KR101803884B1 - Non-substrate type transparent conductive films using detach manner and method for manufacturing the same - Google Patents

Non-substrate type transparent conductive films using detach manner and method for manufacturing the same Download PDF

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KR101803884B1
KR101803884B1 KR1020150180319A KR20150180319A KR101803884B1 KR 101803884 B1 KR101803884 B1 KR 101803884B1 KR 1020150180319 A KR1020150180319 A KR 1020150180319A KR 20150180319 A KR20150180319 A KR 20150180319A KR 101803884 B1 KR101803884 B1 KR 101803884B1
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South Korea
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film
layer
release
release film
conductive
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KR1020150180319A
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Korean (ko)
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KR20170072006A (en
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김성훈
이용정
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율촌화학 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed herein is a transparent conductive film of a non-substrate type detachment method and a method of manufacturing the same. The conductive film comprising: a first release film; A patterned first conductive layer located on one side of the first release film; An adhesive layer disposed on one surface of the first conductive layer; A patterned second conductive layer located on one side of the adhesive layer; And a second release film located on one side of the second conductive layer.

Description

TECHNICAL FIELD [0001] The present invention relates to a transparent conductive film of a non-substrate type detachment method and a method of manufacturing the same. BACKGROUND ART < RTI ID = 0.0 >

Disclosed herein is a transparent conductive film of a non-substrate type detachment method and a method of manufacturing the same.

Transparent electrodes are used in today's displays and a variety of electronic devices (phones, tablet PCs, TVs, etc.), and its applications are expected to grow even larger in the future. At present, the biggest problem of the transparent electrode is that it can bring about the problem of thickness and transparency, and this can be regarded as the greatest influence of the substrate used in general. When a conductive plastic coating is applied to a general plastic substrate, the transparency of the substrate is limited to 92 to 90%, and the plastic substrate has a thickness of 50 to 100 탆 or more. The thickness of the used touch panel or display increases.

Korean Patent Laid-Open No. 10-2012-0117545

In one aspect, the present disclosure relates to a non-substrate type detach-type transparent conductive film which exhibits an increase in transmittance and a thickness reduction effect by eliminating a plastic substrate, and is further applicable to a flexible, The purpose is to provide.

In another aspect, the present invention relates to a non-substrate type detachment method capable of keeping the pressure-sensitive adhesive layer on the other release film without easily deforming or damaging the pressure-sensitive adhesive layer while easily removing the one- And a process for producing the same.

In another aspect, the present invention aims to provide a non-substrate type detach-type transparent conductive film with improved high-temperature and high-humidity reliability and a method of manufacturing the same.

In another aspect, the present invention aims to provide a transparent electrode of both sides using the transparent conductive film.

In one aspect, the techniques disclosed herein include a first release film; A patterned first conductive layer located on one side of the first release film; An adhesive layer disposed on one surface of the first conductive layer; A patterned second conductive layer located on one side of the adhesive layer; And a second release film located on one side of the second conductive layer, wherein the first release film comprises a first base film and a first release layer in contact with the first conductive layer, Based type detachment method transparent conductive film comprising a second base film and a second release layer in contact with the second conductive layer.

In an exemplary embodiment, the peeling force of the first release film may be lower than the peeling force of the second release film.

In an exemplary embodiment, when the peel force of the first release film is P1 and the peel force of the second release film is P2, P2 / P1 may be 2.0 to 5.0.

In an exemplary embodiment, the peel force of the first release film is 1 to 5 gf / 25 mm, and the peel force of the second release film is 2 to 30 gf / 25 mm.

In an exemplary embodiment, the first release layer comprises a melamine-based or acrylic release agent, and the second release layer comprises a silicone-based release agent.

In an exemplary embodiment, the thickness of the first and second conductive layers may be 50 nm to 1 탆, respectively.

In an exemplary embodiment, the first and second conductive layers are formed of a material selected from the group consisting of PEDOT (Poly (3,4-Ethylene Di-Oxythiophene)), PSS (Poly (Styrene- May include at least one selected from the group consisting of a nanowire, a silver mesh, a copper mesh, ITO (Indium Tin Oxide), and ATO (Antimony Tin Oxide).

In an exemplary embodiment, the adhesive layer comprises a crosslinking agent; And an acrylic copolymer containing a crosslinkable functional group.

