KR20220049046A - Resin composition, light-blocking film, method for producing light-blocking film, and substrate having partitioning wall attached thereto - Google Patents

Abstract

A resin composition comprising a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium, a photoinitiator or a quinonediazide compound, and a solvent. The resin composition which forms the partition which made the high reflectance and high light-shielding property compatible also in the heating conditions of 250 degrees C or less is provided.

Description

A resin composition, a light-shielding film, a method for manufacturing a light-shielding film, and a substrate with barrier ribs TECHNICAL FIELD

The present invention relates to a resin composition, a light-shielding film formed of the resin composition, a method for manufacturing the light-shielding film, and a substrate with barrier ribs having a pattern-formed barrier rib.

DESCRIPTION OF RELATED ART Generally, color display is performed using the liquid crystal display device which is a type of image display device using white light sources, such as LED, and the color filter which selectively passes red, green, and blue. However, color display using such a color filter has poor light utilization efficiency and has a problem in color reproducibility.

Then, as a color display device with high light utilization efficiency, the color display device provided with the wavelength conversion part containing the fluorescent substance for wavelength conversion, and a polarization splitting means and a polarization conversion means is proposed (for example, patent document 1) reference). For example, a blue light source, a liquid crystal element, a phosphor that is excited by blue light to emit red fluorescence, a phosphor that is excited by blue light to emit green fluorescence, and a wavelength converter having a light scattering layer for scattering blue light. A color display device is proposed (for example, refer patent document 2).

However, since the color filter containing the color conversion fluorescent substance as described in patent documents 1 and 2 generate|occur|produces fluorescence in all directions, the light extraction efficiency is low and the brightness|luminance is inadequate. In particular, in high-definition display devices called 4K and 8K, since the pixel size becomes small, the subject of luminance becomes remarkable, so that a higher luminance is calculated|required.

Japanese Patent Laid-Open No. 2000-131683 Japanese Patent Laid-Open No. 2009-244383 Japanese Patent Laid-Open No. 2000-347394 Japanese Patent Laid-Open No. 2006-259421

In order to improve the luminance of the display device, it is effective to increase the reflectance of the barrier rib separating the color conversion phosphor. In addition, in order to prevent light mixing between adjacent pixels, it is necessary to increase the light-shielding property of the barrier ribs. As mentioned above, the barrier rib material which made high reflectance and light-shielding property compatible is calculated|required.

The inventors first studied a method of using a material obtained by adding a black pigment to a white barrier rib material having a high reflectance to form a barrier rib having both high reflectance and light blocking properties. However, in this method, light is absorbed by a white pigment and a black pigment at the time of exposure, light does not reach the bottom of a film|membrane, and the subject that pattern workability is bad became clear.

On the other hand, as described in Patent Documents 3 and 4, a technique of blackening by baking after pattern formation is proposed by adding a specific metal compound. However, these blackening techniques required baking at 400 degreeC or more, and there existed a subject that light-shielding property did not improve by heating at 250 degrees C or less.

Then, an object of this invention is to provide the resin composition which can form the partition which made the high reflectance and light-shielding property compatible also in heating conditions of 250 degrees C or less.

The present invention is a resin composition comprising a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium, a photoinitiator or a quinonediazide compound, and a solvent.

Although the resin composition of the present invention allows light to pass in the process of pattern exposure after film formation, the light-shielding property increases after heating the exposed film to a temperature of 120° C. or more and 250° C. or less. Therefore, high reflectance even under heating conditions of 250° C. or less. It is possible to form a fine thick film barrier rib pattern with high light blocking properties.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows one aspect of the board|substrate with partitions of this invention which has a pattern-formed partition.
Fig. 2 is a cross-sectional view showing one aspect of a substrate with barrier ribs of the present invention having a pattern-formed barrier rib and a pixel containing a color conversion luminescent material.
3 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a low refractive index layer.
Fig. 4 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a low refractive index layer and an inorganic protective layer I.
Fig. 5 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a low refractive index layer and an inorganic protective layer II.
6 is a cross-sectional view showing an embodiment of a substrate with partition walls of the present invention having a color filter.
7 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a color filter and an inorganic protective layer III and/or a yellow organic protective layer.
Fig. 8 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a color filter and an inorganic protective layer IV and/or a yellow organic protective layer.
Fig. 9 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a light-shielding barrier rib.
10 is a cross-sectional view showing the configuration of a display device used for color mixture evaluation in Examples.

Hereinafter, although the resin composition which concerns on this invention, the light-shielding film formed from the resin composition, the manufacturing method of a light-shielding film, and suitable embodiment of a board|substrate with a barrier rib are described concretely, this invention is not limited to the following embodiment, The objective and It can be changed and implemented in various ways depending on the use.

The resin composition of this invention can be used suitably as a material for forming the partition which separates a color conversion phosphor. The resin composition of the present invention comprises a resin and an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium (hereinafter, sometimes referred to as "organometallic compound"); It is preferable to contain a photoinitiator or a quinonediazide compound, and a solvent.

The resin has a function of improving the crack resistance and light resistance of the partition wall. From a viewpoint of improving the crack resistance of the partition in heat processing, 10 weight% or more is preferable and, as for content of resin which occupies in solid content of a resin composition, 20 weight% or more is more preferable. On the other hand, from a viewpoint of improving light resistance, 60 weight% or less is preferable and, as for content of resin which occupies in solid content of a resin composition, 50 weight% or less is more preferable. Here, solid content means all the components except volatile components, such as a solvent, among the components contained in a resin composition. The quantity of solid content can be calculated|required by counting the remainder which heated the resin composition and evaporated the volatile component.

As resin, polysiloxane, a polyimide, a polyimide precursor, polybenzoxazole, a polybenzoxazole precursor, a (meth)acrylic polymer etc. are mentioned, for example. Here, a (meth)acrylic polymer means the polymer of methacrylic acid ester and/or an acrylic acid ester. You may contain these 2 or more types. Among these, polysiloxane is preferable at the point excellent in transparency, heat resistance, and light resistance.

Polysiloxane is a hydrolysis/dehydration condensate of organosilane. When the resin composition of this invention has negative photosensitivity, it is preferable that polysiloxane contains the repeating unit represented by following General formula (2) at least. In addition, you may include another repeating unit. By including the repeating unit derived from the bifunctional alkoxysilane compound represented by General formula (2), excessive thermal polymerization (condensation) of polysiloxane by heating can be suppressed and the crack resistance of a partition can be improved. It is preferable to contain 10-80 mol% of repeating units represented by General formula (2) in all the repeating units in polysiloxane. By including 10 mol% or more of the repeating unit represented by General formula (2), crack resistance can be improved more. 15 mol% or more is more preferable, and, as for content of the repeating unit represented by General formula (2), 20 mol% or more is still more preferable. On the other hand, by including 80 mol% or less of the repeating unit represented by the general formula (2), the molecular weight of the polysiloxane during polymerization can be sufficiently increased to improve the coating properties. As for content of the repeating unit represented by General formula (2), 70 mol% or less is more preferable.

In the said General formula (2), R< ¹ > and R< ² > may respectively be same or different, and represents a C1-C20 monovalent organic group. R ¹ and R ² are preferably a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms from the viewpoint of facilitating adjustment of the molecular weight of the polysiloxane during polymerization. However, in an alkyl group and an aryl group, at least one part of the hydrogen may be substituted by the radically polymerizable group. In this case, in the hardened|cured material of the negative photosensitive resin composition, the radically polymerizable group may be radically polymerized.

When the resin composition of the present invention has negative photosensitivity, it is preferable that the polysiloxane further contains a repeating unit selected from a repeating unit represented by the following general formula (3) and a repeating unit represented by the following general formula (4). . The refractive index of polysiloxane is reduced by including the repeating unit derived from a fluorine-containing alkoxysilane compound represented by General formula (3) or General formula (4), When it contains the white pigment mentioned later, refractive index with a white pigment By expanding the difference, the interfacial reflection can be further improved, and the reflectance can be further improved. It is more preferable to contain in polysiloxane 20-80 mol% in total of the repeating unit selected from the repeating unit represented by General formula (3) and the repeating unit represented by General formula (4). By including 20 mol% or more in total of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), the interfacial reflection between the polysiloxane and the white pigment is further improved when a white pigment described later is contained. Thus, the reflectance can be further improved. As for the total content of the repeating unit represented by General formula (3) and the repeating unit represented by General formula (4), 40 mol% or more is more preferable. On the other hand, by including a total of 80 mol% or less of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), excessive hydrophobization of the polysiloxane is suppressed, and compatibility with other components in the composition is improved and improve the resolution. As for the total content of the repeating unit represented by General formula (3) and the repeating unit represented by General formula (4), 70 mol% or less is more preferable. In addition, you may include another repeating unit.

In the general formulas (3) and (4), R ³ represents an alkyl group, alkenyl group, aryl group or arylalkyl group having 1 to 10 carbon atoms in which all or part of hydrogen is substituted with fluorine. R ⁴ represents a single bond, -O-, -CH ₂ -CO-, -CO- or -O-CO-. R ⁵ represents a monovalent organic group having 1 to 20 carbon atoms. R ³ is preferably an alkyl group having 1 to 6 carbon atoms in which all or part of hydrogen is substituted with fluorine from the viewpoint of further reducing the refractive index of polysiloxane. In addition, in the photocured material of the negative photosensitive resin composition, the alkenyl group may be radically superposed|polymerized.

The repeating units represented by the general formulas (2) to (4) are derived from the alkoxysilane compounds represented by the following general formulas (5) to (7), respectively. That is, the polysiloxane containing the repeating unit represented by the general formulas (2) to (4) is hydrolyzed and polycondensed by the alkoxysilane compound containing the alkoxysilane compound represented by the following general formulas (5) to (7). It can be obtained by summing Furthermore, you may use another alkoxysilane compound.

In the general formulas (5) to (7), R ¹ to R ⁵ each represents the same group as R ¹ to R ⁵ in the general formulas (2) to (4). R< ⁶ > may be same or different, and represents a C1-C20 monovalent organic group, and a C1-C6 alkyl group is preferable.

Examples of the alkoxysilane compound represented by the general formula (5) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldimethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, Diphenyldimethoxysilane, diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, Styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ -Acryloylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2 -(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3- Dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 5-dimethylmethoxysilyl Valeric acid, 5-dimethylethoxysilylvaleric acid, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic anhydride, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic anhydride Anhydride, 4-dimethylmethoxysilylbutyric acid, 4-dimethylethoxysilylbutyric acid, etc. are mentioned. You may use these 2 or more types.

Examples of the alkoxysilane compound represented by the general formula (6) include trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, and perfluoropentyltriethoxy. Silane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane, heptadecafluorodecyl Trimethoxysilane, heptadecafluorodecyltriethoxysilane, etc. are mentioned. You may use these 2 or more types.

Examples of the alkoxysilane compound represented by the general formula (7) include bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, bis(trifluoropropyl)diethoxysilane, and trifluoropropylmethyl. Dimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, heptadecafluorodecylmethyldimethoxysilane, etc. are mentioned. You may use these 2 or more types.

As another alkoxysilane compound, For example, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyl trime Toxysilane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-aminopropyltrimethoxysilane, trifunctional alkoxysilane compounds such as 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane; tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane; 3-Glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl) Ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl } Epoxy group or oxetane group-containing alkoxysilane compounds such as oxetane: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane , 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2- aromatic ring-containing alkoxysilane compounds such as phenylethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride; Styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ - radically polymerizable group containing alkoxysilane compounds, such as acryloylpropyltriethoxysilane, (gamma)-methacryloylpropyltrimethoxysilane, and (gamma)-methacryloylpropyltriethoxysilane; 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropyl succinic anhydride, 3-triethoxysilylpropyl succinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic acid anhydride and carboxyl group-containing alkoxysilane compounds such as , 3-trimethoxysilylpropylphthalic anhydride and 3-triethoxysilylpropylphthalic anhydride.

