KR20220057545A - Method for manufacturing release film and semiconductor package - Google Patents

Abstract

A mold release that satisfies at least one of the following (1) or (2), comprising a base layer, an adhesive layer, and a conductive layer disposed between the base layer and the adhesive layer. film. (1) The base layer contains a polyester copolymer including a butylene structure and an alkylene oxide structure. (2) The elongation at 150°C is 1000% or more.

Description

Method for manufacturing release film and semiconductor package

[0001] The present invention relates to a release film and a method for manufacturing a semiconductor package.

[0002] In recent years, as thinning of electronic devices, particularly mobile phones, progresses, further thinning is required for semiconductor packages in which electronic components such as semiconductor devices are embedded. In addition, from the viewpoint of improving heat dissipation, instead of over molding in which the entire electronic component is covered with a seal resin, exposed die molding that exposes a part of the surface of the electronic component (Exposed Die Molding) ) is increasingly being employed.

[0003] When sealing the electronic component so that a part of the electronic component is in an exposed state, it is necessary to prevent leakage (flash/burr) of the sealing material to the exposed portion of the electronic component. Therefore, sealing is performed in the state which stuck the film (release film) which has release property to the part to be exposed of an electronic component, and peeling a release film after that and exposing the surface of an electronic component is performed. As such a release film, for example, Patent Document 1 describes a laminated film in which a film made of a fluororesin is laminated on at least one surface of a base film made of a stretched polyester resin film.

Japanese Patent Application Publication No. 2005-186740

[0005] As described above, the release film is peeled off from the surface of the electronic component after the sealing process. At this time, if the release film is charged, discharge is generated at the time of peeling, and there is a fear that electrostatic destruction of electronic components may occur.

In addition, a technique of collectively sealing a plurality of packages after mounting on a board has been recently studied, and the use of a release film for exposing terminals has been studied. In this case, since various types of packages exist on the substrate, excellent extensibility (mold followability) is required for the release film. In addition, since there are cases where the package is weak to heat depending on the type of package, it is required to exhibit excellent extensibility even at low temperatures (eg, 150° C. or less).

[0006] In view of the above circumstances, one aspect of the present invention has an object to provide a release film in which electrostatic breakdown of electronic components is suppressed and excellent in extensibility at low temperatures. Another aspect of the present invention is to provide a method for manufacturing a semiconductor package using the release film.

[0007] Means for solving the above problems include the following embodiments.

<1> A polyester comprising a substrate layer, an adhesive layer, and a conductive layer disposed between the substrate layer and the adhesive layer, wherein the substrate layer includes a butylene structure and an alkylene oxide structure A release film comprising a copolymer.

<2> A release film comprising a substrate layer, an adhesive layer, and a conductive layer disposed between the substrate layer and the adhesive layer, and having an elongation at 150°C of 1000% or more.

The release film as described in <1> or <2> for using for manufacture of the semiconductor package by <3> exposure molding.

<4> The step of sealing the periphery of the electronic component in a state in which the adhesive layer of the release film according to any one of <1> to <3> is in contact with at least a part of the surface of the electronic component; A method of manufacturing a semiconductor package comprising the step of peeling from the electronic component.

[0008] According to one aspect of the present invention, there is provided a release film that suppresses electrostatic breakdown of electronic components and has excellent extensibility at low temperatures. According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package using the release film.

1 is a view schematically showing the configuration of a release film.
It is a figure which showed the shape of the test piece used for the measurement of the elongation rate and elastic modulus of a release film.

Hereinafter, the form for carrying out the present invention will be described in detail. However, this invention is not limited to the following embodiment. In the following embodiments, the constituent elements (including element steps and the like) are not essential except as otherwise specified. The same applies to numerical values and ranges, and the present invention is not limited.

[0011] In the present specification, the term "process" includes not only a process independent from other processes, but also a corresponding process as long as the purpose of the process is achieved even if it cannot be clearly distinguished from other processes.

In the present specification, in the numerical range indicated using "-", the numerical values described before and after "-" are included as a minimum value and a maximum value, respectively.

In the numerical range described step by step in this specification, the upper limit or lower limit described in one numerical range may be substituted with the upper limit or lower limit of the numerical range described in another stepwise range. In addition, in the numerical range described in this specification, you may substitute the upper limit or lower limit of the numerical range with the value described in the Example.

