KR20220104768A - 레지스트 패턴간 충전액의 대체액 및 이를 이용한 레지스트 패턴의 제조 방법 - Google Patents
레지스트 패턴간 충전액의 대체액 및 이를 이용한 레지스트 패턴의 제조 방법 Download PDFInfo
- Publication number
- KR20220104768A KR20220104768A KR1020227020742A KR20227020742A KR20220104768A KR 20220104768 A KR20220104768 A KR 20220104768A KR 1020227020742 A KR1020227020742 A KR 1020227020742A KR 20227020742 A KR20227020742 A KR 20227020742A KR 20220104768 A KR20220104768 A KR 20220104768A
- Authority
- KR
- South Korea
- Prior art keywords
- resist
- resist pattern
- alkyl
- liquid
- replacement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-207844 | 2019-11-18 | ||
| JP2019207844A JP2021081545A (ja) | 2019-11-18 | 2019-11-18 | レジストパターン間置換液、およびそれを用いたレジストパターンの製造方法 |
| PCT/EP2020/082179 WO2021099235A1 (en) | 2019-11-18 | 2020-11-16 | Replacement liquid of liquid filling between resist patterns, and method for producing resist patterns using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220104768A true KR20220104768A (ko) | 2022-07-26 |
Family
ID=73455692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227020742A Pending KR20220104768A (ko) | 2019-11-18 | 2020-11-16 | 레지스트 패턴간 충전액의 대체액 및 이를 이용한 레지스트 패턴의 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230045307A1 (enExample) |
| EP (1) | EP4062235A1 (enExample) |
| JP (3) | JP2021081545A (enExample) |
| KR (1) | KR20220104768A (enExample) |
| CN (1) | CN114730144A (enExample) |
| TW (1) | TWI887299B (enExample) |
| WO (1) | WO2021099235A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022175281A (ja) | 2021-05-13 | 2022-11-25 | トヨタ自動車株式会社 | 提案システムおよび提案方法 |
| WO2024141355A1 (en) * | 2022-12-26 | 2024-07-04 | Merck Patent Gmbh | Electronic device manufacturing aqueous solution, method for manufacturing resist pattern and method for manufacturing device |
| KR20250137630A (ko) * | 2023-01-13 | 2025-09-18 | 메르크 파텐트 게엠베하 | 전자 기기 제조 수용액, 레지스트 패턴의 제조 방법 및 디바이스의 제조 방법 |
| KR20240170272A (ko) * | 2023-05-26 | 2024-12-03 | 삼성에스디아이 주식회사 | 금속 함유 포토레지스트 현상액 조성물, 및 이를 이용한 현상 단계를 포함하는 패턴 형성 방법 |
| WO2025087999A1 (en) * | 2023-10-25 | 2025-05-01 | Merck Patent Gmbh | Electronic device manufacturing aqueous solution, method for producing resist pattern, and method for manufacturing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016060116A1 (ja) | 2014-10-14 | 2016-04-21 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | レジストパターン処理用組成物およびそれを用いたパターン形成方法 |
| WO2018095885A1 (en) | 2016-11-25 | 2018-05-31 | Az Electronic Materials (Luxembourg) S.A.R.L. | A lithography composition, a method for forming resist patterns and a method for making semiconductor devices |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822441A1 (de) * | 1997-06-24 | 1999-01-28 | Heidelberger Druckmasch Ag | Druckformreinigungsverfahren |
| US7811748B2 (en) * | 2004-04-23 | 2010-10-12 | Tokyo Ohka Kogyo Co., Ltd. | Resist pattern forming method and composite rinse agent |
| JP4493393B2 (ja) * | 2004-04-23 | 2010-06-30 | 東京応化工業株式会社 | リソグラフィー用リンス液 |
| JP2006011054A (ja) * | 2004-06-25 | 2006-01-12 | Shin Etsu Chem Co Ltd | リンス液及びこれを用いたレジストパターン形成方法 |