In an exemplary embodiment, the acrylic copolymer may be a copolymer of an acrylate monomer having 4 to 20 carbon atoms.

In an exemplary embodiment, the adhesive layer may have an adhesive force of 1000 to 3000 gf / 25 mm.

In another aspect, the technique disclosed herein includes an adhesive layer; Based transparent electrode comprising a patterned conductive layer formed on both sides of the adhesive layer.

In another aspect, the techniques disclosed herein include the steps of: (1) forming a patterned first conductive layer on a first release layer of a first release film having a first base film and a first release layer stacked; (2) forming a patterned second conductive layer on the second release layer of the second release film having the second base film and the second release layer laminated thereon; (3) forming an adhesive layer on the first conductive layer; And (4) laminating a second conductive layer formed on the second release film with an adhesive layer. The present invention also provides a method for manufacturing a transparent conductive film of a non-substrate type detach system.

In an exemplary embodiment, the peeling force of the first release film may be lower than the peeling force of the second release film.

In an exemplary embodiment, the method may further comprise (after step (4), (5) removing the first release film and then removing the second release film.

In one aspect, the techniques disclosed herein are based on non-substrate type detach-type transparent conductive films that exhibit increased transmittance and thickness reduction effects by eliminating plastic substrates and that are further flexible, There is an effect of providing a manufacturing method.

In another aspect, the technique disclosed in this specification is a non-substrate type detach (hereinafter, referred to as " non-substrate type detacher ") capable of holding the adhesive layer on the other release film without easily deforming or damaging the adhesive layer while easily removing the one- detach type transparent conductive film and a method of manufacturing the same.

In another aspect, the technique disclosed in this specification is effective to provide a non-substrate type detach-type transparent conductive film with improved high-temperature and high-humidity reliability and a method of manufacturing the same.

In another aspect, the technique disclosed in this specification has an effect of providing a double-sided transparent electrode using the transparent conductive film.

1 is a schematic diagram showing a cross-section of a conductive film structure according to one exemplary embodiment of the present disclosure;
2 is a schematic view showing a method of manufacturing a conductive film and an implementation method thereof according to an exemplary embodiment of the present disclosure;

Hereinafter, the present invention will be described in detail.

As used herein, the term "non-substrate type" means that an adhesive layer exists between two conductive layers but does not have a substrate at the center. This contrasts with a substrate-type transparent conductive film or transparent electrode in which a plastic or glass substrate is present at the center.

The term " detach-type transparent conductive film "as used herein means that a conductive layer is formed on a temporary substrate, then an adhesive layer is formed on the conductive layer, and then the temporary substrate, , And a transparent / transparent conductive film of high transparency / low thickness, which removes the release film and imparts light transmittance and conductivity in a detached manner.

As used herein, the term "transparent electrode" refers to an electrode having light transmittance and conductivity, and examples of the application of the transparent electrode include various display devices such as a liquid crystal display device, an electronic paper display device, Including a device using a touch panel, in a battery field, for example, a solar cell, and the like.

When a layer or member is referred to herein as being "on one side" or "on" of another layer or member, this is not only the case where a layer or member is in contact with another layer or member, But also to the case where another layer or another member is present.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic diagram showing a cross section of a transparent conductive film structure of a non-substrate type detachment type according to one exemplary embodiment of the present disclosure;

As shown in FIG. 1, the conductive film includes a first release film 10; A first conductive layer (20) located on one side of the first release film (10); An adhesive layer (30) located on one surface of the first conductive layer (20); A second conductive layer 40 located on one side of the adhesive layer 30; And a second release film (50) located on one side of the second conductive layer (40), the first release film (10) comprising a first base film (11) and the first conductive layer (20) And the second release film 50 includes a second base film 51 and a second release layer 52 in contact with the second conductive layer 40 .

By removing the first release film 10 and the second release film 50, the conductive film can provide a double-sided transparent electrode having a thin thickness and excellent optical characteristics.

In an exemplary embodiment, the first base film 11 and / or the second base film 51 is an optical film made of a material having heat resistance, such as polyethylene terephthalate (polyethylene terephthalate), polyethylene naphthalate A thermoplastic resin including a polyester resin such as polyethylene terephthalate, polyethylene terephthalate and the like, preferably a PET film. The thickness of the first base film 11 and / or the second base film 51 may have a thickness in the range of 25 to 188 mu m in a non-limiting example.