The content of the alkoxysilane compound represented by the general formula (5) in the alkoxysilane compound used as the raw material of the polysiloxane is in the range described above with the content of the repeating unit represented by the general formula (2) in all the repeating units of the polysiloxane. From the viewpoint of On the other hand, 80 mol% or less is preferable from a similar viewpoint, and, as for content of the alkoxysilane compound represented by General formula (5), 70 mol% or less is more preferable. In addition, also with respect to the total content of the alkoxysilane compound represented by the general formulas (6) and (7), the total content of the repeating units represented by the general formulas (3) and (4) in the above-mentioned range From a viewpoint, 20 mol% or more is preferable, and 40 mol% or more is more preferable. On the other hand, 80 mol% or less is preferable from a similar viewpoint, and, as for total content of the alkoxysilane compound represented by General formula (6) and General formula (7), 70 mol% or less is more preferable.

From a viewpoint of applicability|paintability, 1,000 or more are preferable and, as for the weight average molecular weight (Mw) of polysiloxane, 2,000 or more are more preferable. On the other hand, 50,000 or less are preferable and, as for Mw of polysiloxane from a developable viewpoint, 20,000 or less are more preferable. Here, Mw of polysiloxane in this invention means the polystyrene conversion value measured by gel permeation chromatography (GPC).

Polysiloxane can be obtained by hydrolyzing the above-mentioned organosilane compound, and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence of a solvent or in the absence of a solvent.

Various conditions in the hydrolysis can be set according to physical properties suitable for the intended use in consideration of the reaction scale, the size and shape of the reaction vessel, and the like. As various conditions, an acid concentration, reaction temperature, reaction time etc. are mentioned, for example.

For the hydrolysis reaction, an acid catalyst such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyhydric carboxylic acid or anhydride thereof, or an ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferable.

When an acid catalyst is used for the hydrolysis reaction, the amount of the acid catalyst added is preferably 0.05 parts by weight or more, based on 100 parts by weight of all alkoxysilane compounds used in the hydrolysis reaction, from the viewpoint of making the hydrolysis proceed faster, and 0.1 A weight part or more is more preferable. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst to be added is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, based on 100 parts by weight of all alkoxysilane compounds. Here, the total amount of an alkoxysilane compound means the quantity containing all the alkoxysilane compound, its hydrolyzate, and its condensate. The same is applied below.

The hydrolysis reaction can be carried out in a solvent. The solvent may be appropriately selected in consideration of stability, wettability, volatility, and the like of the resin composition.

When the solvent is produced by the hydrolysis reaction, it is also possible to perform the hydrolysis in the absence of a solvent. When using for a resin composition, it is also preferable to adjust a resin composition to an appropriate density|concentration by further adding a solvent after completion|finish of hydrolysis reaction. In addition, it is also possible to distill or remove all or part of the product alcohol or the like by heating and/or under reduced pressure after hydrolysis, and then adding a suitable solvent.

When using a solvent for a hydrolysis reaction, 50 weight part or more is preferable with respect to 100 weight part of all alkoxysilane compounds from a viewpoint of suppressing the formation of a gel, and, as for the addition amount of a solvent, 80 weight part or more is more preferable. On the other hand, from a viewpoint of advancing hydrolysis more quickly, 500 weight part or less is preferable with respect to 100 weight part of all alkoxysilane compounds, and, as for the addition amount of a solvent, 200 weight part or less is more preferable.

Moreover, as water used for a hydrolysis reaction, ion-exchange water is preferable. Although the amount of water can be set arbitrarily, 1.0-4.0 mol is preferable with respect to 1 mol of all alkoxysilane compounds.

As a method of a dehydration condensation reaction, the method of heating the silanol compound solution obtained by the hydrolysis reaction of an organosilane compound as it is, etc. are mentioned, for example. The heating temperature is preferably 50°C or higher and the solvent boiling point or lower, and the heating time is preferably 1 to 100 hours. Moreover, in order to raise the polymerization degree of polysiloxane, you may perform reheating or addition of a base catalyst. In addition, according to the purpose, after the dehydration condensation reaction, an appropriate amount of the product alcohol or the like may be distilled out and removed under heating and/or reduced pressure, and then a suitable solvent may be added.

It is preferable that the said catalyst is not contained in the siloxane resin solution after hydrolysis and dehydration condensation from a viewpoint of storage stability of a resin composition, and the catalyst can be removed as needed. As a catalyst removal method, water washing, treatment with an ion exchange resin, etc. are preferable from a viewpoint of simplification of operation and removability. Water washing is a method of diluting a polysiloxane solution with an appropriate hydrophobic solvent, washing with water several times, and then concentrating the obtained organic layer with an evaporator or the like. The treatment with an ion exchange resin is a method in which a polysiloxane solution is brought into contact with an appropriate ion exchange resin.

The organometallic compound becomes black particles or yellow particles by decomposition and aggregation in the exposure step and/or heating step during pattern formation of the partition wall A-1 to be described later, and It has a function of improving an OD value. Since the OD value is low before exposure and the OD value rises after pattern formation, in the exposure step, the exposed light can be sufficiently transmitted to the bottom to be photocured or photodecomposed. For example, in the case of a resin composition having negative photosensitivity, in order to form a partition wall (A-1) having a high OD value, if a pattern is formed in advance using a resin composition containing a large amount of black pigment, The photocuring tends to be insufficient. As a result, the shape of the obtained partition wall A-1 tends to become an inverted taper type. When pattern formation is carried out using the resin composition of this invention containing the above-mentioned organometallic compound, since it fully photocures to a bottom part, a taper angle can be easily made into the preferable range mentioned later.

Examples of the organometallic compound include organometallic compounds containing silver such as silver neodecanoate, silver octylate, and silver salicylate; organometallic compounds containing gold such as chloro(triphenylphosphine)gold and tetrachloroauric acid tetrahydrate; organometallic compounds containing platinum, such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; Organometallic compounds containing palladium, such as bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylideneacetonepalladium and the like. You may contain these 2 or more types.

Among these, when silver neodecanoate contains an organometallic compound containing silver such as silver octylate or silver salicylate, it becomes black by decomposition and agglomeration in the exposure step, and becomes yellow by further decomposition and agglomeration in the subsequent heating step. do.

On the other hand, platinum-containing organometallic compounds such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; an organometallic compound selected from palladium such as bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylideneacetonepalladium; When it contains, it will blacken by decomposing|disassembling and aggregating in an exposure process and/or a heating process.

Among these, organic metals selected from bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium and tetrakis(triphenylphosphine)palladium from the viewpoint of further improving the OD value. compounds are preferred.

The resin composition of this invention WHEREIN: As for content of the organometallic compound which occupies in solid content, 0.2 to 5 weight% is preferable. By making content of an organometallic compound into 0.2 weight% or more, the OD value of the partition obtained can be improved more. As for content of an organometallic compound, 1.5 weight% or more is more preferable. On the other hand, when content of an organometallic compound shall be 5 weight% or less, a reflectance can be improved more.

When the resin composition of this invention is used for pattern formation of the partition (A-1) mentioned later, it is preferable to have negative-type or positive-type photosensitivity. When providing negative photosensitivity, it is preferable to contain a photoinitiator, and a high-definition patterned partition can be formed. It is preferable that the negative photosensitive resin composition further contains a photopolymerizable compound. On the other hand, when providing positive photosensitivity, it is preferable to contain a quinonediazide compound.

The photoinitiator may be any as long as it decomposes and/or reacts with irradiation of light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine α-aminoalkylphenone compounds such as -4-yl-phenyl)-butan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) )-Acyl phosphine oxide compounds such as phosphine oxide; 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone-1- oxime ester compounds such as [9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime); benzyl ketal compounds such as benzyl dimethyl ketal; 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxye ?-hydroxyketone compounds such as oxy)phenyl-(2-hydroxy-2-propyl)ketone and 1-hydroxycyclohexyl-phenylketone; Benzophenone, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4,4-dichlorobenzophenone, hydroxy benzophenone compounds such as benzophenone, 4-benzoyl-4'-methyl-diphenylsulfide, alkylated benzophenone, and 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone; acetophenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, and 4-azidebenzalacetophenone; aromatic keto ester compounds such as 2-phenyl-2-oxymethyl acetate; Benzoic acid ester compounds, such as 4-dimethylamino benzoate ethyl, 4-dimethylamino benzoic acid (2-ethyl) hexyl, 4-diethyl amino benzoate ethyl, and 2-benzoyl methyl benzoate, etc. are mentioned. You may contain these 2 or more types.

From a viewpoint of advancing radical hardening effectively, 0.01 weight% or more is preferable in solid content, and, as for content of the photoinitiator in the resin composition of this invention, 1 weight% or more is more preferable. On the other hand, from a viewpoint of suppressing the elution etc. of the remaining photoinitiator and improving yellowing more, 20 weight% or less is preferable in solid content, and, as for content of a photoinitiator, 10 weight% or less is more preferable.

The photopolymerizable compound in this invention means the compound which has two or more ethylenically unsaturated double bonds in a molecule|numerator. Considering the easiness of radical polymerization, it is preferable that a photopolymerizable compound has a (meth)acryl group.

Examples of the photopolymerizable compound include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. Krylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacrylic rate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1 , 10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, Dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erythritol undecaacrylate, pentapentaerythritol dodecaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nona methacrylate, tetrapentaerythritol decamethacrylate rate, pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, dimethylol-tricyclodecane diacrylate, and the like. You may contain these 2 or more types.

As for content of the photopolymerizable compound in the resin composition of this invention, 1 weight% or more is preferable in solid content from a viewpoint of advancing radical hardening effectively. On the other hand, as for content of a photopolymerizable compound from a viewpoint of suppressing the excessive reaction of radicals and improving resolution, 40 weight% or less in solid content is preferable.

As a quinonediazide compound, the compound which the sulfonic acid of naphthoquinonediazide couple|bonded with the compound which has a phenolic hydroxyl group by ester is preferable. Examples of the compound having a phenolic hydroxyl group used herein include BIs-Z, TekP-4HBPA (tetrakis P-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, BIsRS-3P (above, trade names). , Honshu Chemical Co., Ltd.), BIR-PC, BIR-PTBP, BIR-BIPC-F (above, trade name, manufactured by Asahi Yukizai Kogyo Co., Ltd.), 4,4'-sulfonyldiphenol, BPFL ( A brand name, JFE Chemical Co., Ltd. product) etc. are mentioned. As a quinonediazide compound, what introduce|transduced 4-naphthoquinonediazidesulfonic acid or 5-naphthoquinonediazidesulfonic acid by ester bond to these compounds which have a phenolic hydroxyl group is preferable, for example, THP-17, TDF- 517 (trade name, Toyo Kosei Kogyo Co., Ltd. product), SBF-525 (trade name, AZ Electronic Materials Co., Ltd. product) etc. are mentioned.

From a viewpoint of improving a sensitivity, 0.5 weight% or more is preferable in solid content, and, as for content of the quinonediazide compound in the resin composition of this invention, 1 weight% or more is more preferable. On the other hand, from a viewpoint of improving a resolution, 25 weight% or less is preferable in solid content, and, as for content of a quinonediazide compound, 20 weight% or less is more preferable.

A solvent adjusts the viscosity of a resin composition to the range suitable for application|coating, and has a function which improves the uniformity of a partition. As a solvent, it is preferable to combine the solvent whose boiling point under atmospheric pressure is more than 150 degreeC and 250 degrees C or less, and the solvent which is 150 degrees C or less.

