KR20230015919A - 2액 부가경화형 실리콘고무 조성물 - Google Patents
2액 부가경화형 실리콘고무 조성물 Download PDFInfo
- Publication number
- KR20230015919A KR20230015919A KR1020227041074A KR20227041074A KR20230015919A KR 20230015919 A KR20230015919 A KR 20230015919A KR 1020227041074 A KR1020227041074 A KR 1020227041074A KR 20227041074 A KR20227041074 A KR 20227041074A KR 20230015919 A KR20230015919 A KR 20230015919A
- Authority
- KR
- South Korea
- Prior art keywords
- component
- composition
- group
- silicone rubber
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020091225A JP7627549B2 (ja) | 2020-05-26 | 2020-05-26 | 二液付加硬化型シリコーンゴム組成物 |
| JPJP-P-2020-091225 | 2020-05-26 | ||
| PCT/JP2021/015140 WO2021241036A1 (ja) | 2020-05-26 | 2021-04-12 | 二液付加硬化型シリコーンゴム組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230015919A true KR20230015919A (ko) | 2023-01-31 |
Family
ID=78744360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227041074A Pending KR20230015919A (ko) | 2020-05-26 | 2021-04-12 | 2액 부가경화형 실리콘고무 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230203253A1 (https=) |
| EP (1) | EP4159814A4 (https=) |
| JP (1) | JP7627549B2 (https=) |
| KR (1) | KR20230015919A (https=) |
| CN (1) | CN115667408A (https=) |
| TW (1) | TWI884253B (https=) |
| WO (1) | WO2021241036A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7630892B2 (ja) * | 2021-12-21 | 2025-02-18 | 信越化学工業株式会社 | 付加硬化型液状シリコーンゴム組成物及び電子写真式画像形成部材 |
| JPWO2024024503A1 (https=) * | 2022-07-26 | 2024-02-01 | ||
| JP7669429B2 (ja) * | 2023-07-31 | 2025-04-28 | 旭化成ワッカーシリコーン株式会社 | 2液型付加硬化性組成物キット及び該組成物キットの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014122271A (ja) | 2012-12-21 | 2014-07-03 | Shin Etsu Chem Co Ltd | 付加硬化型自己接着性シリコーンゴム組成物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655895B2 (ja) * | 1989-03-16 | 1994-07-27 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物 |
| JP2006056986A (ja) * | 2004-08-19 | 2006-03-02 | Shin Etsu Chem Co Ltd | 二液硬化型シリコーン組成物 |
| JP4463117B2 (ja) * | 2005-01-06 | 2010-05-12 | 信越化学工業株式会社 | 難燃性・熱伝導性シリコーン成形体およびその製造方法 |
| KR101497157B1 (ko) * | 2008-09-11 | 2015-02-27 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 경화성 실리콘 수지 조성물, 그의 경화물 및 상기 조성물로 이루어지는 차광성 실리콘 접착 시트 |
| JP2012207192A (ja) * | 2011-03-30 | 2012-10-25 | Dow Corning Toray Co Ltd | 2液型シリコーンゴム組成物 |
| CN102676113B (zh) * | 2012-04-28 | 2013-11-06 | 烟台德邦先进硅材料有限公司 | 一种led封装硅胶及其制备方法 |
| CN103881393A (zh) | 2014-03-20 | 2014-06-25 | 东莞优邦材料科技有限公司 | 双组分加成型有机聚硅氧烷组合物及其制备方法及应用 |
| CN105368068B (zh) * | 2015-11-27 | 2019-05-17 | 浙江新安化工集团股份有限公司 | 一种用于套管的耐高温高击穿电压无填料的有机硅橡胶 |
| JP2019031601A (ja) * | 2017-08-07 | 2019-02-28 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物及びシリコーンゴム硬化物 |
-
2020
- 2020-05-26 JP JP2020091225A patent/JP7627549B2/ja active Active
-
2021
- 2021-04-12 KR KR1020227041074A patent/KR20230015919A/ko active Pending
- 2021-04-12 EP EP21814060.6A patent/EP4159814A4/en active Pending
- 2021-04-12 US US17/927,435 patent/US20230203253A1/en active Pending
- 2021-04-12 WO PCT/JP2021/015140 patent/WO2021241036A1/ja not_active Ceased
- 2021-04-12 CN CN202180037857.9A patent/CN115667408A/zh active Pending
- 2021-04-14 TW TW110113376A patent/TWI884253B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014122271A (ja) | 2012-12-21 | 2014-07-03 | Shin Etsu Chem Co Ltd | 付加硬化型自己接着性シリコーンゴム組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115667408A (zh) | 2023-01-31 |
| WO2021241036A1 (ja) | 2021-12-02 |
| EP4159814A4 (en) | 2024-07-10 |
| JP7627549B2 (ja) | 2025-02-06 |
| US20230203253A1 (en) | 2023-06-29 |
| TW202212478A (zh) | 2022-04-01 |
| TWI884253B (zh) | 2025-05-21 |
| EP4159814A1 (en) | 2023-04-05 |
| JP2021187877A (ja) | 2021-12-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PE0902 | Notice of grounds for rejection |
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| P11 | Amendment of application requested |
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| P11-X000 | Amendment of application requested |
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