In the exemplary embodiment, the tensile strength of the first base film 11 and / or the second base film 51 is 22.0 ± 8 kgf / mm 2 in the MD direction (width direction), 30.0 ± 9 kgf / mm 2 . The elongation of the first base film 11 and / or the second base film 51 may be 150 ± 80% in the MD direction and 100 ± 80% in the TD direction.

In an exemplary embodiment, the second base film 51 may have an orientation angle of 6 degrees or less, more specifically, an orientation angle of 0 to 6 degrees. The orientation angle is the angle at which the film is stretched during the production of the second base film 51, which indicates the orientation of the alignment main axis. When the angle of the orientation angle is 6 degrees or less, the foreign matter on the adherend can be clearly seen when the film is adhered to the adherend in a later process. Therefore, it is possible to increase the accuracy in inspection of the foreign body of the adherend.

In an exemplary embodiment, the peeling force of the first release film 10 may be lower than the peeling force of the second release film 50. [ The adhesive layer 30 should be kept intact without being damaged or deformed when the first release film 10 is peeled off. If the difference in releasing force between the first release film 10 and the second release film 50 is small, deformation or damage of the adhesive layer 30 may occur upon removal of the first release film 10, And the second release film 50, it is important that the second release film 50 can be easily removed if the difference in releasing force is too high, so that it is necessary to have a proper releasing force difference.

In an exemplary embodiment, when the peeling force of the first release film 10 is P1 and the peeling force of the second release film 50 is P2, P2 / P1 may be 2.0 to 5.0.

In an exemplary embodiment, the peel force of the first release film 10 is 1 to 5 gf / 25 mm and the peel force of the second release film 50 is 2 to 30 gf / 25 mm or 2 to 25 gf / 25 mm. When the peeling force of the first release film is 1 gf / 25 mm or more, it is possible to prevent the occurrence of defects such as lifting and tunneling, thereby protecting the conductive layer or the adhesive layer. When the peeling force of the first release film is 5 gf / Or less, it is possible to prevent the problem that the adhesive layer may peel off when the first release film is peeled off. It is also preferable that the peeling force of the second release film does not exceed 30 gf / 25 mm, preferably 25 gf / 25 mm even after being left at 70 DEG C for 24 hours. This is because when the peeling force between the second release film and the conductive layer is higher than the peeling force between the conductive layer and the adhesive layer after the removal of the first release film, the second release film may not peel off.

In an exemplary embodiment, the surface tension of the first release layer 12 may be 30 to 50 dynes, or 35 to 45 dyme. Further, the release agent of the first release layer 12 is not particularly limited, , Non-silicone type melamine type or acrylic type releasing agent can be used, and the curing type can use both heat and ultraviolet ray curing. The amount of the releasing agent contained in the first release layer 12 is not particularly limited, but may be in the range of 0.3 to 4 g / m 2 or 0.5 to 3 g / m 2 in consideration of the peeling performance.

In the exemplary embodiment, there is no particular restriction on the release form of the second release layer 52, but it is preferable to apply an addition-type silicone system exhibiting releasability to the acrylic pressure-sensitive adhesive to achieve a drying temperature of 130 ° C or lower. When the film is heated to 130 DEG C or higher, heat shrinkage of the film may cause lateral wrinkles and / or vertical wrinkles. As the silicone-based releasing agent which does not apply heat, ultraviolet curing type acrylic silicon, mercapto group-containing silicon and epoxy group-containing silicon can also be used.

In an exemplary embodiment, the formation of the release layer (first and / or second release layer) on the base film (first and / or second base film) may be accomplished by coating techniques commonly used in the art ≪ / RTI > Specifically, the releasing agent may be applied to the base film by various methods such as gravure coating, Meyer bar coating, air knife coating, doctor knife coating, and the like, followed by drying and curing by heat treatment or ultraviolet irradiation have.

In an exemplary embodiment, the first and second conductive layers may be patterned. The "pattern" may mean that a certain form is repeatedly formed. Specifically, the pattern may be in the form of a polygon such as a triangle, a rectangle, etc., a circle, an ellipse or an amorphous form.

