JP7786821B2 - 計測装置、リソグラフィ装置、および物品製造方法 - Google Patents

計測装置、リソグラフィ装置、および物品製造方法

Info

Publication number
JP7786821B2
JP7786821B2 JP2021201173A JP2021201173A JP7786821B2 JP 7786821 B2 JP7786821 B2 JP 7786821B2 JP 2021201173 A JP2021201173 A JP 2021201173A JP 2021201173 A JP2021201173 A JP 2021201173A JP 7786821 B2 JP7786821 B2 JP 7786821B2
Authority
JP
Japan
Prior art keywords
measurement
image
substrate
alignment
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021201173A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023086568A5 (enExample
JP2023086568A (ja
Inventor
悟 神保
和彦 三島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021201173A priority Critical patent/JP7786821B2/ja
Priority to KR1020220166272A priority patent/KR20230088255A/ko
Priority to US18/062,080 priority patent/US12339595B2/en
Publication of JP2023086568A publication Critical patent/JP2023086568A/ja
Publication of JP2023086568A5 publication Critical patent/JP2023086568A5/ja
Application granted granted Critical
Publication of JP7786821B2 publication Critical patent/JP7786821B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30204—Marker

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Signal Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2021201173A 2021-12-10 2021-12-10 計測装置、リソグラフィ装置、および物品製造方法 Active JP7786821B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021201173A JP7786821B2 (ja) 2021-12-10 2021-12-10 計測装置、リソグラフィ装置、および物品製造方法
KR1020220166272A KR20230088255A (ko) 2021-12-10 2022-12-02 계측 장치, 리소그래피 장치, 및 물품 제조 방법
US18/062,080 US12339595B2 (en) 2021-12-10 2022-12-06 Measurement apparatus, lithography apparatus, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021201173A JP7786821B2 (ja) 2021-12-10 2021-12-10 計測装置、リソグラフィ装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2023086568A JP2023086568A (ja) 2023-06-22
JP2023086568A5 JP2023086568A5 (enExample) 2024-12-13
JP7786821B2 true JP7786821B2 (ja) 2025-12-16

Family

ID=86695458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021201173A Active JP7786821B2 (ja) 2021-12-10 2021-12-10 計測装置、リソグラフィ装置、および物品製造方法

Country Status (3)

Country Link
US (1) US12339595B2 (enExample)
JP (1) JP7786821B2 (enExample)
KR (1) KR20230088255A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201908127D0 (en) * 2019-06-07 2019-07-24 Renishaw Plc Manufacturing method and apparatus
WO2025013286A1 (ja) * 2023-07-13 2025-01-16 株式会社ニコン 照明ユニット、露光装置、及び露光方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176958A (ja) 2008-01-24 2009-08-06 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
US20150235108A1 (en) 2014-02-20 2015-08-20 Kla-Tencor Corporation Signal Response Metrology For Image Based Overlay Measurements
JP2018522283A (ja) 2015-07-13 2018-08-09 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
JP2019074724A (ja) 2017-10-19 2019-05-16 キヤノン株式会社 評価方法、決定方法、リソグラフィ装置、およびプログラム
JP2020004918A (ja) 2018-06-29 2020-01-09 キヤノン株式会社 情報処理装置、プログラム、加工装置、加工システム、および物品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI267012B (en) 2004-06-03 2006-11-21 Univ Nat Cheng Kung Quality prognostics system and method for manufacturing processes
JP2015015318A (ja) * 2013-07-03 2015-01-22 キヤノン株式会社 処理方法、処理装置、リソグラフィ装置、及び物品の製造方法
JP6608130B2 (ja) * 2014-11-06 2019-11-20 キヤノン株式会社 計測装置、リソグラフィ装置、及び物品の製造方法
JP6808684B2 (ja) * 2018-06-14 2021-01-06 キヤノン株式会社 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法
WO2021083704A1 (en) * 2019-11-01 2021-05-06 Asml Netherlands B.V. Metrology method and lithographic apparatuses
JP7364540B2 (ja) * 2020-08-05 2023-10-18 株式会社日立ハイテク 画像処理システム
US12148181B2 (en) * 2020-08-28 2024-11-19 Canon Kabushiki Kaisha Measurement apparatus that measures position information of measurement target in predetermined direction
TWI862875B (zh) * 2020-10-22 2024-11-21 日商佳能股份有限公司 處理裝置和方法、測量裝置和方法、微影裝置、製造物品的方法、模型、產生方法和裝置
CN116648675A (zh) * 2020-11-17 2023-08-25 Asml荷兰有限公司 量测系统和光刻系统
JP7649188B2 (ja) * 2021-04-21 2025-03-19 キヤノン株式会社 処理システム、計測装置、基板処理装置及び物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176958A (ja) 2008-01-24 2009-08-06 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
US20150235108A1 (en) 2014-02-20 2015-08-20 Kla-Tencor Corporation Signal Response Metrology For Image Based Overlay Measurements
JP2018522283A (ja) 2015-07-13 2018-08-09 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
JP2019074724A (ja) 2017-10-19 2019-05-16 キヤノン株式会社 評価方法、決定方法、リソグラフィ装置、およびプログラム
JP2020004918A (ja) 2018-06-29 2020-01-09 キヤノン株式会社 情報処理装置、プログラム、加工装置、加工システム、および物品の製造方法

