KR20230033612A - 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법 - Google Patents

전사 필름, 도체 패턴을 갖는 적층체의 제조 방법 Download PDF

Info

Publication number
KR20230033612A
KR20230033612A KR1020220108045A KR20220108045A KR20230033612A KR 20230033612 A KR20230033612 A KR 20230033612A KR 1020220108045 A KR1020220108045 A KR 1020220108045A KR 20220108045 A KR20220108045 A KR 20220108045A KR 20230033612 A KR20230033612 A KR 20230033612A
Authority
KR
South Korea
Prior art keywords
preferable
photosensitive composition
composition layer
mass
group
Prior art date
Application number
KR1020220108045A
Other languages
English (en)
Korean (ko)
Inventor
히사시 오니츠카
Original Assignee
후지필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 가부시키가이샤 filed Critical 후지필름 가부시키가이샤
Publication of KR20230033612A publication Critical patent/KR20230033612A/ko

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/246—Vapour deposition

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
KR1020220108045A 2021-08-31 2022-08-29 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법 KR20230033612A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021140953A JP2023034627A (ja) 2021-08-31 2021-08-31 転写フィルム、導体パターンを有する積層体の製造方法
JPJP-P-2021-140953 2021-08-31

Publications (1)

Publication Number Publication Date
KR20230033612A true KR20230033612A (ko) 2023-03-08

Family

ID=85292920

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220108045A KR20230033612A (ko) 2021-08-31 2022-08-29 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법

Country Status (4)

Country Link
JP (1) JP2023034627A (zh)
KR (1) KR20230033612A (zh)
CN (1) CN115729036A (zh)
TW (1) TW202311049A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060891A (ja) 2008-09-04 2010-03-18 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060891A (ja) 2008-09-04 2010-03-18 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Also Published As

Publication number Publication date
CN115729036A (zh) 2023-03-03
JP2023034627A (ja) 2023-03-13
TW202311049A (zh) 2023-03-16

Similar Documents

Publication Publication Date Title
WO2022181485A1 (ja) 積層体の製造方法、回路配線の製造方法
KR20230033612A (ko) 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법
WO2022181611A1 (ja) 導体パターンを有する積層体の製造方法
KR20230032974A (ko) 도체 패턴을 갖는 적층체의 제조 방법, 전사 필름
KR20230032894A (ko) 도체 패턴을 갖는 적층체의 제조 방법 및 전사 필름
WO2023100553A1 (ja) 転写フィルム、導体パターンを有する積層体及び導体パターンを有する積層体の製造方法、転写フィルムの製造方法
WO2022138493A1 (ja) 積層体の製造方法、回路配線の製造方法、転写フィルム
WO2022181455A1 (ja) 転写フィルム及び導体パターンの製造方法
WO2023145156A1 (ja) 転写フィルム及び導体パターン形成方法
WO2022181456A1 (ja) 転写フィルム及び導体パターンの製造方法
WO2022138154A1 (ja) 積層体の製造方法、回路配線の製造方法、転写フィルム
WO2022181539A1 (ja) 導体パターンを有する積層体の製造方法
WO2022138468A1 (ja) 転写材料及び積層体の製造方法
KR20230019012A (ko) 전사 필름 및 도체 패턴을 갖는 적층체의 제조 방법
WO2021220980A1 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法
KR20230019050A (ko) 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법, 감광성 조성물
JP2023035807A (ja) 導体パターンを有する積層体の製造方法及び転写フィルム
KR20230019041A (ko) 감광성 조성물, 감광성 조성물층, 전사 필름, 도체 패턴을 갖는 적층체의 제조 방법
JP2023043527A (ja) 感光性組成物、転写フィルム及び導体パターンを有する積層体の製造方法
KR20240090361A (ko) 전사 필름, 도체 패턴을 갖는 적층체 및 도체 패턴을 갖는 적층체의 제조 방법, 전사 필름의 제조 방법
JP2022156251A (ja) 転写フィルム、積層体の製造方法、導体パターンを有する積層体の製造方法
JP2023020993A (ja) 透明導電パターンを含む積層体の製造方法、および、タッチパネルの製造方法
CN118235091A (zh) 转印膜、具有导体图案的层叠体及具有导体图案的层叠体的制造方法、转印膜的制造方法
JP2023020692A (ja) Ｌｅｄアレイ用感光性転写材料、ｌｅｄアレイ用遮光材、ｌｅｄアレイ、及び、電子機器
WO2022070539A1 (ja) 情報付与方法、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法