In the present specification, the content rate or content of each component in the composition is the sum of the plurality of substances present in the composition, unless otherwise specified, when a plurality of types of substances corresponding to each component exist in the composition. It means the content rate or content.

In the present specification, the particle diameter of each component in the composition means a value for a mixture of the plurality of types of particles present in the composition, unless otherwise specified, when a plurality of types of particles corresponding to each component exist in the composition do.

In the present specification, the term "layer" includes not only the case where the entire region is formed, but also the case where the region is formed only in a part of the region when the region in which the layer exists is observed.

In this specification, the thickness of each layer which comprises a release film or a release film can be measured by a well-known method. For example, you may measure using a dial gauge etc., and you may measure from the cross-sectional image of a release film. Alternatively, the material constituting the layer may be removed using a solvent or the like, and may be calculated from the mass before and after removal, the density of the material, the area of the layer, and the like. When the thickness of a layer is not constant, let the arithmetic mean of the values measured at arbitrary five points|pieces be the thickness of a layer.

In the present specification, "(meth)acryl" means at least one or both of acryl and methacryl, and "(meth)acrylate" means at least one of acrylate and methacrylate or means both.

[0012] <Release film>

The release film of the present disclosure includes a substrate layer, an adhesive layer, and a conductive layer disposed between the substrate layer and the adhesive layer, and is a release film satisfying at least one of the following (1) or (2). .

(1) The base layer contains a polyester copolymer (hereinafter simply referred to as a polyester copolymer) including a butylene structure and an alkylene oxide structure.

(2) The elongation at 150°C is 1000% or more.

[0013] According to the release film, electrostatic destruction of electronic components is suppressed. Although the reason is not necessarily clear, charging of a release film is suppressed by providing a conductive layer, and it is thought that it is because discharge is hard to generate|occur|produce when peeling a release film from an electronic component.

1, the configuration of the release film is schematically shown. As shown in FIG. 1 , the release film 40 includes a substrate layer 10 , an adhesive layer 20 , and a conductive layer 30 disposed between the substrate layer 10 and the adhesive layer 20 , there is.

As shown in FIG. 1, in the release film of the present disclosure, the conductive layer 30 is disposed between the base layer 10 and the adhesive layer 20, not the surface of the release film 40 (adhesive). layer 20 is disposed on the surface of the release film). For this reason, the release film can fully be closely_contact|adhered to the surface of an electronic component through an adhesive layer, and penetration of a sealing material can be prevented effectively.

[0016] Furthermore, since the release film satisfies at least one of (1) or (2) above, it is excellent in extensibility at low temperature.

[0017] The release film of the present disclosure is peeled off after performing a treatment such as a sealing process in a state in which the adhesive layer side is adhered to the surface of an adherend such as an electronic component. When the release film of this indication peels from a to-be-adhered body, discharge is hard to generate|occur|produce. For this reason, it is used suitably for manufacture of the semiconductor package by exposure molding, for example.

[0018] In the present disclosure, the elongation (%) at 150° C. of the release film is measured as follows.

First, a test piece having a shape as shown in Fig. 2 is produced using a release film. A tensile test is performed while holding both ends of this test piece with a testing machine. The measurement is carried out under the conditions of 150°C, and the tensile speed is set to 500 mm/min. From the distance A between the gage points of the sample before the test (the length of the portion having a width of 10 mm in the test piece shown in Fig. 2: 40 mm) and the distance B between the gage points when the sample is cut, the elongation rate is calculated by the following formula do.

[0019]

For the measurement of the elongation of the release film, for example, "TENSILON Tensile Tester RTA-100 Type" manufactured by Orientec Co., Ltd. (ORIENTEC CO., LTD.) or a similar tester, Use a gripper and one with a 180 degree peeling device.

[0021] The release film preferably has an elongation at 150°C of 1200% or more, and more preferably 1400% or more. The elongation rate in 150 degreeC of a release film can be adjusted with the composition ratio between the butylene structure and alkylene oxide structure in a polyester copolymer, when a base material layer contains a polyester copolymer, for example.

[0022] The release film preferably has an elastic modulus at 150° C. of 10 MPa to 50 Mpa, more preferably 20 MPa to 40 Mpa. When the elastic modulus at 150°C is 10 MPa or more, good mold followability tends to be obtained, and when it is 50 MPa or less, good extensibility tends to be obtained.