Examples of the solvent include alcohols such as ethanol, propanol, isopropanol, and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; ketones such as methyl ethyl ketone, acetyl acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; Ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate , acetates such as butyl lactate; Aromatic or aliphatic hydrocarbons, such as toluene, xylene, hexane, and cyclohexane, (gamma)-butyrolactone, N-methyl- 2-pyrrolidone, dimethyl sulfoxide, etc. are mentioned. You may contain these 2 or more types. Among these, it is preferable to combine diacetone alcohol as a solvent whose boiling point under atmospheric pressure exceeds 150 degreeC and 250 degrees C or less from a viewpoint of applicability|paintability, and propylene glycol monomethyl ether as a solvent which is 150 degrees C or less.

The content of the solvent can be arbitrarily set according to the application method or the like. For example, when film-forming by spin coating, it is common to make content of a solvent into 50 weight% or more and 95 weight% or less in a resin composition.

It is preferable that the resin composition of this invention further contains the coordination compound (Hereinafter, it may describe as "coordination compound") which has a phosphorus atom. The coordination compound can coordinate with the organometallic compound in the resin composition, improve the solubility of the organometallic compound in a solvent, promote decomposition of the organometallic compound, and further improve the OD value of the obtained partition wall. Examples of the coordination compound include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, and tri(2-furyl)phosphine. phine, tris(1-adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, tris(O-tolyl)phosphine, and the like. You may contain these 2 or more types. As for content of the coordination compound in the resin composition of this invention, 0.5-3.0 molar equivalent is preferable with respect to an organometallic compound.

It is preferable that the resin composition of this invention contains a white pigment and/or a black pigment further. The white pigment has a function of further improving the reflectance of the barrier rib. The black pigment has a function of adjusting the OD value.

As a white pigment, titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, these complex compounds, etc. are mentioned, for example. You may contain these 2 or more types. Among these, titanium dioxide with high reflectance and easy industrial use is preferable.

The crystal structure of titanium dioxide is classified into anatase type, rutile type and brookite type. Among these, a rutile-type titanium oxide is preferable at the point with low photocatalytic activity.

The white pigment may be surface-treated. Surface treatment with a metal selected from Al, Si and Zr is preferable, and the light resistance and heat resistance of the formed partition wall can be improved.

As for the median diameter of a white pigment, 100-500 nm is preferable from a viewpoint of improving the reflectance of a partition more. Here, the median diameter of the white pigment can be calculated from the particle size distribution measured by the laser diffraction method using a particle size distribution analyzer (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

As a titanium dioxide pigment preferably used as a white pigment, For example, R960; DuPont Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle diameter 210 nm), CR-97; Ishihara Sangyo Co., Ltd. product (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter of 250 nm), JR-301; Teika Co., Ltd. product (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 300 nm), JR-405; Teika Co., Ltd. product (rutile type, Al ₂ O ₃ treatment, average primary particle diameter of 210 nm), JR-600A; Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter of 250 nm), JR-603; Teika Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter of 280 nm), etc. are mentioned. You may contain these 2 or more types.

From a viewpoint of improving a reflectance more, 20 weight% or more in solid content is preferable, and, as for content of the white pigment in a resin composition, 30 weight% or more is more preferable. On the other hand, from a viewpoint of improving the surface smoothness of a partition, 60 weight% or less in solid content is preferable and, as for content of a white pigment, 55 weight% or less is more preferable.

As a black pigment, a black organic pigment, a mixed color organic pigment, a black inorganic pigment, etc. are mentioned, for example.

As a black organic pigment, carbon black, perylene black, aniline black, a benzofuranone type pigment etc. are mentioned, for example. These may be coat|covered with resin.

Examples of the mixed color organic pigment include those obtained by mixing two or more types of pigments selected from red, blue, green, purple, yellow, magenta, and cyan, and the like, followed by pseudo blackening. Among these, the mixed pigment of a red pigment and a blue pigment is preferable from a viewpoint of making compatible high OD value and pattern workability suitably among these. 20/80-80/20 are preferable and, as for the weight ratio of the red pigment and blue pigment in a mixed pigment, 30/70-70/30 are more preferable. If the specific example of a typical pigment is represented by a color index (CI) number, the following will be mentioned. As a red pigment, it is pigment red (it abbreviates to PR hereafter) 9, PR48, PR97, PR122, PR123, PR144, PR149, PR166, PR168, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, for example. , PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, and the like. You may contain these 2 or more types. As a blue pigment, Pigment Blue (it abbreviates to PB hereafter) 15, PB15:3, PB15:4, PB15:6, PB22, PB60, PB64 etc. are mentioned, for example. You may contain these 2 or more types.

Examples of the black inorganic pigment include graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal complex oxide; metal sulfides; metal nitride; metal oxynitrides; metal carbides and the like. You may contain these 2 or more types.

Among the above black pigments, a pigment selected from titanium nitride, zirconium nitride, carbon black, and mixed pigments having a weight ratio of 20/80 to 80/20 of a red pigment and a blue pigment is preferable from the viewpoint of having high light-shielding properties. In addition, from the viewpoint of easy adjustment of the taper angle of the partition wall (A-1) to a preferable range described later, a pigment selected from titanium nitride, zirconium nitride, and mixed pigments having a weight ratio of red pigment and blue pigment of 20/80 to 80/20 is more preferable.

The content of the black pigment in the resin composition adjusts the reflectance and OD to the above-mentioned ranges, and from the viewpoint of further suppressing the color mixture of light in the adjacent pixel, 0.01% by weight or more in solid content is preferable, and 0.05% by weight or more more preferably. On the other hand, from a viewpoint of adjusting a reflectance and OD to the above-mentioned range, 5 weight% or less in solid content is preferable and, as for content of a black pigment, 3 weight% or less is more preferable.

It is preferable that the resin composition of this invention contains a photobase generator further. By containing a photobase generator, a base is generated in the exposure step, and from the viewpoint of promoting decomposition and aggregation of the organometallic compound in the resin composition, the organometallic compound is more efficiently converted into black particles or yellow particles, obtained by The OD value of the barrier rib can be further improved.

The photobase generator may be any as long as it decomposes and/or reacts with irradiation of light (including ultraviolet rays and electron beams) to generate a base. For example, 2-(9-oxoxanthen-2-yl)propionic acid 1,5,7-triazacyclo[4,4,0]dec-5-ene, N-cyclohexylcarbamic acid 1-(anthra) Quinon-2-yl)ethyl, N,N-diethylcarbamic acid 9-anthrylmethyl, N-cyclohexylcarbamic acid 9-anthrylmethyl, 1-carboxylic acid 9-anthrylmethylpiperidine, N; N-dicyclohexylcarbamic acid 9-anthrylmethyl, N,N-dicyclohexylcarbamic acid 1-(anthraquinon-2-yl)ethyl, cyclohexylammonium propionate 2-(3-benzoylphenyl), butyltriphenyl Boronic acid 1,2-dicyclohexyl-4,4,5,5,-tetramethylbiguanidinium, 2-(3-benzoylphenyl)propionic acid 1,2-diisopropyl-3-[bis(dimethylamino) Methylene] guanidinium, (2-nitrophenyl) methyl 4-hydroxypiperidine-1-carboxylic acid, 2-(3-benzoylphenyl) guanidinium propionate, etc. are mentioned. You may use these 2 or more types.

As for content of the photobase generator in the resin composition of this invention, 0.5 weight% or more in solid content is preferable from a viewpoint of improving OD value more. On the other hand, as for content of a photobase generator, 2.0 weight% or less in solid content is preferable from a viewpoint of improving a resolution.

The resin composition of the present invention may contain a liquid-repellent compound. A liquid-repellent compound is a compound which provides the property (liquid-repellent performance) of repelling water and an organic solvent to a resin composition. Although it will not specifically limit if it is a compound which has such a property, Specifically, the compound which has a fluoroalkyl group is used preferably. By containing a liquid-repellent compound, liquid-repellent performance can be provided to the top part of a partition after the partition A-1 is formed. Thereby, for example, when forming the pixel containing the (B) color conversion light emitting material mentioned later, the color conversion light emitting material from which a composition differs can be separately applied to each pixel easily.

Examples of the liquid-repellent compound include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, Octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1, 1,2,2-tetrafluorobutyl)ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl)ether, sodium perfluorododecylsulfonate, 1,1,2 ,2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, N-[3-(perfluorooctanesulfonamide) Propyl]-N,N'-dimethyl-N-carboxymethyleneammonium betaine, perfluoroalkylsulfonamide propyltrimethylammonium salt, perfluoroalkyl-N-ethylsulfonylglycine salt, bisphosphate (N-perfluoroox) tylsulfonyl-N-ethylaminoethyl), a compound having a fluoroalkyl or fluoroalkylene group in the terminal, main chain, and/or side chain, such as monoperfluoroalkylethyl phosphate ester, etc. are mentioned. In addition, as a commercially available liquid repellent compound, "Megapec" (registered trademark) F142D, F172, F173, F183, F444, F477 (above, Dainippon Ink Chemicals Co., Ltd.), Ftop EF301, 303, 352 (Shin) Akita Kasei Co., Ltd.), Fluorad FC-430, FC-431 (Sumitomo 3M Co., Ltd.)), "AsahiGuard" (registered trademark) AG710, "Sufflon" (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Corporation), BM-1000, BM-1100 (manufactured by Yusho Corporation), NBX-15 , FTX-218, DFX-18 (manufactured by Neos Corporation), and the like. You may contain these 2 or more types. Among these, it is more preferable to have a photopolymerizable group from a point which has high reactivity and can form a firm bond with resin. As a liquid-repellent compound which has a fluorine atom and a photopolymerizable group, "Megapec" (trademark) RS-76-E, RS-56, RS-72-k, RS-75, RS-76-E, RS- 76-NS, RS-76, RS-90 (above, a brand name, DIC Co., Ltd. product) etc. are mentioned. In addition, in this case, in the partition (A-1) containing the photocured material of the negative photosensitive resin composition, the photopolymerizable group may be photopolymerized.

From a viewpoint of improving the liquid-repellent performance of a partition and improving inkjet applicability|paintability, 0.01 weight% or more in solid content is preferable and, as for content of the liquid-repellent compound in a resin composition, 0.1 weight% or more is more preferable. On the other hand, from a viewpoint of improving compatibility with resin and a white pigment, 10 weight% or less in solid content is preferable and, as for content of a liquid repellent compound, 5 weight% or less is more preferable.

Moreover, the resin composition of this invention may contain a ultraviolet absorber, a polymerization inhibitor, surfactant, an adhesive improving agent, etc. as needed.

By containing a ultraviolet absorber in the resin composition of this invention, light resistance can be improved and resolution can be improved more. As the ultraviolet absorber, from the viewpoint of transparency and non-coloring properties, 2-(2H-benzotriazol-2-yl)phenol, 2-(2H-benzotriazol-2-yl)-4,6-tert-pentylphenol, 2 -(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2(2H-benzotriazol-2-yl)-6-dodecyl-4- benzotriazole compounds such as methylphenol and 2-(2'-hydroxy-5'-methacryloxyethylphenyl)-2H-benzotriazole; benzophenone compounds such as 2-hydroxy-4-methoxybenzophenone; A triazine-based compound such as 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[(hexyl)oxy]-phenol is preferably used.

By containing a polymerization inhibitor in the resin composition of this invention, resolution can be improved more. Examples of the polymerization inhibitor include di-t-butylhydroxytoluene, butylhydroxyanisole, hydroquinone, 4-methoxyphenol, 1,4-benzoquinone, and t-butylcatechol. In addition, as a commercially available polymerization inhibitor, "IRGANOX" (registered trademark) 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425, 1520, 245, 259, 3114, 565, 295 (above, trade name, BASF Japan ( Note) and the like. You may contain these 2 or more types.

By containing surfactant in the resin composition of this invention, the flow property at the time of application|coating can be improved. Examples of the surfactant include "Megapec" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (above, trade names, manufactured by Dainippon Ink Chemicals Co., Ltd.), NBX-15 , fluorine-based surfactants such as FTX-218 (above, trade name, manufactured by Neos Corporation); Silicone-based surfactants, such as "BYK" (registered trademark)-333, 301, 331, 345, 307 (above, a brand name, Big Chemie Japan Co., Ltd. product); polyalkylene oxide-based surfactants; Poly(meth)acrylate type surfactant etc. are mentioned. You may contain these 2 or more types.