| EP1804124A1 (en) * | 2004-09-01 | 2007-07-04 | Tokyo Ohka Kogyo Co., Ltd. | Developing solution composition for lithography and method for resist pattern formation |
| KR20080069252A (ko) * | 2006-01-11 | 2008-07-25 | 토쿄오오카코교 가부시기가이샤 | 리소그래피용 세정제 및 그것을 이용한 레지스트 패턴형성방법 |
| US20100028803A1 (en) * | 2008-08-01 | 2010-02-04 | Fujifilm Corporation | Surface treating agent for resist pattern formation, resist composition, method of treating surface of resist pattern therewith and method of forming resist pattern |
| JP5624753B2 (ja) * | 2009-03-31 | 2014-11-12 | 東京応化工業株式会社 | リソグラフィー用洗浄液及びこれを用いたレジストパターンの形成方法 |
| CN103229104B (zh) * | 2010-12-09 | 2016-08-24 | 日产化学工业株式会社 | 包含含有羟基的咔唑酚醛清漆树脂的形成抗蚀剂下层膜的组合物 |
| JP5705607B2 (ja) * | 2011-03-23 | 2015-04-22 | メルクパフォーマンスマテリアルズIp合同会社 | リソグラフィー用リンス液およびそれを用いたパターン形成方法 |
| JP6455397B2 (ja) * | 2014-11-27 | 2019-01-23 | 信越化学工業株式会社 | パターン形成用リンス溶液及びパターン形成方法 |
| JP6428568B2 (ja) * | 2014-11-27 | 2018-11-28 | 信越化学工業株式会社 | パターン形成用リンス溶液及びパターン形成方法 |
| KR102113463B1 (ko) * | 2016-01-22 | 2020-05-21 | 후지필름 가부시키가이샤 | 처리액 |
| KR102083151B1 (ko) * | 2016-06-20 | 2020-03-03 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | 린스 조성물, 레지스트 패턴의 형성 방법 및 반도체 디바이스의 제조 방법 |
| JP6759174B2 (ja) * | 2016-11-07 | 2020-09-23 | 富士フイルム株式会社 | 処理液及びパターン形成方法 |
| JP2018127513A (ja) * | 2017-02-06 | 2018-08-16 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | 半導体水溶性組成物、およびその使用 |
-
2019
- 2019-11-18 JP JP2019207844A patent/JP2021081545A/ja active Pending
-
2020
- 2020-11-16 CN CN202080079209.5A patent/CN114730144A/zh active Pending
- 2020-11-16 WO PCT/EP2020/082179 patent/WO2021099235A1/en not_active Ceased
- 2020-11-16 KR KR1020227020742A patent/KR20220104768A/ko active Pending
- 2020-11-16 JP JP2022516211A patent/JP7732976B2/ja active Active
- 2020-11-16 US US17/777,638 patent/US20230045307A1/en active Pending
- 2020-11-16 EP EP20808057.2A patent/EP4062235A1/en active Pending
- 2020-11-17 TW TW109140073A patent/TWI887299B/zh active
-
2025
- 2025-04-30 JP JP2025075386A patent/JP2025114656A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016060116A1 (ja) | 2014-10-14 | 2016-04-21 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | レジストパターン処理用組成物およびそれを用いたパターン形成方法 |
| WO2018095885A1 (en) | 2016-11-25 | 2018-05-31 | Az Electronic Materials (Luxembourg) S.A.R.L. | A lithography composition, a method for forming resist patterns and a method for making semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023502837A (ja) | 2023-01-26 |
| JP2025114656A (ja) | 2025-08-05 |
| CN114730144A (zh) | 2022-07-08 |
| TWI887299B (zh) | 2025-06-21 |
| JP2021081545A (ja) | 2021-05-27 |
| TW202124692A (zh) | 2021-07-01 |
| JP7732976B2 (ja) | 2025-09-02 |
| WO2021099235A1 (en) | 2021-05-27 |
| EP4062235A1 (en) | 2022-09-28 |
| US20230045307A1 (en) | 2023-02-09 |
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| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| PE0902 | Notice of grounds for rejection |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| T11-X000 | Administrative time limit extension requested |
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