In an exemplary embodiment, the thickness of the first and second conductive layers may be 50 nm to 1 탆, respectively. Thereby, an excellent light transmittance and an excellent electrical conductivity can be realized.

The method of forming the conductive layer is not particularly limited, and any method known in the art can be used. In an exemplary embodiment, the first and second conductive layers may be a single film of conductive material or two or more mixed films, and may have a one-dimensional or two-dimensional structure. The conductive material may be a metal material, a carbon material, or a polymer material.

In an exemplary embodiment, the first and second conductive layers are formed of a material selected from the group consisting of PEDOT (Poly (3,4-Ethylene Di-Oxythiophene)), PSS (Poly (Styrene- May include at least one selected from the group consisting of a nanowire, a silver mesh, a copper mesh, ITO (Indium Tin Oxide), and ATO (Antimony Tin Oxide).

The adhesive layer 30 may be applied to any adhesive commonly used in the related art. In an exemplary embodiment, the adhesive layer 30 may include a crosslinking agent; And an acrylic copolymer containing a crosslinkable functional group. The use of a copolymer containing a functional group can prevent the phenomenon that the cohesive force between the pressure-sensitive adhesives is lowered and the phenomenon of lifting, bubbling, and transferring during the reliability evaluation. As the functional group, it is preferable to use a carboxyl group alone, a hydroxyl group alone, or a monomer containing a combination of a carboxyl group and a hydroxyl group. More preferably, a monomer using only a hydroxyl group is used. The use of a monomer containing only a hydroxyl group can prevent the problem of corrosion and oxidization of the attachment surface due to strong reactivity of the functional group and adversely affecting the reliability of the product. On the other hand, a cross-linking agent having reactivity with a hydroxyl group can be used for the purpose of enhancing cohesion and durability in a copolymer structure. As the crosslinking agent, compounds such as diisocyanate, tetrafunctional epoxide, metal chelate, amine, amide and the like can be used. Among them, it is preferable to use an isocyanate compound having a hexamethylene diisocyanate (HMDI) structure capable of maintaining the transparency of the pressure-sensitive adhesive and having various surface layers and excellent adhesion.

In an exemplary embodiment, the cross-linking agent can be reacted with the adhesive layer functionalities to have a gel fraction of 60% or more, more preferably 60 to 80%. The higher the gel fraction, the better the cohesive strength and heat resistance of the adhesive layer, which is superior in terms of physical properties. However, if the adhesive layer is too hard at a gel fraction of more than 80%, bubbling and tunneling may occur during storage under high temperature and high humidity conditions.

In an exemplary embodiment, the acrylic copolymer may be prepared from an acrylate monomer having 4 to 20 carbon atoms with transparency secured. As a result of copolymerization using monomers having 20 or less carbon atoms, a sterically hindrance due to p-orbital interference is generated to increase the proportion of unreacted monomers, which causes problems such as bubbles and unevenness in adhesion reliability Can be prevented. In addition, by using monomers having four or more carbon atoms, it is possible to prevent vaporization from occurring easily, which may cause copolymer unbalance and safety problems due to an increase in internal pressure.

In an exemplary embodiment, the pressure sensitive adhesive composition may further comprise a silane coupling agent. As the silane coupling agent, a silane coupling agent containing an epoxy group can be used. The epoxy group of the silane coupling agent is bonded to the reactive group of the copolymer, and the alkoxysilane portion is bonded to the adherend to which the adhesive is applied, thereby improving the adhesion stability and preventing the adhesive strength from dropping if left for a long time under high temperature and high humidity conditions.

In addition, in an exemplary embodiment, the pressure-sensitive adhesive composition may further contain a plasticizer, an epoxy resin, a curing agent, or the like for a specific purpose. An ultraviolet stabilizer, an antioxidant, or the like may be further added for general purposes.

In a non-limiting example, the pressure-sensitive adhesive layer 30 may include 0.1 to 0.3 parts by weight of an isocyanate-based curing agent and 0.01 to 1.0 part by weight of a silane coupling agent based on 100 parts by weight of the acrylic pressure-sensitive adhesive composition. Further, 0.1 to 2.0 parts by weight of an epoxy curing agent may be added to 100 parts by weight of the acrylic pressure-sensitive adhesive composition.

