KR20230027146A - 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 - Google Patents

폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 Download PDF

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Publication number
KR20230027146A
KR20230027146A KR1020237000492A KR20237000492A KR20230027146A KR 20230027146 A KR20230027146 A KR 20230027146A KR 1020237000492 A KR1020237000492 A KR 1020237000492A KR 20237000492 A KR20237000492 A KR 20237000492A KR 20230027146 A KR20230027146 A KR 20230027146A
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KR
South Korea
Prior art keywords
polyamic acid
polyimide
polyimide film
film
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237000492A
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English (en)
Korean (ko)
Inventor
히로후미 나카야마
Original Assignee
가부시키가이샤 가네카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 가네카 filed Critical 가부시키가이샤 가네카
Publication of KR20230027146A publication Critical patent/KR20230027146A/ko
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020237000492A 2020-06-23 2021-05-31 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 Pending KR20230027146A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-107900 2020-06-23
JP2020107900 2020-06-23
PCT/JP2021/020630 WO2021261177A1 (ja) 2020-06-23 2021-05-31 ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体、積層体の製造方法及び電子デバイス

Publications (1)

Publication Number Publication Date
KR20230027146A true KR20230027146A (ko) 2023-02-27

Family

ID=79282522

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237000492A Pending KR20230027146A (ko) 2020-06-23 2021-05-31 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스

Country Status (5)

Country Link
JP (1) JP7756085B2 (https=)
KR (1) KR20230027146A (https=)
CN (1) CN115803365B (https=)
TW (1) TWI896686B (https=)
WO (1) WO2021261177A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115803365B (zh) * 2020-06-23 2024-07-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法及电子器件
KR20240150429A (ko) * 2022-02-16 2024-10-15 가부시키가이샤 가네카 폴리아미드산, 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스
JP7823734B2 (ja) * 2022-03-28 2026-03-04 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
JP7235157B1 (ja) 2022-07-29 2023-03-08 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
CN120059184A (zh) 2022-07-29 2025-05-30 Ｕｂｅ株式会社 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器
WO2026071035A1 (ja) * 2024-09-30 2026-04-02 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルム、ポリイミドフィルム／基材積層体、フレキシブル電子デバイス、及び、フレキシブル電子デバイス基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP2014070139A (ja) 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2016029177A (ja) 2015-10-05 2016-03-03 宇部興産株式会社 ポリイミド前駆体及びポリイミド

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1801097A1 (en) * 2005-12-23 2007-06-27 Rolic AG Photocrosslinkable materials
JP2014173071A (ja) * 2013-03-13 2014-09-22 Sumitomo Bakelite Co Ltd ポリイミドフィルム
JP2014210896A (ja) * 2013-04-22 2014-11-13 住友ベークライト株式会社 ポリイミド樹脂およびポリイミドフィルム
JP6627510B2 (ja) * 2013-11-27 2020-01-08 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
WO2015080158A1 (ja) * 2013-11-27 2015-06-04 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP2015108092A (ja) * 2013-12-05 2015-06-11 学校法人東京工芸大学 ポリイミドの製造方法及びその製造方法により得られるポリイミド
WO2015122032A1 (ja) * 2014-02-14 2015-08-20 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
WO2016010003A1 (ja) * 2014-07-17 2016-01-21 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
CN107428934B (zh) * 2015-03-31 2020-10-02 旭化成株式会社 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体
JP6491742B2 (ja) * 2015-04-17 2019-03-27 旭化成株式会社 樹脂組成物、ポリイミド樹脂膜、及びその製造方法
US12269949B2 (en) * 2019-02-01 2025-04-08 Wingo Technology Co., Ltd. Polyimide compound and molded article comprising the polyimide compound
JP2021109908A (ja) * 2020-01-09 2021-08-02 旭化成株式会社 樹脂組成物、ポリイミド、及びポリイミドフィルムの製造方法
WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
CN115803365B (zh) * 2020-06-23 2024-07-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法及电子器件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP2014070139A (ja) 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法
JP2016029177A (ja) 2015-10-05 2016-03-03 宇部興産株式会社 ポリイミド前駆体及びポリイミド

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TWI896686B (zh) 2025-09-11
CN115803365B (zh) 2024-07-30
JP7756085B2 (ja) 2025-10-17
CN115803365A (zh) 2023-03-14
TW202210556A (zh) 2022-03-16
WO2021261177A1 (ja) 2021-12-30
JPWO2021261177A1 (https=) 2021-12-30

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