The elastic modulus in 150 degreeC of a release film can be adjusted with the composition ratio between the butylene structure and alkylene oxide structure in a polyester copolymer, when a base material layer contains a polyester copolymer, for example.

[0023] (modulus of elasticity at 150 ℃)

The elastic modulus (MPa) at 150°C of the release film is calculated from the inclination of the tangent line in the stress-strain diagram by pulling the test piece in the same manner as in the measurement of the elongation at 150°C. It is calculated by the following formula from the force (MPa) per unit cross-sectional area (mm ² ) acting on the test piece, the distance between the gage points L0 (40 mm) before the test, and the distance L between the gage points.

[0024]

[0025] (substrate layer)

From a viewpoint of extensibility at low temperature, it is preferable that a base material layer contains the polyester copolymer containing a butylene structure and an alkylene oxide structure.

The alkylene oxide structure contained in the polyester copolymer is the structure in which the alkylene group and the oxygen atom couple|bonded, Preferably carbon number of the alkylene group is 1-6, More preferably, it is 4.

[0026] The polyester copolymer can be synthesized, for example, by copolymerizing an aromatic dicarboxylic acid such as terephthalic acid or a derivative thereof, 1,4-butanediol, and poly(alkylene oxide) glycol.

[0027] The polyester copolymer is preferably a copolymer including a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2). In this copolymer, the structural unit represented by Formula (1) is an elastomer which comprises a hard segment (PBT), and the structural unit represented by Formula (2) comprises a soft segment (PTMG), respectively.

[0028]

[0029]

The mass ratio (PBT:PTMG) of the hard segment (PBT) and the soft segment (PTMG) constituting the copolymer is not particularly limited. For example, you may select from the range of 1:9-9:1, you may select from the range of 2:8-8:2, You may select from the range of 3:7-7:3.

[0031] The base layer may contain components other than the polyester copolymer. For example, polyester, such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polyimide, polyamide, polyester ether, polyamideimide, a fluorine-containing resin, etc. are mentioned. When the base layer contains components other than the polyester copolymer, the proportion of the polyester copolymer is preferably 50 mass % or more of the entire base layer, more preferably 70 mass % or more, still more preferably 80 mass % or more Do.

The thickness of the base layer is not particularly limited, and it is preferably 10 μm to 300 μm, and more preferably 20 μm to 100 μm. When the thickness of the base layer is 10 μm or more, the release sheet is not easily broken, and thus the handleability is excellent. When the thickness of the base layer is 300 μm or less, since the followability to the mold is excellent, the occurrence of poor appearance due to wrinkles or the like of the molded semiconductor package tends to be suppressed.

[0033] The base layer may be composed of only one layer, or may be composed of two or more layers. As a method of obtaining a base layer composed of two or more layers, a method of extruding the material of each layer by a co-extrusion method to produce it, a method of laminating two or more films, and the like. .

[0034] If necessary, the surface of the base layer on the side on which the conductive layer is provided may be subjected to a treatment for improving the adhesion to the conductive layer. As a treatment method, surface treatment, such as corona treatment and plasma treatment, application|coating of an undercoat agent (primer), etc. are mentioned.

[0035] If necessary, on the back surface of the base layer (the surface opposite to the side on which the conductive layer is disposed), a back treatment agent for controlling unwinding properties from a roll of the release film is provided it may be As a back surface treatment agent, a silicone resin, fluorine-containing resin, polyvinyl alcohol, resin which has an alkyl group, etc. are mentioned. If necessary, these backside treatment agents may be subjected to a denaturation treatment. Only 1 type may be used for a back surface treatment agent, and may use 2 or more types together.

[0036] (adhesive layer)

It is preferable that an adhesive layer contains an adhesive from a viewpoint of the adhesiveness with respect to the surface of an electronic component. The type of the pressure-sensitive adhesive is not particularly limited, and may be selected in consideration of adhesiveness, releasability, heat resistance, and the like. Specifically, an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, and a urethane pressure-sensitive adhesive are preferable, and an acrylic pressure-sensitive adhesive is more preferable. One type may be sufficient as the adhesive contained in an adhesion layer, and 2 or more types may be sufficient as it.

