KR20230084492A - 수지 조성물, 수지 부착 금속박, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지 - Google Patents

수지 조성물, 수지 부착 금속박, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지 Download PDF

Info

Publication number
KR20230084492A
KR20230084492A KR1020237011469A KR20237011469A KR20230084492A KR 20230084492 A KR20230084492 A KR 20230084492A KR 1020237011469 A KR1020237011469 A KR 1020237011469A KR 20237011469 A KR20237011469 A KR 20237011469A KR 20230084492 A KR20230084492 A KR 20230084492A
Authority
KR
South Korea
Prior art keywords
group
resin composition
resin
component
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237011469A
Other languages
English (en)
Korean (ko)
Inventor
시오리 다바타
준키 소메카와
요시키 히다카
도시키 후지이
다카히로 다키
도모카즈 시마다
유키오 나카무라
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20230084492A publication Critical patent/KR20230084492A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020237011469A 2020-10-07 2021-10-01 수지 조성물, 수지 부착 금속박, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지 Pending KR20230084492A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020169715 2020-10-07
JPJP-P-2020-169715 2020-10-07
PCT/JP2021/036452 WO2022075221A1 (ja) 2020-10-07 2021-10-01 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
KR20230084492A true KR20230084492A (ko) 2023-06-13

Family

ID=81126854

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237011469A Pending KR20230084492A (ko) 2020-10-07 2021-10-01 수지 조성물, 수지 부착 금속박, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지

Country Status (5)

Country Link
JP (1) JPWO2022075221A1 (https=)
KR (1) KR20230084492A (https=)
CN (1) CN116323195A (https=)
TW (1) TWI905282B (https=)
WO (1) WO2022075221A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025127855A1 (ko) * 2023-12-13 2025-06-19 주식회사 두산 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6443735B2 (ja) * 2014-11-11 2018-12-26 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP7082454B2 (ja) * 2015-10-16 2022-06-08 三菱瓦斯化学株式会社 プリプレグ、積層体及びプリント配線基板
WO2019172342A1 (ja) * 2018-03-06 2019-09-12 日立化成株式会社 プリプレグ、積層板、多層プリント配線板、半導体パッケージ及び樹脂組成物、並びに、プリプレグ、積層板及び多層プリント配線板の製造方法
KR102324559B1 (ko) * 2020-02-28 2021-11-10 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
CN111471144B (zh) * 2020-03-27 2022-05-31 顺德职业技术学院 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025127855A1 (ko) * 2023-12-13 2025-06-19 주식회사 두산 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판

Also Published As

Publication number Publication date
JPWO2022075221A1 (https=) 2022-04-14
TW202227554A (zh) 2022-07-16
WO2022075221A1 (ja) 2022-04-14
TWI905282B (zh) 2025-11-21
CN116323195A (zh) 2023-06-23

Similar Documents

Publication Publication Date Title
TWI775544B (zh) 印刷配線板用的樹脂組成物、帶樹脂層支撐體、預浸體、積層板、多層印刷配線板及其應用、毫米波雷達用印刷配線板
KR102905881B1 (ko) 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 다층 프린트 배선판 및 반도체 패키지
JP7272068B2 (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20230108275A (ko) 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
JP2020169274A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2021187889A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169276A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2021138849A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、半導体パッケージ及び樹脂組成物の製造方法
CN113661213B (zh) 树脂组合物、预浸料、层叠板、多层印刷布线板及半导体封装体
TW202229442A (zh) 馬來醯亞胺樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體
KR20250110826A (ko) 수지 조성물, 수지 필름, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
JP7552218B2 (ja) 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
TW201829543A (zh) 樹脂組成物、帶樹脂層支撐體、預浸體、積層板、多層印刷配線板及其應用、毫米波雷達用印刷配線板
KR20230084492A (ko) 수지 조성물, 수지 부착 금속박, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지
JP2023013224A (ja) アンテナモジュール用積層板の製造方法、アンテナ装置の製造方法、アンテナモジュールの製造方法及び通信装置の製造方法
KR20230108278A (ko) 말레이미드 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지
JP2020169275A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169277A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR102954230B1 (ko) 수지 조성물, 프리프레그, 적층판, 다층 프린트 배선판 및 반도체 패키지
CN120936671A (zh) 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板和半导体封装体
JP2021187888A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、半導体パッケージ、樹脂組成物の製造方法及びプリント配線板用プレポリマー
JP2026016525A (ja) 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20240154549A (ko) 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
JP2025094409A (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902