In an exemplary embodiment, the molecular weight of the pressure-sensitive adhesive may be about 70 to 1.5 million, and the glass transition temperature (Tg) may be -50 to -10 ° C. If the glass transition temperature is too low, the cohesive force of the pressure-sensitive adhesive may be lowered, and if the glass transition temperature is too high, the pressure-sensitive adhesive property with the adherend may be lowered.

In an exemplary embodiment, the application amount of the adhesive layer 30 may be 5 to 50 g / m 2 , or 10 to 20 g / m 2 . When the application amount is less than 5 g / m 2 , the adhesive force is remarkably lowered, which may result in lifting problems in the reliability evaluation. If the application amount is more than 50 g / m 2, the viscoelasticity inherent in the adhesive may cause problems such as compression resistance. The application of the pressure-sensitive adhesive may be carried out by any coating method generally used in the art without limitation, and may be carried out using a die coater, a nip coater, a gravure roll coater, a comma coater or the like.

In an exemplary embodiment, the adhesive layer 30 may have an adhesive force of 1000 to 3000 gf / 25 mm. If the adhesive strength is less than 1000 gf / 25 mm, bubbling and tunneling may occur during storage under high temperature and high humidity conditions in the state adhered to the adherend. Also, if the adhesive force exceeds 3000 gf / 25 mm, it can not be removed when a defect occurs in the laminate with an adherend, which may cause a rise in production cost.

In another aspect, the technique disclosed herein includes an adhesive layer; Based transparent electrode comprising a patterned conductive layer formed on both sides of the adhesive layer.

In an exemplary embodiment, the transparent conductive film or the transparent electrode may have a total light transmittance of 90% or more, 92% or more, 94% or more, 96% or more, 98% or more, 99% or more or 99.99% or more. In another aspect, the transparent conductive film or the transparent electrode may have a haze of 0.15% or less. In another aspect, the transparent conductive film or the transparent electrode may have a thickness of 5 to 100 μm, 5 to 90 μm, 5 to 80 μm, 5 to 70 μm, 5 to 60 μm, or 5 to 50 μm.

In the case of a conventional sensor for a conventional touch panel, two PET films having a conductive layer formed thereon are overlaid. The light transmittance of the PET film itself is in the range of 90 to 92%, which is 92% of 92% %, And when the thickness of the PET film itself is in the range of 50 to 125 占 퐉, the thickness of the PET film becomes 100 占 퐉 or more when two sheets are stacked together. On the other hand, The above disadvantages can be solved and the thickness and the light transmission loss can be reduced.

2 is a schematic view showing a method of manufacturing a conductive film and an implementation method thereof according to an exemplary embodiment of the present disclosure;

(1) forming a first conductive layer on a first release layer of a first release film on which a first base film and a first release layer are laminated; (2) forming a second conductive layer on the second release layer of the second release film in which the second base film and the second release layer are laminated; (3) forming an adhesive layer on the first conductive layer; And (4) laminating a second conductive layer formed on the second release film with an adhesive layer. The present invention also provides a method for manufacturing a transparent conductive film of a non-substrate type detach system.

In an exemplary embodiment, the peeling force of the first release film may be lower than the peeling force of the second release film.

In an exemplary embodiment, the method may further comprise (after step (4), (5) removing the first release film and then removing the second release film.

Hereinafter, the present invention will be described in more detail with reference to Examples. It is to be understood by those skilled in the art that these embodiments are merely illustrative of the present invention and that the scope of the present invention is not construed as being limited by these embodiments.

Example 1.

1 part by weight of a curing agent and 300 parts by weight of an organic solvent were blended with 100 parts by weight of a melamine resin on one surface of a first base film (thickness 75 탆) of polyethylene terephthalate to form a first release layer (thickness 0.7 탆) To prepare a first release film. Next, a first conductive layer was formed on the first release layer and patterned. The conductive material was PEDOT: PSS, and the conductive layer was formed to a thickness of 100 nm.

On the other hand, 1 part by weight of a curing agent and 600 parts by weight of an organic solvent were added to 100 parts by weight of a silicone release agent on a surface of a second base film (thickness: 100 mu m) which was polyethylene terephthalate separately and a second release layer ) Was formed and a second release film was produced. Next, a second conductive layer was formed on the second release layer and patterned. The conductive material was PEDOT: PSS, and the conductive layer was formed to a thickness of 100 nm.

