KR20230088255A - 계측 장치, 리소그래피 장치, 및 물품 제조 방법 - Google Patents

계측 장치, 리소그래피 장치, 및 물품 제조 방법 Download PDF

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Publication number
KR20230088255A
KR20230088255A KR1020220166272A KR20220166272A KR20230088255A KR 20230088255 A KR20230088255 A KR 20230088255A KR 1020220166272 A KR1020220166272 A KR 1020220166272A KR 20220166272 A KR20220166272 A KR 20220166272A KR 20230088255 A KR20230088255 A KR 20230088255A
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KR
South Korea
Prior art keywords
image
measurement
substrate
alignment
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220166272A
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English (en)
Korean (ko)
Inventor
사토루 짐보
가즈히코 미시마
Original Assignee
캐논 가부시끼가이샤
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Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20230088255A publication Critical patent/KR20230088255A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30204—Marker

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Signal Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020220166272A 2021-12-10 2022-12-02 계측 장치, 리소그래피 장치, 및 물품 제조 방법 Pending KR20230088255A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-201173 2021-12-10
JP2021201173A JP7786821B2 (ja) 2021-12-10 2021-12-10 計測装置、リソグラフィ装置、および物品製造方法

Publications (1)

Publication Number Publication Date
KR20230088255A true KR20230088255A (ko) 2023-06-19

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Family Applications (1)

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KR1020220166272A Pending KR20230088255A (ko) 2021-12-10 2022-12-02 계측 장치, 리소그래피 장치, 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US12339595B2 (enExample)
JP (1) JP7786821B2 (enExample)
KR (1) KR20230088255A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201908127D0 (en) * 2019-06-07 2019-07-24 Renishaw Plc Manufacturing method and apparatus
WO2025013286A1 (ja) * 2023-07-13 2025-01-16 株式会社ニコン 照明ユニット、露光装置、及び露光方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI267012B (en) 2004-06-03 2006-11-21 Univ Nat Cheng Kung Quality prognostics system and method for manufacturing processes
JP2009176958A (ja) 2008-01-24 2009-08-06 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
JP2015015318A (ja) * 2013-07-03 2015-01-22 キヤノン株式会社 処理方法、処理装置、リソグラフィ装置、及び物品の製造方法
US10152654B2 (en) 2014-02-20 2018-12-11 Kla-Tencor Corporation Signal response metrology for image based overlay measurements
JP6608130B2 (ja) * 2014-11-06 2019-11-20 キヤノン株式会社 計測装置、リソグラフィ装置、及び物品の製造方法
US10474045B2 (en) 2015-07-13 2019-11-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP7041489B2 (ja) 2017-10-19 2022-03-24 キヤノン株式会社 評価方法、決定方法、リソグラフィ装置、およびプログラム
JP6808684B2 (ja) * 2018-06-14 2021-01-06 キヤノン株式会社 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法
JP2020004918A (ja) 2018-06-29 2020-01-09 キヤノン株式会社 情報処理装置、プログラム、加工装置、加工システム、および物品の製造方法
WO2021083704A1 (en) * 2019-11-01 2021-05-06 Asml Netherlands B.V. Metrology method and lithographic apparatuses
JP7364540B2 (ja) * 2020-08-05 2023-10-18 株式会社日立ハイテク 画像処理システム
US12148181B2 (en) * 2020-08-28 2024-11-19 Canon Kabushiki Kaisha Measurement apparatus that measures position information of measurement target in predetermined direction
TWI862875B (zh) * 2020-10-22 2024-11-21 日商佳能股份有限公司 處理裝置和方法、測量裝置和方法、微影裝置、製造物品的方法、模型、產生方法和裝置
CN116648675A (zh) * 2020-11-17 2023-08-25 Asml荷兰有限公司 量测系统和光刻系统
JP7649188B2 (ja) * 2021-04-21 2025-03-19 キヤノン株式会社 処理システム、計測装置、基板処理装置及び物品の製造方法

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JP2023086568A (ja) 2023-06-22
US12339595B2 (en) 2025-06-24
JP7786821B2 (ja) 2025-12-16
US20230185208A1 (en) 2023-06-15

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