By containing an adhesive improving agent in the resin composition of this invention, adhesiveness with a base board improves and a reliable partition can be obtained. As an adhesive improving agent, an alicyclic epoxy compound, a silane coupling agent, etc. are mentioned, for example. Among these, since an alicyclic epoxy compound has high heat resistance, the color change after a heating can be suppressed more.

Examples of the alicyclic epoxy compound include 3',4'-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 1,2 of 2,2-bis(hydroxymethyl)-1-butanol -Epoxy-4-(2-oxiranyl)cyclohexane adduct, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy- 4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl) modified ε-caprolactone, 3,4-epoxycyclohexylmethylmethacrylate, hydrogenated bisphenol A diglycidyl ether; Hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, hydrogenated bisphenol A bis(propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis(ethylene glycol glycidyl ether) ether; 1,4-cyclohexanedicarboxylic acid diglycidyl, 1,4-cyclohexanedimethanol diglycidyl ether, etc. are mentioned. You may contain these 2 or more types.

From a viewpoint of improving more adhesiveness with a base board|substrate, 0.1 weight% or more in solid content is preferable, and, as for content of the adhesiveness improving agent in the resin composition of this invention, 1 weight% or more is more preferable. On the other hand, from a viewpoint of suppressing the color change by heating more, 20 weight% or less in solid content is preferable, and, as for content of an adhesiveness improving agent, 10 weight% or less is more preferable.

The resin composition of the present invention can be produced, for example, by mixing the above-mentioned resin, an organometallic compound, a photoinitiator or a quinonediazide compound, a solvent, and other components as needed.

Next, the light-shielding film of the present invention will be described. The light-shielding film of this invention is obtained by hardening|curing the resin composition of this invention mentioned above. The light-shielding film of this invention can be used suitably as a light-shielding pattern in OGS type touch panels, such as a decorative pattern for cover base materials, other than the partition A-1 mentioned later. As for the film thickness of a light shielding film, 10 micrometers or more are preferable.

Next, the manufacturing method of the light shielding film of this invention is demonstrated with an example. The method for producing a light-shielding film of the present invention is a film forming step of applying the resin composition of the present invention on a base substrate and drying it to obtain a dried film, an exposure step of pattern exposure of the obtained dried film, and a developer solution in the dried film after exposure. It is preferable to have the developing process of dissolving and removing a part, and the heating process of hardening by heating the dried film after image development.

The method for producing a light-shielding film of the present invention is characterized in that, in the heating step, the OD value per 10 µm of the film thickness is increased by 0.3 or more by heating the developed film to a temperature of 120°C or higher and 250°C or lower. From a viewpoint of improving an OD value more, 150 degreeC or more is preferable and, as for the heating temperature at the time of a heating process, 180 degreeC or more is more preferable. From a viewpoint of suppressing the crack generation of the film|membrane to be heated, 250 degrees C or less is preferable, and, as for the heating temperature at the time of a heating process, 240 degrees C or less is more preferable. The heating time is preferably 15 minutes to 2 hours. The film formed from the resin composition of the present invention has a low OD value during exposure and an increase in OD value after pattern formation. can Furthermore, since the OD value after pattern formation is high, the barrier rib which made high reflectance and light-shielding property compatible can be obtained.

As a coating method of the resin composition in the said film forming process, the slit coating method, the spin coating method, etc. are mentioned, for example. As a drying apparatus, a hot air oven, a hot plate, etc. are mentioned, for example. The drying time is preferably 80 to 120°C, and the drying time is preferably 1 to 15 minutes.

The exposure step is a step in which a necessary portion of the dried film is photocured by exposure or an unnecessary portion of the dried film is photolyzed to make an arbitrary portion of the dried film soluble in a developer. In an exposure process, you may expose through the photomask which has a predetermined opening part, and arbitrary patterns may be drawn directly using a laser beam etc. without using a photomask.

As an exposure apparatus, a proximity exposure machine is mentioned, for example. As an actinic light irradiated in an exposure process, a near-infrared light, a visible light, and an ultraviolet-ray are mentioned, for example, An ultraviolet-ray is preferable. Moreover, as the light source, a low-pressure mercury-vapor lamp, a high-pressure mercury-vapor lamp, an ultra-high pressure mercury lamp, a halogen lamp, a sterilization lamp, etc. are mentioned, for example, An ultra-high pressure mercury lamp is preferable.

The exposure conditions can be appropriately selected according to the thickness of the dry film to be exposed. In general, it is preferable to use an ultra-high pressure mercury lamp with an output of 1 to 100 mW/cm 2 , and to expose at an exposure amount of 1 to 10,000 mJ/cm 2 .

In the developing step, the developing solution dissolves and removes the developer-soluble portion of the dry film after exposure, and only the portion insoluble in the developer remains, and a dry film patterned in an arbitrary pattern shape (hereinafter referred to as a pattern before heating) ) is the process of obtaining As a pattern shape, shapes, such as a grid|lattice shape and stripe shape, are mentioned, for example.

As a developing method, the immersion method, the spray method, the brush method etc. are mentioned, for example.

As a developing solution, the solvent which can melt|dissolve the unnecessary part in the dry film|membrane after exposure can be selected suitably, and the aqueous solution which has water as a main component is preferable. For example, when a resin composition contains the polymer which has a carboxyl group, aqueous alkali solution is preferable as a developing solution. As aqueous alkali solution, For example, inorganic aqueous alkali solutions, such as sodium hydroxide, potassium hydroxide, sodium carbonate, calcium hydroxide; and organic aqueous alkali solutions such as tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine and diethanolamine. Among these, an aqueous solution of potassium hydroxide or an aqueous solution of tetramethylammonium hydroxide is preferable from the viewpoint of improving the resolution. From a viewpoint of improving developability, 0.05 weight% or more is preferable and, as for the density|concentration of aqueous alkali solution, 0.1 weight% or more is more preferable. On the other hand, from a viewpoint of suppressing peeling and corrosion of a pattern before heating, 5 weight% or less is preferable, and, as for the density|concentration of aqueous alkali solution, 1 weight% or less is more preferable. As for the developing temperature, 20-50 degreeC is preferable in order to make process control easy.

The heating process is a process of heat-hardening the pattern before heating formed in the developing process. As a heating apparatus, a hot plate, oven, etc. are mentioned, for example. Preferred heating temperature and heating time are as described above.

Next, the board|substrate with a partition wall of this invention is demonstrated. The barrier rib substrate of the present invention has barrier ribs (hereinafter, referred to as "partition walls (A-1)" in some cases) in which the (A-1) pattern was formed on the underlying substrate. A base substrate has a function as a support body in a board|substrate with a partition wall. The barrier rib has a function of suppressing color mixing of light between adjacent pixels when it has a pixel containing a color conversion luminescent material described later.

The barrier rib substrate of the present invention is characterized in that the barrier rib A-1 has a reflectance of 20% to 60% per 10 µm in thickness at a wavelength of 550 nm and an OD value per 10 µm in thickness of 1.0 to 3.0. When the reflectance is 20% or more and the OD value is 3.0 or less, the luminance of the display device can be improved by utilizing the reflection on the side of the barrier rib (A-1). On the other hand, when the reflectance is 60% or less and the OD value is 1.0 or more, the light passing through the barrier rib A-1 can be suppressed, and color mixing of light between adjacent pixels can be suppressed.

In Fig. 1, a cross-sectional view of an embodiment of a substrate with barrier ribs of the present invention having a pattern-formed barrier rib is shown. It has a barrier rib 2 pattern-formed on the underlying substrate 1 .

<Lower substrate>

As a base board|substrate, a glass plate, a resin board, a resin film, etc. are mentioned, for example. As a material of a glass plate, an alkali free glass is preferable. As a material of a resin plate and a resin film, polyester, a (meth)acrylic polymer, a transparent polyimide, polyether sulfone, etc. are preferable. 1 mm or less is preferable and, as for the thickness of a glass plate and a resin plate, 0.8 mm or less is preferable. As for the thickness of a resin film, 100 micrometers or less are preferable.

<Bulkhead (A-1)>

The barrier rib A-1 has a reflectance of 20 to 60% and an OD value of 1.0 to 3.0 per 10 µm in thickness at a wavelength of 550 nm. Here, the thickness of the partition wall A-1 refers to the length of the partition wall A-1 in a direction perpendicular to the underlying substrate (height direction). In the case of the board|substrate with a partition wall shown in FIG. 1, the thickness of the partition 2 is represented by the code|symbol H. In addition, the length of the partition wall A-1 in the horizontal direction to the base substrate is made into the width|variety of the partition wall A-1. In the case of the board|substrate with a partition wall shown in FIG. 1, the width|variety of the partition 2 is represented by the code|symbol L.

In this invention, it is thought that the reflectance in the side surface of a partition contributes to brightness improvement of a display device, and the light-shielding property of a partition contributes to color mixing suppression, respectively. On the other hand, since the reflectance per thickness and the OD value are considered to be the same regardless of the thickness direction and the width direction, in the present invention, attention is paid to the reflectance per thickness and the OD value of the barrier rib. In addition, as will be described later, the thickness of the partition wall A-1 is preferably 0.5 to 50 µm, and the width is preferably 5 to 40 µm. Then, in this invention, 10 micrometers was selected as a representative value of the thickness of the partition A-1, and attention was paid to the reflectance per 10 micrometers in thickness, and OD value.

When the reflectance per 10 µm in thickness is less than 20%, the reflection on the side surface of the barrier rib becomes small and the luminance of the display device becomes insufficient. 30 % or more is preferable and, as for the reflectance per 10 micrometers in thickness, 35 % or more is more preferable. The higher the reflectance, the greater the reflection at the side of the barrier rib, and thus the luminance of the display device can be improved. As for the reflectance per 10 micrometers in thickness, 44 % or less is more preferable.

In addition, when the OD value per 10 µm in thickness is less than 1.0, color mixture of light occurs between adjacent pixels. 1.5 or more are preferable and, as for the OD value per 10 micrometers in thickness, 2.0 or more are more preferable. On the other hand, when the OD value per 10 µm in thickness exceeds 3.0, the reflection at the side of the barrier rib becomes small and the luminance of the display device becomes insufficient. As for the OD value per 10 micrometers in thickness, 2.5 or less are more preferable.

The reflectance per 10 µm in thickness of the barrier rib A-1 at a wavelength of 550 nm is determined from the upper surface of the barrier rib A-1 having a thickness of 10 µm using a spectrophotometer (eg, Konica Minolta Co., Ltd. CM- 2600d), can be measured by SCI mode. However, when a sufficient area for measurement cannot be ensured, or when a measurement sample with a thickness of 10 µm cannot be taken, and the composition of the partition wall A-1 is known, the partition wall A-1 and You may obtain the reflectance per 10 micrometers in thickness by producing a solid film with a thickness of 10 micrometers of the same composition, and measuring a reflectance similarly with respect to a solid film instead of the partition A-1. For example, a solid film is produced under the same processing conditions as the formation of the partition wall A-1 except that the thickness is 10 µm using the material from which the partition wall A-1 is formed, and no pattern formation is performed. With respect to the solid film, the reflectance may be similarly measured from the upper surface.

The OD value per 10 µm of the thickness of the barrier rib A-1 is determined using an optical densitometer (for example, 361T (visual) manufactured by X-rite) from the upper surface for the 10 µm thick barrier rib A-1. And by measuring the intensity of transmitted light, it can calculate by following formula (1). However, when a sufficient area for measurement cannot be ensured, or when a measurement sample with a thickness of 10 µm cannot be obtained, and the composition of the partition wall A-1 is known, similarly to the measurement of reflectance, the partition wall You may obtain the OD value per 10 micrometers in thickness by producing a 10 micrometer-thick solid film of the same composition as (A-1), and measuring the OD value similarly with respect to the solid film instead of the partition (A-1).