[0037] The acrylic pressure-sensitive adhesive includes a monomer having a low glass transition temperature (Tg) such as butyl acrylate, ethyl acrylate, and 2-ethylhexyl acrylate as main monomers (eg, -20°C or less), and (meth)acrylic acid , hydroxyethyl (meth) acrylate, hydroxyethyl (meth) acrylate, (meth) acrylamide, a copolymer obtained by copolymerizing a monomer having a functional group such as (meth) acrylonitrile (hereinafter also referred to as an acrylic copolymer) ) is preferable. The "glass transition temperature" is the glass transition temperature of a homopolymer obtained using the corresponding monomer.

[0038] The acrylic copolymer may be a crosslinked (架橋型) acrylic copolymer. A crosslinkable acrylic copolymer can be synthesize|combined by crosslinking the monomer used as a raw material of an acrylic copolymer using a crosslinking agent. As a crosslinking agent used for the synthesis|combination of a crosslinkable acrylic copolymer, well-known crosslinking agents, such as an isocyanate compound, a melamine compound, and an epoxy compound, are mentioned. Moreover, in order to form the network-like structure which spread loosely in the acrylic adhesive, it is more preferable that a crosslinking agent is a polyfunctional crosslinking agent, such as trifunctionality and tetrafunctionality.

[0039] The pressure-sensitive adhesive layer may contain an anchoring enhancer, a crosslinking accelerator, a filler, a colorant, and the like, if necessary. For example, as the pressure-sensitive adhesive layer contains a filler, the external surface (the surface opposite to the conductive layer) of the pressure-sensitive adhesive layer is roughened, and effects such as improved releasability from electronic components are obtained.

The material of the filler is not particularly limited, and may be an organic material such as a resin, an inorganic material such as a metal or a metal oxide, or a combination of an organic material and an inorganic material. In addition, the number of fillers contained in an adhesion layer may be one, and 2 or more types may be sufficient as it. The volume average particle diameter of a filler in particular is not restrict|limited. For example, it can select from the range of 1 micrometer - 20 micrometers. In the present specification, the volume average particle diameter of the filler is the particle diameter (D50) when the accumulation from the small diameter side in the volume-based particle size distribution measured by the laser diffraction method becomes 50%.

From the viewpoint of affinity with the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer, the filler is preferably a resin particle. As resin which comprises resin particle, an acrylic resin, an olefin resin, a styrene resin, an acrylonitrile resin, a silicone resin, etc. are mentioned. From the viewpoint of suppressing the residue on the surface of the semiconductor package after molding, an acrylic resin is preferable.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, and is preferably 0.1 μm to 100 μm, and more preferably 1 μm to 100 μm. When the thickness of the adhesive layer is 0.1 µm or more, the adhesive force to the electronic component is sufficiently obtained, and penetration of the sealing material is effectively suppressed. When the thickness of the pressure-sensitive adhesive layer is 100 μm or less, the distance from the conductive layer on the surface of the pressure-sensitive adhesive layer is not too far and the surface resistivity is kept low, so that electrostatic breakdown of electronic components is effectively suppressed. Moreover, it is hard to produce the thermal contraction stress at the time of thermosetting of an adhesive layer, and the flatness of a release film is easy to maintain.

In consideration of the ease of formation of the adhesive layer (applicability, etc.), securing of adhesive force, securing of antistatic function, etc., it is more preferable that the thickness of the adhesive layer is 3 µm to 50 µm.

[0043] (conductive layer)

The structure in particular of a conductive layer will not be restrict|limited, as long as it improves the electroconductivity of a release film and can suppress charging. For example, a layer containing a conductive material such as an antistatic agent, a conductive polymer material, or a metal may be used.

Examples of the antistatic agent contained in the conductive layer include a quaternary ammonium salt, a pyridium salt, a cationic antistatic agent having a cationic group such as a primary to tertiary amino group, a sulfonate group, a sulfate group, a phosphate ester group, and the like. Anionic antistatic agents having an anionic group of, amphoteric antistatic agents such as amino acids and amino acid sulfate esters, nonionic antistatic agents having nonionic groups such as aminoalcohol, glycerin, polyethylene glycol, The polymer-type antistatic agent etc. which made these antistatic agents high molecular weight are mentioned. The combination of a main agent and an adjuvant (curing agent etc.) may be sufficient as an antistatic agent.

Examples of the conductive polymer material contained in the conductive layer include a polymer compound having polythiophene, polyaniline, polypyrrole, polyacetylene or the like in its skeleton.