Then, 0.2 part by weight of an isocyanate curing agent and 50 parts by weight of an organic solvent were added to 100 parts by weight of an acrylic copolymer containing a hydroxyl group functional group on the formed first conductive layer to form a pressure-sensitive adhesive layer having a thickness of 10 탆, A second conductive layer formed on the second release film was laminated with an adhesive layer to prepare a transparent conductive film of a non-substrate type detachment type.

Thereafter, after removing the first release film, the second release film was removed to obtain a transparent electrode of a non-substrate type having a thin thickness and excellent optical characteristics.

Experimental example.

The properties of the above-mentioned samples were measured in the following manner.

First, the peeling force and adhesive force were measured.

Specifically, the prepared sample samples were cut in the machine direction to a width of 25 mm x 250 mm in length. The samples were peeled off at a peeling rate of 300 m / min using a peel test method using an adhesive force measuring device (CKP-5000) to measure a first type peel force. The specimens were laminated to a TESA 7475 tape using an automatic joining machine (2 kg load) and stored at 25 ± 2 ° C for 30 minutes. Similarly, the second type peel force was measured while peeling off with a peeling speed of 300 m / min by a 180 ° peel test method using an adhesive force measuring device (CKP-5000). The test specimens were laminated to a TESA 7475 tape using an automatic pestle (2 kg load) and stored at 25 ± 2 ° C for 30 minutes. The adhesive strength was measured while peeling off at a peeling speed of 300 m / min using a peel test method using an adhesive force measuring device (CKP-5000).

On the other hand, the haze and total light transmittance of the samples of Example 1 were measured, and the high temperature and high humidity reliability was evaluated.

Haze was measured with an NDH2000 instrument using the JIS K7136 standard. The haze (%) was evaluated to be "very good" below 0.15%.

The total light transmittance was measured by NDH2000 instrument using JIS K7361 standard. And the light transmittance of 99% or more was evaluated as "very good ".

In the high temperature and high humidity reliability evaluation, samples were left for 72 hours at 85 ° C and 85% RH. Then, the surface of the specimens was cut with a knife at intervals of 1 mm, The adhesion between the conductive layer and the adhesive layer interface was evaluated. It was evaluated as "very good" that no desorption between the conductive layer and the adhesive layer interface occurred at all. In addition, the occurrence of desorption at a part between the conductive layer and the adhesive layer interface was evaluated as "normal ".

As a result, it was confirmed that the transparent electrode of Example 1 exhibited excellent optical characteristics and reduced thickness while maintaining conductivity.

The peel force of the first release film of the conductive film according to exemplary embodiments of the present disclosure was found to be lower than that of the second release film. Specifically, when the peeling force of the first release film was P1 and the peeling force of the second release film was P2, P2 / P1 showed a value between 2.0 and 5.0. Thus, when P2 / P1 is 2.0 to 5.0, defects such as lifting and tunneling are prevented. It is possible to protect the conductive layer or the adhesive layer and to prevent the problem that the adhesive layer may peel off when the first release film is peeled off.

The double-sided transparent electrode according to the exemplary embodiments of the present disclosure can be thinned as compared with the conventional method and can realize a reduced thickness. The light transmittance was "very good" with 99% or more, and the haze (%) was also "excellent" Therefore, it can be confirmed that the embodiments have excellent optical characteristics.

On the other hand, it has been confirmed that the transparent electrode according to exemplary embodiments of the present invention exhibits "excellent" in the evaluation of high temperature and high humidity reliability, and thus shows excellent high temperature and high humidity reliability.

Having described specific portions of the present invention in detail, it will be apparent to those skilled in the art that this specific description is only a preferred embodiment and that the scope of the present invention is not limited thereby. It will be obvious. Accordingly, the actual scope of the present invention will be defined by the appended claims and their equivalents.