OD value=log10(I ₀ /I) … (One)

I ₀ : incident light intensity

I: transmitted light intensity.

Moreover, as a means for making the reflectance and OD value into the said range, making the partition A-1 into the preferable composition mentioned later is mentioned, for example.

The taper angle of the partition wall A-1 is preferably 45° to 110°. The taper angle of the barrier rib A-1 refers to an angle between the side and the bottom of the cross section of the barrier rib. In the case of the board|substrate with a partition wall shown in FIG. 1, the taper angle of the partition 2 is represented by the code|symbol θ. By setting the taper angle to 45° or more, the difference between the widths of the upper portion and the bottom portion of the partition wall A-1 becomes small, and the width of the partition wall A-1 can be easily formed in a preferable range to be described later. As for the taper angle, 70 degrees or more are more preferable. On the other hand, when the pixel containing the (B) color conversion luminescent material mentioned later is formed by inkjet coating by making the taper angle into 110 degrees or less, the defect of ink can be suppressed and inkjet applicability|paintability can be improved. Here, the ink agglomeration means a phenomenon in which the ink crosses the barrier rib and mixes in adjacent pixel portions. As for the taper angle, 95 degrees or less are more preferable. The taper angle of the partition wall A-1 accelerates the arbitrary cross section of the partition wall A-1 using an optical microscope (FE-SEM (For example, S-4800 made by Hitachi Seisakusho Co., Ltd.)) It can be obtained by observing at a voltage of 3.0 kV and a magnification of 2,500 times, and measuring the angle between the side and the bottom of the cross section of the partition wall A-1.

In addition, as a means for making the taper angle of the partition wall A-1 into the said range, for example, making the partition wall A-1 into the preferable composition mentioned later, forming using the resin composition of this invention mentioned above things and the like.

It is preferable that the thickness of the partition wall A-1 is larger than the thickness of the pixel, when a board|substrate with a partition has a pixel containing the (B) color conversion luminescent material mentioned later. Specifically, 0.5 micrometer or more is preferable and, as for the thickness of the partition A-1, 10 micrometers or more are more preferable. On the other hand, from a viewpoint of extracting the light emission in a pixel bottom more efficiently, 50 micrometers or less are preferable and, as for the thickness of the partition A-1, 20 micrometers or less are more preferable. In addition, it is preferable that the width of the barrier rib A-1 is sufficient to further improve the luminance by using light reflection on the side surface of the barrier rib and further suppress the color mixing of light in adjacent pixels due to light leakage. . 5 micrometers or more are specifically, preferable and, as for the width|variety of a partition, 15 micrometers or more are more preferable. On the other hand, the width of the partition wall A-1 is preferably 50 µm or less, and more preferably 40 µm or less, from the viewpoint of further improving the luminance by securing a large amount of the light emitting area of the pixel.

The partition wall A-1 has a repeating pattern corresponding to a predetermined number of pixels according to the screen size of the image display device. As the number of pixels of an image display apparatus, 4000 pieces horizontally and 2000 pieces are mentioned vertically, for example. The number of pixels affects the resolution (delicate and dense) of the displayed image. Therefore, it is necessary to form the number of pixels according to the required image resolution and the screen size of the image display apparatus, and it is preferable to determine the pattern formation dimension of the partition wall accordingly.

The partition wall (A-1) is a resin, a white pigment, and particles containing at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver. It is preferable to contain (Hereinafter, it may describe as "metal oxide particle or metal particle"). The resin has a function of improving the crack resistance and light resistance of the partition wall. The white pigment has a function of further improving the reflectance of the barrier rib. A metal oxide particle or a metal particle has a function which adjusts an OD value and suppresses the color mixing of the light in an adjacent pixel.

The resin and the white pigment are as described above as materials constituting the resin composition. From a viewpoint of improving the crack resistance of the partition in heat processing, 10 weight% or more is preferable, and, as for content of resin in partition (A-1), 20 weight% or more is more preferable. On the other hand, from a viewpoint of improving light resistance, 60 weight% or less is preferable and, as for content of resin in partition (A-1), 50 weight% or less is more preferable.

From a viewpoint of improving a reflectance more, 20 weight% or more is preferable and, as for content of the white pigment in partition (A-1), 30 weight% or more is more preferable. On the other hand, from a viewpoint of improving the surface smoothness of a partition, 60 weight% or less is preferable and, as for content of the white pigment in partition (A-1), 55 weight% or less is more preferable.

Metal oxide particles or metal particles refer to black particles or yellow particles generated when the organometallic compound in the above-described resin composition decomposes and aggregates in an exposure step and/or a heating step. The content of the metal oxide particles or metal particles in the partition wall A-1 is preferably 0.2% by weight or more, and 0.5% by weight or more, from the viewpoint of further suppressing color mixing of light in adjacent pixels by adjusting the reflectance and OD to the above-mentioned ranges. Weight % or more is more preferable. On the other hand, from a viewpoint of adjusting reflectance and OD to the above-mentioned range, 5 weight% or less is preferable and, as for content of the metal oxide particle or metal particle in partition A-1, 3 weight% or less is more preferable.

It is preferable that the partition wall (A-1) further contains a liquid repellent compound. By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the partition wall (A-1), and for example, when forming a pixel containing the (B) color conversion light-emitting material described later, a color having a different composition in each pixel The conversion light-emitting material can be easily applied separately. The liquid repellent compound is as described above as a material constituting the resin composition.

From a viewpoint of improving the liquid-repellent performance of a partition and improving inkjet applicability, 0.01 weight% or more is preferable and, as for content of the liquid-repellent compound in partition (A-1), 0.1 weight% or more is more preferable. On the other hand, from a viewpoint of improving compatibility with resin and a white pigment, 10 weight% or less is preferable and, as for content of the liquid repellent compound in partition (A-1), 5 weight% or less is more preferable.

The surface contact angle of the barrier rib (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, and 20° or more from the viewpoint of improving inkjet applicability and facilitating separate application of the color conversion luminescent material. This is more preferable, and 40 degrees or more is still more preferable. On the other hand, from the viewpoint of improving the adhesion between the barrier rib and the underlying substrate, the surface contact angle of the barrier rib A-1 is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition wall A-1 can be measured with respect to the partition wall upper part based on the wettability test method of the substrate glass surface prescribed|regulated to JIS R3257 (enactment date=1999/04/20). Moreover, as a method of making the surface contact angle of the partition A-1 into the said range, the method of using the liquid repellent compound mentioned above, etc. are mentioned, for example.

As a method of pattern-forming the partition wall A-1 on a base board|substrate, the photosensitive paste method is preferable at the point which adjustment of a pattern shape is easy. As a method of patterning the barrier ribs by the photosensitive paste method, for example, an application step of applying the above-mentioned resin composition on a base substrate and drying it to obtain a dried film, an exposure step of pattern exposing the obtained dried film according to a desired pattern shape; The method which has the developing process of dissolving and removing the part soluble in the developing solution in the dry film after exposure, and the heating process of hardening the partition after image development is preferable. It is preferable that the resin composition has positive-type or negative-type photosensitivity. Pattern exposure may expose through the photomask which has a predetermined|prescribed opening part, and may draw arbitrary patterns directly using a laser beam etc. without using a photomask. In addition, when the board|substrate with a barrier rib has the light-shielding barrier rib A-2 mentioned later, on the light-shielding barrier rib A-2, the barrier rib A-1 can be pattern-formed similarly. Each process is as described above as a manufacturing method of the light-shielding film.

<Light-shielding bulkhead (A-2)>

The barrier rib substrate of the present invention further comprises (A-2) patterned barrier ribs (hereinafter referred to as " It is preferable to have a light-shielding partition (A-2)" in some cases. By having the light-shielding partition wall A-2, light-shielding property is improved, the light leakage of the backlight in a display apparatus is suppressed, and a high-contrast and clear image can be obtained.

Fig. 6 is a cross-sectional view showing an embodiment of a substrate with barrier ribs of the present invention having a light-shielding barrier rib. It has the barrier ribs 2 and the light-shielding barrier rib 7 patterned on the underlying substrate 1, and the pixels 3 are arranged in a region spaced apart by the barrier rib 2 and the light-shielding barrier rib 7 .

The light-shielding barrier rib A-2 has an OD value of 0.5 or more per 1.0 µm in thickness. Here, as for the thickness of the light-shielding partition A-2, 0.5-10 micrometers is preferable so that it may mention later. Then, in this invention, 1.0 micrometer was selected as a representative value of the thickness of the partition A-2, and attention was paid to the OD value per 1.0 micrometer of thickness. By setting the OD value per 1.0 µm in thickness to 0.5 or more, the light-shielding property is further improved, and a clearer image with higher contrast can be obtained. As for the OD value per 1.0 micrometer of thickness, 1.0 or more are more preferable. On the other hand, the OD value per 1.0 μm thickness is preferably 4.0 or less, and pattern workability can be improved. As for the OD value per 1.0 micrometer in thickness, 3.0 or less are more preferable. The OD value of the light-shielding barrier rib A-2 can be measured similarly to the OD value of the above-described barrier rib A-1. Moreover, as a means for making OD value into the said range, making light-shielding partition A-2 into the preferable composition mentioned later is mentioned, for example.

From a viewpoint of improving light-shielding property, 0.5 micrometer or more is preferable, and, as for the thickness of light-shielding partition A-2, 1.0 micrometer or more is more preferable. On the other hand, from a viewpoint of improving flatness, 10 micrometers or less are preferable and, as for the thickness of light-shielding partition A-2, 5 micrometers or less are more preferable. Moreover, it is preferable that the width|variety of the light-shielding barrier rib A-2 is about the same as that of the above-mentioned barrier rib A-1.

It is preferable that the light-shielding barrier rib A-2 contains resin and a black pigment. The resin has a function of improving the crack resistance and light resistance of the partition wall. The black pigment has a function of absorbing the incident light and reducing the emitted light.

As resin, an epoxy resin, a (meth)acrylic polymer, a polyurethane, polyester, a polyimide, polyolefin, polysiloxane, etc. are mentioned, for example. You may contain these 2 or more types. Among these, a polyimide is preferable at the point excellent in heat resistance and solvent resistance.

As a black pigment, what was illustrated as a black pigment in the resin composition mentioned above, palladium oxide, platinum oxide, gold oxide, silver oxide, etc. are mentioned. A black pigment selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferable at the point of having high light-shielding property.

As a method of pattern-forming the light-shielding barrier rib A-2 on the base substrate, for example, using the photosensitive material described in Japanese Patent Application Laid-Open No. 2015-1654, similarly to the above-mentioned barrier rib A-1, a photosensitive paste. A method of forming a pattern by a method is preferable.

In the barrier rib substrate of the present invention, pixels containing (B) color conversion luminescent material are further arranged to be spaced apart by the barrier ribs (A-1) (hereinafter referred to as “pixel (B)” in some cases) It is preferable to have The pixel B has a function of enabling color display by converting at least a part of the wavelength region of the incident light to emit outgoing light having a wavelength region different from that of the incident light.

Fig. 2 is a cross-sectional view of one embodiment of a substrate with barrier ribs of the present invention having a pattern-formed barrier rib A-1 and a pixel B containing a color conversion luminescent material. It has a partition wall 2 pattern-formed on the base substrate 1, and the pixel 3 is arrange|positioned in the area|region spaced apart by the partition wall 2. As shown in FIG.

The color conversion material preferably contains a phosphor selected from an inorganic phosphor and an organic phosphor.

