KR20230056036A - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR20230056036A
KR20230056036A KR1020237009861A KR20237009861A KR20230056036A KR 20230056036 A KR20230056036 A KR 20230056036A KR 1020237009861 A KR1020237009861 A KR 1020237009861A KR 20237009861 A KR20237009861 A KR 20237009861A KR 20230056036 A KR20230056036 A KR 20230056036A
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KR
South Korea
Prior art keywords
substrate
wafer
distance
height
periphery
Prior art date
Application number
KR1020237009861A
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English (en)
Korean (ko)
Inventor
다카히로 야마구치
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20230056036A publication Critical patent/KR20230056036A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020237009861A 2020-09-04 2021-08-23 기판 처리 장치 및 기판 처리 방법 KR20230056036A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020149320 2020-09-04
JPJP-P-2020-149320 2020-09-04
PCT/JP2021/030857 WO2022050117A1 (ja) 2020-09-04 2021-08-23 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
KR20230056036A true KR20230056036A (ko) 2023-04-26

Family

ID=80490891

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237009861A KR20230056036A (ko) 2020-09-04 2021-08-23 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP7405268B2 (zh)
KR (1) KR20230056036A (zh)
CN (1) CN116018214A (zh)
TW (1) TW202215500A (zh)
WO (1) WO2022050117A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018121045A (ja) 2017-01-26 2018-08-02 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249433A (ja) 2002-02-25 2003-09-05 Seiko Epson Corp 露光装置及び露光制御方法
JP4363593B2 (ja) 2003-05-14 2009-11-11 東京エレクトロン株式会社 薄膜除去装置
JP4312145B2 (ja) 2004-11-15 2009-08-12 大日本スクリーン製造株式会社 基板位置補正装置および基板位置補正方法
JP5398785B2 (ja) 2011-06-20 2014-01-29 株式会社東芝 スパイラル塗布装置及びスパイラル塗布方法
JP2013102053A (ja) 2011-11-08 2013-05-23 Tokyo Electron Ltd 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体
JP6516825B2 (ja) 2014-06-04 2019-05-22 東京エレクトロン株式会社 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体
CN108028177B (zh) 2015-09-15 2022-10-21 东京毅力科创株式会社 基板处理装置、基板处理方法以及存储介质
JP6815799B2 (ja) 2016-09-13 2021-01-20 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7043777B2 (ja) 2017-10-04 2022-03-30 東京エレクトロン株式会社 塗布膜形成装置
JP6659181B2 (ja) 2018-06-11 2020-03-04 キヤノン株式会社 搬送装置、リソグラフィ装置、および物品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018121045A (ja) 2017-01-26 2018-08-02 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体

Also Published As

Publication number Publication date
CN116018214A (zh) 2023-04-25
JPWO2022050117A1 (zh) 2022-03-10
JP7405268B2 (ja) 2023-12-26
TW202215500A (zh) 2022-04-16
WO2022050117A1 (ja) 2022-03-10

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