10: first release film 11: first base film
12: first release layer 20: first conductive layer
30: adhesive layer 40: second conductive layer
50: second release film 51: second base film
52: second release layer

Claims (14)

A first release film;
A patterned first conductive layer located on one side of the first release film;
An adhesive layer disposed on one surface of the first conductive layer;
A patterned second conductive layer located on one side of the adhesive layer; And
And a second release film located on one side of the second conductive layer,
Wherein the first release film comprises a first base film and a first release layer in contact with the first conductive layer,
Wherein the second release film comprises a second base film and a second release layer in contact with the second conductive layer,
The thickness of the first and second conductive layers is 50 nm to 1 占 퐉, respectively,
The first and second conductive layers may be formed of at least one material selected from the group consisting of PEDOT (Poly (3,4-Ethylene Di-Oxythiophene), PSS (Poly (Styrene-Sulfonate), polyaniline, carbon nanotube, graphene, , At least one selected from the group consisting of a mesh, a copper mesh, ITO (Indium Tin Oxide), and ATO (Antimony Tin Oxide)
The peeling force of the first release film is lower than the peeling force of the second release film,
The peeling force between the adhesive layer and the second conductive layer is higher than the peeling force between the second conductive layer and the second release film,
Wherein the pressure-sensitive adhesive layer is formed from an acrylic copolymer containing a hydroxyl group functional group, an isocyanate-based curing agent, and an organic solvent, and the application amount of the pressure-sensitive adhesive layer is 5 to 50 g / m 2 detach type transparent conductive film.
delete The method according to claim 1,
Wherein the P2 / P1 is 2.0 to 5.0 when the peeling force of the first release film is P1 and the peeling force of the second release film is P2.
The method of claim 3,
Wherein the first release film has a peel force of 1 to 5 gf / 25 mm and the second release film has a peel force of 2 to 30 gf / 25 mm.
The method according to claim 1,
Wherein the first release layer comprises a melamine-based or acrylic release agent, and the second release layer comprises a silicone-based release agent.
delete delete delete delete The method according to claim 1,
Wherein the adhesive layer has an adhesive force of 1000 to 3000 gf / 25 mm. The transparent conductive film of the non-substrate type detach type.
delete (1) forming a patterned first conductive layer on a first release layer of a first release film on which a first base film and a first release layer are laminated;
(2) forming a patterned second conductive layer on the second release layer of the second release film having the second base film and the second release layer laminated thereon;
(3) forming an adhesive layer on the first conductive layer; And
(4) laminating a second conductive layer formed on the second release film with an adhesive layer,
The thickness of the first and second conductive layers is 50 nm to 1 占 퐉, respectively,
The first and second conductive layers may be formed of at least one material selected from the group consisting of PEDOT (Poly (3,4-Ethylene Di-Oxythiophene), PSS (Poly (Styrene-Sulfonate), polyaniline, carbon nanotube, graphene, , At least one selected from the group consisting of a mesh, a copper mesh, ITO (Indium Tin Oxide), and ATO (Antimony Tin Oxide)
The peeling force of the first release film is lower than the peeling force of the second release film,
The peeling force between the adhesive layer and the second conductive layer is higher than the peeling force between the second conductive layer and the second release film,
Wherein the pressure-sensitive adhesive layer is formed from an acrylic copolymer containing a hydroxyl group functional group, an isocyanate-based curing agent, and an organic solvent, and the application amount of the pressure-sensitive adhesive layer is 5 to 50 g / m 2 detach type transparent conductive film.
delete 13. The method of claim 12,
The transparent conductive film manufacturing method may further include the steps of (4): (5) removing the first release film and removing the second release film to form an adhesive layer; And a patterned conductive layer formed on both sides of the adhesive layer to produce a transparent conductive film of a non-substrate type. The method of manufacturing a transparent conductive film of a non-substrate type detach type.
KR1020150180319A 2015-12-16 2015-12-16 Non-substrate type transparent conductive films using detach manner and method for manufacturing the same KR101803884B1 (en)

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KR102262695B1 (en) * 2018-11-22 2021-06-08 주식회사 엘지화학 Foldable backplate, manufacturing method of foldable backplate and foldable display device comprising the same

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KR101425573B1 (en) * 2013-05-02 2014-08-05 서상영 Protection film for mobile terminal and method for manufacturing the same
KR101530591B1 (en) * 2014-04-07 2015-06-22 율촌화학 주식회사 Non-substrate type adhesive tape for transper printing and preparation method thereof

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KR101425573B1 (en) * 2013-05-02 2014-08-05 서상영 Protection film for mobile terminal and method for manufacturing the same
KR101530591B1 (en) * 2014-04-07 2015-06-22 율촌화학 주식회사 Non-substrate type adhesive tape for transper printing and preparation method thereof

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