The barrier rib board|substrate of this invention can be used as a display device combining the liquid crystal and pixel (B) formed on the backlight which emits blue light, and TFT, for example. In this case, it is preferable to contain a red phosphor which is excited by blue excitation light and emits red fluorescence in the region corresponding to the red pixel. Similarly, it is preferable to contain a green fluorescent substance which is excited by blue excitation light and emits green fluorescence in the region corresponding to the green pixel. It is preferable not to contain a phosphor in the area|region corresponding to a blue pixel.

The substrate with barrier ribs of the present invention can also be used in a display device of a method in which blue microLEDs in which a plurality of blue LEDs corresponding to each pixel are arranged on a substrate by white barrier ribs are used as backlights. ON/OFF of each pixel is made possible by ON/OFF of blue micro LED, and liquid crystal is not required. The barrier rib substrate of the present invention can be used for both the barrier ribs separating each pixel and the barrier ribs separating the blue microLED in the backlight.

As the inorganic phosphor, it is preferable to emit light of each color such as green or red by blue excitation light, that is, one that is excited by excitation light having a wavelength of 400 to 500 nm and has a peak in the region of 500 to 700 nm of emission spectrum. . Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ⁴⁺ activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. You may use these 2 or more types. Among these, quantum dots are preferable. Quantum dots have a smaller average particle diameter compared to other phosphors. (B) Since the surface of the pixel can be smoothed to suppress light scattering on the surface, the light extraction efficiency can be further improved, and the luminance can be further improved there is.

As a quantum dot, the particle|grains containing, for example, group II-IV, group III-V, group IV-VI, group IV semiconductor, etc. are mentioned. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ and the like. You may use these 2 or more types.

The quantum dot may contain a p-type dopant or an n-type dopant. Moreover, a quantum dot may have a core-shell structure. In the core-shell structure, any appropriate functional layer (single layer or multiple layers) may be formed around the shell according to the purpose, and the shell surface may be surface treated and/or chemically modified.

As a shape of a quantum dot, a spherical shape, a columnar shape, a scale shape, a plate shape, an irregular shape etc. are mentioned, for example. The average particle diameter of a quantum dot can be arbitrarily selected according to the desired light emission wavelength, and 1-30 nm is preferable. If the average particle diameter of a quantum dot is 1-10 nm, in each of blue, green, and red, the peak in an emission spectrum can be made sharper. 2 nm or more is preferable and, as for the average particle diameter of a quantum dot, 8 nm or less is preferable. For example, when the average particle diameter of the quantum dots is about 2 nm, blue light is emitted, when the average particle diameter is about 3 nm, green light is emitted, and when the average particle diameter is about 6 nm, red light is emitted. The average particle diameter of a quantum dot can be measured by the dynamic light scattering method. A dynamic light scattering photometer DLS-8000 (made by Otsuka Electronics Co., Ltd.) etc. is mentioned as a measuring apparatus of an average particle diameter.

As an organic fluorescent substance, it is preferable to light-emit each color, such as green and red, with blue excitation light. Examples of the phosphor emitting red fluorescence include a pyromethene derivative having a basic skeleton represented by the following structural formula (8), and a pyromethene derivative having a basic skeleton represented by the following structural formula (9) as a green fluorescence phosphor, etc. can Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of a substituent. You may contain these 2 or more types. Among these, a pyromethene derivative is preferable from a point with a high quantum yield. A pyromethene derivative can be obtained by the method of Unexamined-Japanese-Patent No. 2011-241160, for example.

Since the organic phosphor is soluble in a solvent, the pixel B having a desired thickness can be easily formed.

From a viewpoint of improving a color characteristic, 0.5 micrometer or more is preferable, and, as for the thickness of the pixel B, 1 micrometer or more is more preferable. On the other hand, the thickness of the pixel B is preferably 30 µm or less, and more preferably 20 µm or less, from the viewpoints of reduction in thickness of the display device and curved surface workability.

The size of each pixel B is generally about 20 to 200 μm.

It is preferable that the pixels B are arranged to be spaced apart by the partition wall A-1. By providing a barrier rib between a pixel and a pixel, the diffusion and color mixing of the emitted light can be suppressed more.

As a method of forming the pixel B, for example, a method of filling a space separated by the partition wall A-1 with a coating liquid containing a color conversion luminescent material (hereinafter, a color conversion luminescent material coating liquid) is mentioned. The color conversion light-emitting material coating liquid may further contain a resin or a solvent.

As a method of filling the color conversion luminescent material coating liquid, an inkjet coating method or the like is preferable from the viewpoint of easily dividing and applying different color conversion luminescent materials to each pixel.

You may dry the obtained coating film under reduced pressure and/or heat-dry. In the case of drying under reduced pressure, in order to prevent the drying solvent from re-condensing on the inner wall of the reduced pressure chamber, the reduced pressure drying temperature is preferably 80° C. or less. The pressure of drying under reduced pressure is preferably equal to or less than the vapor pressure of the solvent contained in the coating film, and preferably 1 to 1000 Pa. The drying time under reduced pressure is preferably 10 to 600 seconds. When heat-drying, an oven, a hot plate, etc. are mentioned as a heat-drying apparatus, for example. As for the heat-drying temperature, 60-200 degreeC is preferable. As for heat-drying time, 1 to 60 minutes are preferable.

The substrate with barrier ribs of the present invention may further include (C) a low-refractive-index layer having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm (hereinafter referred to as a “low-refractive-index layer (C)” on the pixel (B)) present) is preferred. By having the low-refractive-index layer (C), the light extraction efficiency can be further improved, and the luminance of the display device can be further improved.

Fig. 3 shows a cross-sectional view of an embodiment of the substrate with barrier ribs of the present invention having a low refractive index layer. It has the partition wall 2 and the pixel 3 pattern-formed on the base substrate 1, and also has the low-refractive-index layer 4 on these.

In the display device, the refractive index of the low-refractive-index layer (C) is preferably 1.20 or more, and more preferably 1.23 or more, from the viewpoint of appropriately suppressing the reflection of light from the backlight and efficiently injecting light into the pixel (B). On the other hand, from a viewpoint of improving a brightness|luminance, 1.35 or less are preferable and, as for the refractive index of a low-refractive-index layer (C), 1.30 or less are more preferable. Here, the refractive index of the low-refractive-index layer (C) can be measured by irradiating light with a wavelength of 550 nm from a direction perpendicular to the cured film surface under atmospheric pressure at 20° C. using a prism coupler.

The low-refractive-index layer (C) preferably contains polysiloxane and silica particles having no hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder capable of forming a transparent layer. In addition, by containing silica particles, minute voids can be efficiently formed in the low-refractive-index layer (C), the refractive index can be reduced, and the refractive index can be easily adjusted to the above-mentioned range. Moreover, since it does not have a hollow structure which tends to generate|occur|produce the crack at the time of cure shrinkage by using the silica particle which does not have a hollow structure, a crack can be suppressed. In addition, in the low refractive index layer (C), polysiloxane and the silica particle which do not have a hollow structure may contain each independently, and the polysiloxane and the silica particle which do not have a hollow structure may be contained in the couple|bonded state. From the viewpoint of the uniformity of the low-refractive-index layer (C), it is preferable that polysiloxane and silica particles having no hollow structure are contained in a bonded state.

The polysiloxane contained in the low-refractive-index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low-refractive-index layer (C) can be easily adjusted to 1.20 to 1.35. The fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds containing at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Furthermore, you may use another alkoxysilane compound.

In the general formula (10), R ⁷ represents a fluoroalkyl group having 3 to 17 fluorines. R ⁶ represents the same group as R ⁶ in the general formulas (5) to (7). m represents 1 or 2. 4-m pieces of R ⁶ and m pieces of R ⁷ may be the same or different, respectively.

Examples of the fluorine-containing alkoxysilane compound represented by the general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoroethyltriisopropoxysilane, trifluoropropyl Trimethoxysilane, trifluoropropyltriethoxysilane, trifluoropropyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltri Isopropoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriisopropoxysilane, trifluoroethylmethyldimethoxysilane, trifluoroethyl Methyldiethoxysilane, trifluoroethylmethyldiisopropoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylmethyldiisopropoxysilane, heptadecafluorodecyl Methyldimethoxysilane, heptadecafluorodecylmethyldiethoxysilane, heptadecafluorodecylmethyldiisopropoxysilane, tridecafluorooctylmethyldimethoxysilane, tridecafluorooctylmethyldiethoxysilane, tridecafluoro Looctylmethyldiisopropoxysilane, trifluoroethylethyldimethoxysilane, trifluoroethylethyldiethoxysilane, trifluoroethylethyldiisopropoxysilane, trifluoropropylethyldimethoxysilane, trifluoro Propylethyldiethoxysilane, trifluoropropylethyldiisopropoxysilane, heptadecafluorodecylethyldimethoxysilane, heptadecafluorodecylethyldiethoxysilane, heptadecafluorodecylethyldiisopropoxysilane, tri and decafluorooctylethyldiethoxysilane, tridecafluorooctylethyldimethoxysilane, and tridecafluorooctylethyldiisopropoxysilane. You may use these 2 or more types.

As for content of polysiloxane in a low-refractive-index layer (C), 4 weight% or more is preferable from a viewpoint of suppressing a crack. On the other hand, as for content of polysiloxane, 32 weight% or less is preferable from a viewpoint of ensuring the thixotropic property by the network between silica particles, maintaining an air layer suitably in the low-refractive-index layer (C), and reducing refractive index more.

As silica particles having no hollow structure in the low refractive index layer (C), for example, "Snowtex" (registered trademark) manufactured by Nissan Chemical Industry Co., Ltd. and "organosilicasol" (registered trademark) series ( isopropyl alcohol dispersion, ethylene glycol dispersion, methyl ethyl ketone dispersion, dimethyl acetamide dispersion, methyl isobutyl ketone dispersion, propylene glycol monomethyl acetate dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, xylene-n-butanol dispersion, toluene dispersion, etc. Part numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, etc.) are mentioned. You may contain these 2 or more types.

The content of silica particles having no hollow structure in the low-refractive-index layer (C) ensures thixotropic properties due to the network between silica particles, appropriately maintains an air layer in the low-refractive-index layer (C), and increases the refractive index. From a viewpoint of reducing, 68 weight% or more is preferable. On the other hand, as for content of the silica particle which does not have a hollow structure, 96 weight% or less is preferable from a viewpoint of suppressing a crack.

The thickness of the low-refractive-index layer (C) is preferably 0.1 µm or more, and more preferably 0.5 µm or more, from the viewpoint of covering the step difference of the pixel (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low-refractive-index layer (C) is preferably 20 µm or less, more preferably 10 µm or less, from the viewpoint of reducing the stress that causes cracks in the low-refractive-index layer (C).

As a formation method of a low-refractive-index layer (C), the point of a formation method is easy, and the application|coating method is preferable. For example, the low-refractive-index layer (C) can be formed by apply|coating the resin composition for low refractive index containing polysiloxane and a silica particle on the pixel (B), drying it, and heating.

Moreover, it is preferable that the board|substrate with a barrier rib of this invention has the inorganic protective layer I with a thickness of 50-1,000 nm further on the said low-refractive-index layer (C). By having the inorganic protective layer I, it becomes difficult for moisture in the air to reach the low-refractive-index layer (C), so it is possible to suppress fluctuations in refractive index of the low-refractive-index layer (C) and suppress luminance deterioration.

Fig. 4 shows a cross-sectional view of one embodiment of the substrate with barrier ribs of the present invention having the low refractive index layer and the inorganic protective layer I. It has the partition wall 2 and the pixel 3 which were pattern-formed on the base board|substrate 1, and also has the low-refractive-index layer 4 and the inorganic protective layer I(5) on these.