Aluminum, copper, gold|metal|money, chromium, tin etc. are mentioned as a metal, From a viewpoint of availability, aluminum is preferable.

[0045] A method of forming the conductive layer is not particularly limited. For example, a method of laminating a metal foil or the like on one side of the film serving as the substrate layer, and a method of applying a material for a conductive layer to one surface of the film serving as the substrate layer by coating, vapor deposition, or the like are mentioned.

The thickness of the conductive layer is not particularly limited as long as the antistatic effect of the release film can be sufficiently obtained. For example, it may exist in the range of 0.01 micrometer - 1 micrometer.

[0047] <Method for manufacturing semiconductor package>

The manufacturing method of the semiconductor package of the present disclosure includes a step of sealing the periphery of an electronic component while the adhesive layer of the above-described release film is in contact with at least a part of the surface of the electronic component, and a step of peeling the release film from the electronic component. It is a manufacturing method of the semiconductor package provided with.

[0048] As described above, the release film of the present disclosure is less likely to generate discharge when peeled, and electrostatic breakdown of electronic components is suppressed. Therefore, according to the method, a semiconductor package having excellent reliability can be manufactured.

Furthermore, the release film of the present disclosure has excellent adhesion to electronic components. Therefore, penetration of the sealing material into the part exposed after peeling a release film from an electronic component is hard to generate|occur|produce.

[0049] The type of electronic component used in the above method is not particularly limited. For example, a semiconductor element, a capacitor|condenser, a terminal, etc. are mentioned.

In the method, the type of the material (sealing material) for sealing the periphery of the electronic component is not particularly limited. For example, the resin composition containing an epoxy resin, an acrylic resin, etc. is mentioned.

Example

Hereinafter, the release film of the present disclosure will be described based on Examples. However, the present disclosure is not limited to the following examples.

[0051] <Example 1>

As a material of the base material layer, the mass ratio (PBT:PTMG) of the hard segment (PBT) having the structure represented by the general formula (1) and the soft segment (PTMG) having the structure represented by the general formula (2) is 3:7 poly A base film having a thickness of 100 µm was produced using the ester copolymer, and corona treatment was performed on one surface.

What diluted the antistatic agent to 2.5 mass % with a solvent was apply|coated to the corona-treated surface of a base film, and it heated at 100 degreeC for 1 minute, and formed the conductive layer (0.3 micrometers in thickness). As a solvent, the mixture (mass ratio 1:1) of water and isopropyl alcohol was used.

As a material for the adhesive layer, an adhesive (100 parts by mass), a crosslinking agent (20 parts by mass), a mixed solvent (34 parts by mass) of a mass ratio of toluene:methyl ethyl ketone of 8:2, and a filler (5 parts by mass) By mixing, a composition for forming an adhesive layer was prepared. This composition for forming an adhesion layer was applied on the conductive layer so that the thickness of the adhesion layer was set to 5 µm, and heated at 100°C for 1 minute to form the adhesion layer, thereby producing a release film.

[0052] <Example 2>

A release film was produced in the same manner as in Example 1 except that the mass ratio (PBT:PTMG) of the hard segment (PBT) and the soft segment (PTMG) of the polyester copolymer was 5:5.

[0053] <Example 3>

A release film was produced in the same manner as in Example 1 except that the mass ratio (PBT:PTMG) of the hard segment (PBT) and the soft segment (PTMG) of the polyester copolymer was 7:3.

[0054] <Example 4>

A release film was produced in the same manner as in Example 1 except that the mass ratio (PBT:PTMG) of the hard segment (PBT) and the soft segment (PTMG) of the polyester copolymer was 8:2.

[0055] <Example 5>

A base film (thickness 100) in which a layer A made of polybutylene terephthalate and a layer B made of a polyester copolymer having a mass ratio of hard segment (PBT) and soft segment (PTMG) (PBT:PTMG) of 2:8 are laminated μm) was prepared by co-extrusion. The thickness ratio of the layer A and the layer B was 1:1.

Except having used the obtained base film, it carried out similarly to Example 1, and produced the release film.

[0056] <Comparative Example 1>

As a base film, it carried out similarly to Example 1 except having used the 100-micrometer-thick polybutylene terephthalate film which corona-treated on one side, and produced the release film.