Also Published As

Publication number Publication date
KR20230088255A (ko) 2023-06-19
JP2023086568A (ja) 2023-06-22
US12339595B2 (en) 2025-06-24
US20230185208A1 (en) 2023-06-15

Similar Documents

Publication Publication Date Title
JP5412528B2 (ja) 検査方法、検査システム、基板、およびマスク
JP6140662B2 (ja) 応力ならびにオーバーレイのフィードフォーワード、及び／または、フィードバック・リソグラフィック・プロセス制御
JP4486651B2 (ja) 光波散乱測定データに基づいてプロセスパラメータ値を決定する方法
CN102171618B (zh) 使用二维目标的光刻聚焦和剂量测量
CN102498441B (zh) 量测方法和设备、光刻系统以及光刻处理单元
KR100609116B1 (ko) 프로세스 단계를 특성화하는 방법 및 디바이스 제조방법
TW201643387A (zh) 用於檢測及度量衡的方法與設備
JP6069509B2 (ja) 定量的レチクル歪み測定システム
CN107615450A (zh) 压印装置、压印方法和制造产品的方法
JP7786821B2 (ja) 計測装置、リソグラフィ装置、および物品製造方法
JP2011061025A (ja) デバイス製造方法
KR102217214B1 (ko) 성능 파라미터의 핑거프린트를 결정하는 장치 및 방법
CN110088683A (zh) 用于监测来自量测装置的照射的特性的方法
CN102472979A (zh) 用于光刻的检验方法
CN116648675A (zh) 量测系统和光刻系统
TWI646404B (zh) 用於調整微影裝置之致動的方法
TWI862875B (zh) 處理裝置和方法、測量裝置和方法、微影裝置、製造物品的方法、模型、產生方法和裝置
JP2018194738A (ja) 位置計測装置、リソグラフィ装置、および物品製造方法
JP6316432B2 (ja) 検査方法及び装置並びにリソグラフィ装置
CN115210650B (zh) 用于推断局部均匀性度量的方法
US10481507B2 (en) Measurement method comprising in-situ printing of apparatus mark and corresponding apparatus
CN109690412B (zh) 确定结构的特性的方法、检查设备以及器件制造方法
JP2022149848A (ja) 計測装置、リソグラフィ装置、および物品製造方法
JP2022068832A (ja) 処理装置、計測装置、リソグラフィ装置、物品製造方法、モデル、処理方法、計測方法、生成方法、およびコンピュータ
KR20190124787A (ko) 기판 내의 응력을 결정하는 방법들, 리소그래피 공정을 제어하는 제어 시스템, 리소그래피 장치 및 컴퓨터 프로그램 제품

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20250821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251020

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251201