Moreover, it is preferable that the board|substrate with a partition wall of this invention has the inorganic protective layer II of 50-1,000 nm in thickness further between the said pixel (B) and the said low-refractive-index layer (C). By having the inorganic protective layer II, the raw material forming the pixel B from the pixel B to the low-refractive-index layer becomes difficult to move. can

Fig. 5 shows a cross-sectional view of an embodiment of a substrate with barrier ribs of the present invention having a low refractive index layer and an inorganic protective layer II. It has the partition wall 2 and the pixel 3 which were pattern-formed on the base board|substrate 1, and also has the inorganic protective layer II(6) and the low-refractive-index layer 4 on these.

Moreover, it is preferable that the board|substrate with a partition of this invention has a 1-5 micrometers-thick color filter (Hereinafter, it may describe as a "color filter") between the base substrate and the said pixel (B). Do. The color filter has a function of transmitting visible light in a specific wavelength region to make the transmitted light a desired color. By having a color filter, the color purity of a display device can be improved. Color purity can be further improved by making the thickness of a color filter into 1 micrometer or more. On the other hand, by making the thickness of a color filter into 5 micrometers or less, a brightness|luminance can be improved more.

In FIG. 6, the cross-sectional view of one aspect of the board|substrate with a partition of this invention which has a color filter is shown. It has the partition 2 and the color filter 7 pattern-formed on the base board|substrate 1, and has the pixel 3 on the color filter 7. As shown in FIG.

As a color filter, the color filter etc. using the pigment dispersion type material which disperse|distributed the pigment to the photoresist used for flat panel displays, such as a liquid crystal display, are mentioned, for example. More specifically, a blue color filter selectively transmitting a wavelength of 400 nm to 550 nm, a green color filter selectively transmitting a wavelength of 500 nm to 600 nm, a yellow color filter selectively transmitting a wavelength of 500 nm or more, and selectively transmitting a wavelength of 600 nm or more Transmissive red color filter, etc. are mentioned. In addition, the color filter may be laminated|separated from the pixel B containing a color conversion luminescent material, and may be laminated|stacked integrally and may be laminated|stacked.

Moreover, it is preferable that the board|substrate with a barrier rib of this invention has inorganic protective layer III and/or yellow organic protective layer of 50-1,000 nm in thickness further between a color filter and the said pixel (B). By having the inorganic protective layer III, the raw material for forming the color filter becomes difficult to reach from the color filter to the pixel (B) containing the color conversion luminescent material, so that the luminance deterioration of the pixel (B) containing the color conversion luminescent material is reduced. can be suppressed Moreover, by having a yellow organic protective layer, the blue leakage light which could not be fully converted by the pixel B containing a color conversion light emitting material can be cut, and color reproducibility can be improved.

Fig. 7 shows a cross-sectional view of an embodiment of a substrate with barrier ribs of the present invention having a color filter and an inorganic protective layer III and/or a yellow organic protective layer. It has partition walls 2 and a color filter 7 patterned on a base substrate 1, has an inorganic protective layer III and/or a yellow organic protective layer 8 thereon, and an inorganic protective layer III and/or a yellow organic protective layer It has pixels 3 spaced apart from each other by partition walls 2 covered with a protective layer 8 .

Moreover, it is preferable that the board|substrate with a barrier rib of this invention has an inorganic protective layer IV and/or a yellow organic protective layer with a thickness of 50-1,000 nm further on the said base board|substrate. The inorganic protective layer IV and/or the yellow organic protective layer act as a refractive index adjusting layer, so that light emitted from the pixel B can be extracted more efficiently, and the luminance of the display device can be further improved. Moreover, the yellow organic protective layer can cut off the blue leakage light which could not be completely converted by the pixel (B) containing a color conversion light emitting material, and can improve color reproducibility. It is more preferable that the inorganic protective layer IV and/or the yellow organic protective layer be provided between the underlying substrate and the partition wall (A) and the pixel (B).

Fig. 8 shows a cross-sectional view of an embodiment of a substrate with barrier ribs of the present invention having an inorganic protective layer IV and/or a yellow organic protective layer. having an inorganic protective layer IV and/or a yellow organic protective layer 9 on a base substrate 1, having partition walls 2 and a color filter 7 patterned thereon, and partition walls 2 patterned thereon; and It has a pixel (3).

Examples of the material constituting the inorganic protective layers I to IV include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; metal nitrides such as silicon nitride; Fluorides, such as magnesium fluoride, etc. are mentioned. You may contain these 2 or more types. Among these, silicon nitride or silicon oxide is more preferable at a point with low water vapor permeability and high permeability.

The thickness of the inorganic protective layers I to IV is preferably 50 nm or more, and more preferably 100 nm or more, from the viewpoint of sufficiently suppressing permeation of substances such as water vapor. On the other hand, from the viewpoint of suppressing the decrease in transmittance, the thickness of the inorganic protective layers I to IV is preferably 800 nm or less, more preferably 500 nm or less.

The thickness of the inorganic protective layers I to IV is measured by exposing a cross section perpendicular to the underlying substrate using a polishing apparatus such as a cross section polisher, and magnifying the cross section using a scanning electron microscope or a transmission electron microscope. can do.

Examples of the method for forming the inorganic protective layers I to IV include sputtering. The inorganic protective layer is preferably colorless and transparent or yellow transparent.

A yellow organic protective layer is obtained by pattern-processing the resin composition of this invention containing the organometallic compound containing silver as an organometallic compound, for example. As mentioned above, the organometallic compound containing silver becomes yellow particle|grains by decomposing|decomposing and aggregating in a heating process in the case of pattern formation, and has a function of yellowing a protective layer. As an organometallic compound containing silver, silver neodecanoate, silver octylate, silver salicylate, etc. are mentioned, for example. Among these, silver neodecanoate is preferable from a viewpoint of yellowing more. The yellow resin composition for organic protective layers WHEREIN: As for content of the organometallic compound containing silver, 0.2 to 5 weight% of solid content is preferable. By making content of the organometallic compound containing silver into 0.2 weight% or more, it can yellow more. As for content of the organometallic compound containing silver, 1.5 weight% or more in solid content is more preferable. On the other hand, when content of the organometallic compound containing silver shall be 5 weight% or less in solid content, the transmittance|permeability can be improved more.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. Examples of the yellow pigment include Pigment Yellow (hereinafter abbreviated as PY) PY12, PY13, PY17, PY20, PY24, PY83, PY86, PY93, PY95, PY109, PY110, PY117, PY125, PY129, PY137, PY138, PY139. , PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, and the like. Among them, from the viewpoint of selectively blocking blue light, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable.

As a method of pattern-forming a yellow organic protective layer, the method of pattern-forming by the photosensitive paste method similarly to the above-mentioned partition (A-1) is preferable.

As shown in Fig. 7, when forming the yellow organic protective layer 8 on the color filter 7, the yellow organic protective layer 8 may serve as an overcoat layer for planarizing each pixel of the color filter.

From the viewpoint of sufficiently blocking blue leakage light, the thickness of the yellow organic protective layer is preferably 100 nm or more, and more preferably 500 nm or more. On the other hand, from a viewpoint of suppressing the fall of light extraction efficiency, 3000 nm or less is preferable and, as for the thickness of a yellow organic protective layer, 2000 nm or less is more preferable.

Next, the display device of the present invention will be described. The display device of the present invention includes the above-mentioned barrier rib-bearing substrate and a light emitting light source. As the luminescent light source, a luminescent light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell and a micro LED cell is preferable. An organic EL cell is more preferable as the light emitting light source from the viewpoint of excellent light emitting characteristics. Here, the mini LED cell refers to a cell in which a plurality of LEDs having a length of about 100 µm to 10 mm in length and width are arranged. The microLED cell refers to a cell in which a large number of LEDs having a length of less than 100 µm in length and width are arranged.

An example of the display apparatus which has the board|substrate with barrier ribs of this invention, and organic electroluminescent cell is given and demonstrated about the manufacturing method of the display device of this invention. A photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed using a photolithography method. After sputtering aluminum thereon, aluminum is patterned by a photolithography method to form a rear electrode layer made of aluminum in an opening without an insulating film. Subsequently, tris(8-quinolinolato)aluminum (hereinafter, abbreviated as Alq3) as an electron transporting layer was formed thereon by vacuum deposition, and then dicyanomethylenepyran, quinacridone and 4 were added to Alq3 as a light emitting layer, A white light emitting layer doped with 4'-bis(2,2-diphenylvinyl)biphenyl is formed. Next, N,N'-diphenyl-N,N'-bis(?-naphthyl)-1,1'-biphenyl-4,4'-diamine as a hole transport layer is formed by vacuum deposition. Finally, as a transparent electrode, ITO is formed into a film by sputtering, and the organic electroluminescent cell which has a white light emitting layer is produced. A display device is producible by making the board|substrate with a barrier rib mentioned above and the organic EL cell obtained in this way oppose and bonding with a sealing agent.

Example

Hereinafter, the present invention will be described in more detail by way of Examples and Comparative Examples, but the present invention is not limited to these scopes. In addition, the name is shown below about the thing using the abbreviation among the used compounds.

PGMEA: propylene glycol monomethyl ether acetate

DAA: diacetone alcohol

BHT: dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1-4 was calculated|required with the following method. 1.5 g of the polysiloxane solution was weighed in an aluminum cup, and heated at 250° C. for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid content remaining in the aluminum cup after heating was measured, and the solid content concentration of the polysiloxane solution was calculated|required from the ratio with respect to the weight before heating.

The weight average molecular weight of the polysiloxane in Synthesis Examples 1-4 was calculated|required with the following method. GPC analysis was performed based on "JIS K7252-3 (establishment date = 2008/03/20)" using a GPC analysis apparatus (HLC-8220; manufactured by Tosoh Corporation), using tetrahydrofuran as a mobile phase, , the weight average molecular weight in terms of polystyrene was measured.

The content rate of each repeating unit in the polysiloxane in Synthesis Examples 1-4 was calculated|required with the following method. The polysiloxane solution was poured into a "Teflon" (registered trademark) NMR sample tube with a diameter of 10 mm, ²⁹ Si-NMR measurement was performed, and Si derived from a specific organosilane with respect to the integral value of all Si derived from the organosilane. The content ratio of each repeating unit was calculated from the ratio of the integral value of . ²⁹ Si-NMR measurement conditions are shown below.

Apparatus: nuclear magnetic resonance apparatus (JNM-GX270; manufactured by Nippon Electronics Co., Ltd.)