[0057] <Comparative Example 2>

A release film was produced in the same manner as in Example 3 except that an adhesive layer was formed without forming a conductive layer on the base film.

[0058] Details of each material used in the production of the release film are as follows.

Antistatic agent: A mixture of the following component A (100 parts by mass) and component B (25 parts by mass)

Component A: Cationic antistatic agent which is an acrylic copolymer having a quaternary ammonium salt, trade name "BONDEIP PA-100 main ingredient", Konishi Co., Ltd.

Component B: Epoxy resin, trade name "BONDEIP PA-100 hardener", Konishi Corporation

[0059] Adhesive: Composed of multiple types of mixed monomers of acrylic adhesive, trade name "FS-1208", LION SPECIALTY CHEMICALS CO., LTD., and methacrylic acid ester

Crosslinking agent: polyisocyanate type crosslinking agent (hexamethylene diisocyanate crosslinking agent (HMDI)), trade name "DURANATE E405-80T", Asahi Kasei Chemicals Corporation

Filler: crosslinked acrylic particles, trade name "MX-500", Soken Chemical & Engineering Co., Ltd., volume average particle diameter 5 mu m

[0060] <Evaluation test>

The following evaluation tests were performed using the produced release film.

[0061] (elongation and modulus at 150 °C)

By the above-described method, the elongation and elastic modulus at 150° C. of the release film were measured. For the measurement, "Tensilon Tensile Tester RTA-100 Type" manufactured by Orientec Co., Ltd. was used. A result is shown in Table 1.

[0062] (Mold followability, molded product appearance)

A release film was mounted on the upper mold of a transfer molding mold having a depth of 3 mm, fixed in a vacuum, mold clamped, and transfer molded with a sealing material. The mold temperature was 150°C, the molding pressure was 6.86 MPa (70 kgf/cm ² ), and the molding time was 300 seconds.

The mold followability was evaluated as ○ if the release sheet followed the mold without cracks, etc., △ when cracks occurred slightly but no practical problems, and × when cracks occurred.

As for the appearance of the molded product, if the release film has no wrinkles, flow marks, etc. and the appearance is good, ○, if the release film has slight wrinkles, flow marks, etc., but there is no practical problem △, When wrinkles, flow marks, etc. of a release film generate|occur|produce and defect generate|occur|produces in an external appearance, it evaluated as x.

[0063] (Electrostatic breakdown test of electronic components)

The adhesive layer side of the release film was pasted on the circuit board on which the electronic component (semiconductor element) was mounted, and it was left to stand for 60 seconds in an atmosphere where the temperature was 23±2°C and the humidity was 60±10%RH. Then, the release film was peeled vigorously. The circuit board after repeating this operation 5 times was confirmed by V-I (voltage-current characteristic) measurement, and when it became energized, it was evaluated as "0", and when it ceased to be energized, it was evaluated as "x".

[0064] [Table 1]

As shown in the results of Table 1, in the release film of the embodiment in which the base layer contains the polyester copolymer, and the elongation at 150 ° C. is 1000% or more, the base layer does not contain the polyester copolymer, Compared with the release film of Comparative Example 1 having an elongation at 150° C. of less than 1000%, the extensibility at low temperature was excellent, and the evaluation of mold followability and molded article appearance was also good.

Furthermore, in the release film of Examples in which the conductive layer was formed between the base layer and the adhesive layer, electrostatic breakdown of electronic components did not occur in the electrostatic breakdown test.

[0066] 10: base layer
20: adhesive layer
30: conductive layer
40: release film

Claims (4)

A substrate layer (基材層), an adhesive layer, and a conductive layer disposed between the substrate layer and the adhesive layer, wherein the substrate layer is a polyester copolymer comprising a butylene structure and an alkylene oxide structure Including, release (離型) film. A release film comprising a substrate layer, an adhesive layer, and a conductive layer disposed between the substrate layer and the adhesive layer, and having an elongation at 150°C of 1000% or more. 3. The method of claim 1 or 2,
The release film for using for manufacture of the semiconductor package by exposure molding. A step of sealing the periphery of the electronic component in a state in which the pressure-sensitive adhesive layer of the release film according to any one of claims 1 to 3 is in contact with at least a part of the surface of the electronic component; A method of manufacturing a semiconductor package comprising the step of peeling a release film from the electronic component.

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