2023-11-20 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210185725A KR20230096337A (ko) | 2021-12-23 | 2021-12-23 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020230160076A Division KR20230163967A (ko) | 2021-12-23 | 2023-11-20 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230096337A true KR20230096337A (ko) | 2023-06-30 |
Family
ID=86959745
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210185725A KR20230096337A (ko) | 2021-12-23 | 2021-12-23 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
| KR1020230160076A KR20230163967A (ko) | 2021-12-23 | 2023-11-20 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020230160076A KR20230163967A (ko) | 2021-12-23 | 2023-11-20 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7411004B2 (zh) |
| KR (2) | KR20230096337A (zh) |
| TW (2) | TW202403943A (zh) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011536A (ko) | 2001-08-01 | 2003-02-11 | 가부시끼가이샤 한도따이 센단 테크놀로지스 | 로드포트, 기판 처리 장치 및 분위기 치환 방법 |
| KR20170003211U (ko) | 2016-03-07 | 2017-09-15 | 내셔널 타이페이 유니버시티 오브 테크놀러지 | 균일하게 차단되는 에어 커튼이 구비된 유동-장 장치 |
| KR101924185B1 (ko) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | 클램프가 장착된 로드포트모듈 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4012190B2 (ja) * | 2004-10-26 | 2007-11-21 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム及び開閉方法 |
| JP4301456B2 (ja) * | 2005-11-30 | 2009-07-22 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム |
| JP4264115B2 (ja) * | 2007-07-31 | 2009-05-13 | Ｔｄｋ株式会社 | 被収容物の処理方法及び当該方法に用いられる蓋開閉システム |
| JP6206126B2 (ja) * | 2012-12-04 | 2017-10-04 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
| JP6268425B2 (ja) * | 2013-07-16 | 2018-01-31 | シンフォニアテクノロジー株式会社 | Ｅｆｅｍ、ロードポート、ウェーハ搬送方法 |
| JP6342753B2 (ja) * | 2014-09-02 | 2018-06-13 | 株式会社日立産機システム | ファンフィルタユニット |
| KR102618491B1 (ko) * | 2016-10-31 | 2023-12-28 | 삼성전자주식회사 | 기판 이송 장치 |
| KR102143208B1 (ko) * | 2018-09-13 | 2020-08-12 | 주식회사 케이씨티 | 에어 커튼 유닛을 구비하는 lpm 및 lpp 시스템 |
| TWI723329B (zh) * | 2019-01-19 | 2021-04-01 | 春田科技顧問股份有限公司 | 裝載埠及其氣簾裝置與吹淨方法 |
| TWI706525B (zh) * | 2019-08-22 | 2020-10-01 | 南韓商責市特馬股份有限公司 | 裝載埠模組的前開式晶圓傳送盒的降低濕度裝置及具備其的半導體製程裝置 |
| KR102289650B1 (ko) * | 2019-08-22 | 2021-08-17 | 주식회사 저스템 | 로드포트모듈의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
| KR102226506B1 (ko) * | 2019-09-09 | 2021-03-11 | 주식회사 저스템 | 반송실 내의 웨이퍼 용기의 습도저감장치 및 이를 구비한 반도체 공정장치 |
-
2021
- 2021-12-23 KR KR1020210185725A patent/KR20230096337A/ko not_active Application Discontinuation
-
2022
- 2022-04-22 JP JP2022071137A patent/JP7411004B2/ja active Active
- 2022-04-25 TW TW112135703A patent/TW202403943A/zh unknown
- 2022-04-25 TW TW111115657A patent/TWI822011B/zh active
-
2023
- 2023-11-20 KR KR1020230160076A patent/KR20230163967A/ko not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011536A (ko) | 2001-08-01 | 2003-02-11 | 가부시끼가이샤 한도따이 센단 테크놀로지스 | 로드포트, 기판 처리 장치 및 분위기 치환 방법 |
| KR20170003211U (ko) | 2016-03-07 | 2017-09-15 | 내셔널 타이페이 유니버시티 오브 테크놀러지 | 균일하게 차단되는 에어 커튼이 구비된 유동-장 장치 |
| KR101924185B1 (ko) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | 클램프가 장착된 로드포트모듈 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023094507A (ja) | 2023-07-05 |
| JP7411004B2 (ja) | 2024-01-10 |
| KR20230163967A (ko) | 2023-12-01 |
| TW202326916A (zh) | 2023-07-01 |
| TW202403943A (zh) | 2024-01-16 |
| TWI822011B (zh) | 2023-11-11 |
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