KR20220092781A - 블레이드 교환 장치 - Google Patents

블레이드 교환 장치 Download PDF

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Publication number
KR20220092781A
KR20220092781A KR1020210160079A KR20210160079A KR20220092781A KR 20220092781 A KR20220092781 A KR 20220092781A KR 1020210160079 A KR1020210160079 A KR 1020210160079A KR 20210160079 A KR20210160079 A KR 20210160079A KR 20220092781 A KR20220092781 A KR 20220092781A
Authority
KR
South Korea
Prior art keywords
blade
cutting blade
cutting
unit
flange
Prior art date
Application number
KR1020210160079A
Other languages
English (en)
Korean (ko)
Inventor
가즈키 데라다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20220092781A publication Critical patent/KR20220092781A/ko

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/157Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling of rotary tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • B24B45/006Quick mount and release means for disc-like wheels, e.g. on power tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • B24B45/003Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614Means for mounting the cutting member
    • B26D7/2621Means for mounting the cutting member for circular cutters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/1552Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
    • B23Q3/1554Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore
    • B23Q2003/155414Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore the transfer mechanism comprising two or more grippers
    • B23Q2003/155418Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore the transfer mechanism comprising two or more grippers the grippers moving together
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00Tool changing
    • Y10T483/13Tool changing with control means energized in response to activator stimulated by condition sensor
    • Y10T483/132Responsive to tool identifying information
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00Tool changing
    • Y10T483/17Tool changing including machine tool or component
    • Y10T483/1733Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
    • Y10T483/1736Tool having specific mounting or work treating feature
    • Y10T483/174Abrading wheel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020210160079A 2020-12-25 2021-11-19 블레이드 교환 장치 KR20220092781A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020216255A JP2022101893A (ja) 2020-12-25 2020-12-25 ブレード交換装置
JPJP-P-2020-216255 2020-12-25

Publications (1)

Publication Number Publication Date
KR20220092781A true KR20220092781A (ko) 2022-07-04

Family

ID=81972370

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210160079A KR20220092781A (ko) 2020-12-25 2021-11-19 블레이드 교환 장치

Country Status (6)

Country Link
US (1) US11980988B2 (de)
JP (1) JP2022101893A (de)
KR (1) KR20220092781A (de)
CN (1) CN114683172A (de)
DE (1) DE102021214596A1 (de)
TW (1) TW202224845A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022125669A (ja) * 2021-02-17 2022-08-29 株式会社ディスコ 切削装置
CN116141077B (zh) * 2023-02-07 2023-12-15 扬州市强胜电气有限公司 一种建筑工程用的打孔装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098536A (ja) 2005-10-06 2007-04-19 Disco Abrasive Syst Ltd 切削ブレードの交換装置
JP2016064450A (ja) 2014-09-22 2016-04-28 株式会社ディスコ 切削ブレード交換システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030326A (en) * 1997-06-05 2000-02-29 Tokyo Seimitsu Co., Ltd. Automatic blade changing system
TW459277B (en) * 1999-08-20 2001-10-11 Disco Abrasive System Ltd Mechanism for adjusting rotational balance of cutting machine
US6520895B2 (en) * 1999-09-07 2003-02-18 Nikon Corporation Polishing device and polishing pad component exchange device and method
US20060014475A1 (en) * 2004-07-15 2006-01-19 Disco Corporation Grindstone tool
JP5016496B2 (ja) * 2004-12-17 2012-09-05 ミルウォーキー・エレクトリック・トゥール・コーポレーション 動力工具用スマートアクセサリー
JP2007208114A (ja) * 2006-02-03 2007-08-16 Disco Abrasive Syst Ltd 切削装置
JP5139720B2 (ja) * 2007-06-05 2013-02-06 株式会社ディスコ 切削装置
JP2015020237A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ 切削装置
JP2015085466A (ja) * 2013-10-31 2015-05-07 株式会社ディスコ フランジ機構
JP6934334B2 (ja) * 2017-06-30 2021-09-15 株式会社ディスコ 切削ブレードの装着方法
JP6966883B2 (ja) * 2017-07-04 2021-11-17 株式会社ディスコ ブレード脱着治具、ブレード脱着方法、ブレード取り出し方法、及び切削装置
WO2019058381A1 (en) * 2017-09-25 2019-03-28 Aggarwal Ujjawal HIGH VOLTAGE LOW PRESSURE SUCTION DEVICE
JP7126749B2 (ja) * 2018-03-19 2022-08-29 株式会社ディスコ 切削装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098536A (ja) 2005-10-06 2007-04-19 Disco Abrasive Syst Ltd 切削ブレードの交換装置
JP2016064450A (ja) 2014-09-22 2016-04-28 株式会社ディスコ 切削ブレード交換システム

Also Published As

Publication number Publication date
CN114683172A (zh) 2022-07-01
US11980988B2 (en) 2024-05-14
TW202224845A (zh) 2022-07-01
US20220203487A1 (en) 2022-06-30
JP2022101893A (ja) 2022-07-07
DE102021214596A1 (de) 2022-06-30

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