Measurement method: Gated decoupling method

Measured nuclear frequency: 53.6693MHz ( ²⁹ Si nucleus)

Spectral Width: 20000Hz

Pulse width: 12 μs (45° pulse)

Pulse repetition time: 30.0 seconds

Solvent: acetone-d6

Reference substance: tetramethylsilane

Measuring temperature: 23℃

Sample rotation rate: 0.0 Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution

In a 1000 ml three-necked flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane, 40.66 g (0.175 mol) of 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropyl succinic anhydride 26.23g (0.10mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.808g of BHT, and 171.62g of PGMEA were added, and 52.65 of water while stirring at room temperature An aqueous solution of phosphoric acid in which 2.265 g of phosphoric acid (1.0 wt% with respect to the input monomer) was dissolved in g was added over 30 minutes. After that, the flask was immersed in a 70°C oil bath and stirred for 90 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100 degreeC 1 hour after the start of temperature increase, and it heat-stirred from there for 2 hours (internal temperature is 100-110 degreeC), and obtained the polysiloxane solution. Moreover, 0.05 liter/classification of the mixed gas of 95 volume% nitrogen and 5 volume% of oxygen was carried out during temperature rise and heating stirring. A total of 131.35 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be 40 weight%, and the polysiloxane (PSL-1) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 4,000. In addition, trifluoropropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclo) in polysiloxane (PSL-1) The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution

In a 1000ml 3-neck flask, 116.07g (0.475mol) of diphenyldimethoxysilane, dimethyldimethoxysilane (0.20mol), 43.46g (0.175mol) of 3-methacryloxypropyltrimethoxysilane, 3-tri 26.23 g (0.10 mol) of methoxysilylpropyl succinic anhydride, 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl) propyltrimethoxysilane, 0.843 g of BHT and 176.26 g of PGMEA were added, While stirring at room temperature, an aqueous solution of phosphoric acid in which 2.221 g of phosphoric acid (1.0 wt% with respect to the input monomer) was dissolved in 43.65 g of water was added over 30 minutes. Then, it carried out similarly to the synthesis example 1, and obtained the polysiloxane solution. A total of 136.90 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be set to 40 weight%, and the polysiloxane (PSL-2) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 2,800. Further, diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclohexyl)propyl in polysiloxane (PSL-2) The molar ratios of each repeating unit derived from trimethoxysilane were 47.5 mol%, 20 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution

In a 1000 ml three-necked flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane, 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropyl succinic acid 26.23 g (0.10 mol) of anhydride, 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl) propyltrimethoxysilane, 0.810 g of BHT and 172.59 g of PGMEA were added, and water was stirred at room temperature while stirring. An aqueous solution of phosphoric acid in which 2.293 g of phosphoric acid (1.0% by weight relative to the input monomer) was dissolved in 54.45 g was added over 30 minutes. Then, it carried out similarly to the synthesis example 1, and obtained the polysiloxane solution. A total of 140.05 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be set to 40 weight%, and the polysiloxane (PSL-3) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 4,100. In addition, trifluoropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclo) in polysiloxane (PSL-3) The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution

In a 1000ml 3-neck flask, 34.05g (0.250mol) of methyltrimethoxysilane, 99.15g (0.500mol) of phenyltrimethoxysilane, 31.25g (0.150mol) of tetraethoxysilane, 3-(3, 24.64 g (0.100 mol) of 4-epoxycyclohexyl) propyltrimethoxysilane and 174.95 g of PGMEA were added, and an aqueous solution of phosphoric acid in which 0.945 g of phosphoric acid (0.50 wt % with respect to the input monomer) was dissolved in 56.70 g of water while stirring at room temperature. was added over 30 minutes. Then, it carried out similarly to the synthesis example 1, and obtained the polysiloxane solution. A total of 129.15 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be set to 40 weight%, and the polysiloxane (PSL-4) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-4) was 4,200. In addition, each repeating unit derived from methyltrimethoxysilane, phenyltrimethoxysilane, tetraethoxysilane and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane in polysiloxane (PSL-4) The molar ratios of were 25 mol%, 50 mol%, 15 mol%, and 10 mol%, respectively.

The compositions of Synthesis Examples 1 to 4 are collectively shown in Table 1.

Synthesis Example 5 Green organic phosphor

3,5-dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis (triphenylphosphine) palladium (0) (0.4 g) and potassium carbonate (2.0 g) It was placed in a flask and purged with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. After the reaction solution was cooled to room temperature and liquid-separated, the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain a white solid of 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g). Next, 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1 drop) and stirred for 4 hours under a nitrogen atmosphere. To the reaction mixture was added a dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g), followed by stirring for an additional 1 hour. After completion of the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was added and stirred, and the organic layer was separated. . The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of a green powder (yield: 17%). ¹ H-NMR analysis results of the obtained green powder were as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 7.95(s, 1H), 7.63-7.48(m, 10H), 6.00(s, 2H), 2.58(s, 6H), 1.50(s, 6H) , 1.37 (s, 18H).

Synthesis Example 6 Red organic phosphor

A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride, and 10 ml of toluene was heated at 120° C. under a nitrogen stream for 6 hours. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and vacuum dried to obtain 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 4-(4-t-butylphenyl)-2-( A mixed solution of 180 mg of 4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride, and 10 ml of degassed toluene was heated at 125°C for 7 hours under a nitrogen stream. After the reaction mixture was cooled to room temperature, 20 ml of water was added, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, then evaporated and dried in vacuo to obtain a pyromethene compound as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyromethene compound and 10 ml of toluene under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was added to the reaction mixture, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of red-purple powder was obtained (yield: 70%). ¹ H-NMR analysis results of the obtained red-purple powder are as follows, and it was confirmed that the obtained red-violet powder was [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19(s, 18H), 3.42(s, 3H), 3.85(s, 6H), 5.72(d, 1H), 6.20(t, 1H), 6.42 -6.97 (m, 16H), 7.89 (d, 4H).

Synthesis Example 7 Polysiloxane solution containing silica particles (LS-1)

In a 500 ml three-neck flask, 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, and 0.10 g (0.4 mmol) of trimethoxysilylpropyl succinic anhydride , 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane and 224.37 g of isopropyl alcohol dispersion (IPA-ST-UP: manufactured by Nissan Chemical Industry Co., Ltd.) of 15.6 wt% silica particles, ethylene 163.93 g of glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous solution of phosphoric acid in which 0.088 g of phosphoric acid was dissolved in 4.09 g of water was added over 3 minutes. Thereafter, the flask was immersed in a 40°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The inner temperature of the solution reached 100° C. 1 hour after the start of the temperature increase, and then heated and stirred for an additional 2 hours (internal temperature was 100 to 110° C.) to obtain a silica particle-containing polysiloxane solution (LS-1). In addition, 0.05 l (liter)/classified nitrogen during the heating and stirring of the temperature. A total of 194.01 g of methanol and water as by-products flowed out during the reaction. The solid content concentration of the obtained silica particle containing polysiloxane solution (LS-1) was 24.3 weight%, and content of the polysiloxane and silica particle in solid content was 15 weight% and 85 weight%, respectively. From methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and γ-acryloxypropyltrimethoxysilane of polysiloxane in the obtained silica particle-containing polysiloxane (LS-1) The molar ratios of each derived repeating unit were 1.0 mol%, 8.0 mol%, 1.0 mol%, and 90.0 mol%, respectively.

Example 1 Resin composition for partition walls (P-1)

As a white pigment, 5.00 g of a titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter "R-960"))) was mixed with 5.00 g of a polysiloxane (PSL-1) solution obtained in Synthesis Example 1 as a resin. and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). Further, 1.00 g of bis (acetylacetonato) palladium as an organometallic compound and 0.861 g (equimolar amount relative to the organometallic compound) of triphenylphosphine as a coordination compound having a phosphorus atom were dissolved in 8.139 g of DAA, An organometallic compound solution (OM-1) was obtained.

Next, 9.98 g of the pigment dispersion (MW-1), 1.86 g of the organometallic compound solution (OM-1), 0.98 g of a polysiloxane (PSL-1) solution, ethanone as a photopolymerization initiator, 1-[9-ethyl- 6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) (“Irgacure” (registered trademark) OXE-02, manufactured by BASF Japan Co., Ltd. (hereinafter) "OXE-02")) 0.050 g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan (hereinafter "IC-819")) 0.400 g, 2-(3-benzoylphenyl)propionic acid 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium as photobase generator (WPBG-266 (trade name), FUJIFILM Wako Pure Chemical Industries, Ltd.) Co., Ltd. (hereinafter “WPBG-266”)) 0.100 g, dipentaerythritol hexaacrylate as a photopolymerizable compound (“KAYARAD” (registered trademark) DPHA, manufactured by New Nippon Pharmaceutical Co., Ltd. (hereinafter “DPHA”) )) 1.20 g, 40 wt% PGMEA dilution of a photopolymerizable fluorine-containing compound (“Megapec” (registered trademark) RS-76-E, manufactured by DIC Corporation (hereinafter “RS-76-E”)) as a liquid repellent compound Solution 1.00 g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (“Celoxide” (registered trademark) 2021P, manufactured by Daicel Co., Ltd. (hereinafter “Celoxide (registered trademark)”) ) 2021P")) 0.100 g, ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] ("IRganox" (registered trademark) 1010, BASF Japan Co., Ltd. (hereinafter “IRGANOX (registered trademark) 1010”)) 0.030 g and acrylic surfactant (“BYK” (registered trademark) 352, manufactured by Big Chemie Japan (hereinafter “BYK-352”))) 0.100 g of a 10 wt% dilution solution of PGMEA (corresponding to a concentration of 500 ppm) was dissolved in 4.20 g of a solvent PGMEA and stirred. The obtained mixture was filtered with a 5.0-micrometer filter, and the resin composition for partitions (P-1) was obtained.

Examples 2 to 3 Resin compositions for partition walls (P-2) to (P-3)

Resin compositions for partition walls (P-2) and (P-3) in the same manner as in Example 1 except that the polysiloxane (PSL-2) or (PSL-3) solution was used instead of the polysiloxane (PSL-1) solution. got

Example 4 Resin composition for bulkheads (P-4)

In Example 1, except that a 40 wt% PGMEA dilution solution of "Megapec" (registered trademark) F477 (Dainippon Ink Chemical Co., Ltd. product) was used instead of the 40 wt% PGMEA dilution solution of RS-76-E. Similarly, the resin composition for partitions (P-4) was obtained.

Example 5 Resin composition for partition walls (P-5)

5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-4) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). 9.98 g of the pigment dispersion (MW-4), 1.86 g of the organometallic compound solution (OM-1), 1.16 g of the polysiloxane (PSL-4) solution, 0.10 g of WPBG-266 as a photobase generator, 1.00 g of a 40 wt% PGMEA diluted solution of F477 as a liquid repellent compound, 0.100 g of Celoxide (registered trademark) 2021P, 1.60 g of THP-17 (trade name, manufactured by Toyo Kosei Co., Ltd.) as a quinonediazide compound, interface 0.100 g of a 10 wt% dilution solution of PGMEA of the activator BYK-352 and 4.10 g of PGMEA were mixed and stirred. The obtained mixture was filtered with a 5.0-micrometer filter, and the resin composition for partitions (P-5) was obtained.

Example 6 Resin composition for partition walls (P-6)

An organometallic compound solution (OM-2) was prepared in the same manner as the organometallic compound solution (OM-1), except that silver neodecanoate was used instead of bis(acetylacetonato)palladium as the organometallic compound. Except having used the organometallic compound solution (OM-2) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition (P-6) for partitions.

Example 7 Resin composition for partition walls (P-7)

An organometallic compound solution (OM-3) was prepared in the same manner as the organometallic compound solution (OM-1), except that chlorotriphenylphosphine gold was used instead of bis(acetylacetonato)palladium as the organometallic compound. Except having used the organometallic compound solution (OM-3) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partitions (P-7).

Example 8 Resin composition for bulkheads (P-8)

An organometallic compound solution (OM-4) was prepared in the same manner as the organometallic compound solution (OM-1), except that bis(acetylacetonato)platinum was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-4) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partitions (P-8).

Example 9 Resin composition for partition walls (P-9)

Except for changing the addition amount of the organometallic compound solution (OM-1) to 0.929 g and the polysiloxane (PSL-1) solution to 1.41 g, and changing the PGMEA 4.20 g to PGMEA 4.70 g as a solvent, Example 1 and Similarly, the resin composition for partitions (P-9) was obtained.

Example 10 Resin composition for bulkheads (P-10)

Except for changing the addition amount of the organometallic compound solution (OM-1) to 0.400 g, the polysiloxane (PSL-1) solution to 1.940 g, and PGMEA 4.20 g as a solvent to 6.27 g PGMEA, Example 1 and Similarly, the resin composition for partitions (P-10) was obtained.

Example 11 Resin composition for partition walls (P-11)

Example 1, except that the amount of the organometallic compound solution (OM-1) added was 4.595 g and the polysiloxane (PSL-1) solution was 0.010 g, and PGMEA 4.20 g was changed to PGMEA 2.92 g as a solvent. Similarly, the resin composition for partitions (P-11) was obtained.

Example 12 Resin composition for bulkheads (P-12)

5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.01 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to disperse the pigment dispersion (MW -2) was obtained. Example except that 9.99 g of pigment dispersion (MW-2) was added instead of pigment dispersion (MW-1), the addition amount of polysiloxane (PSL-1) solution was changed to 1.38 g, and 4.72 g of PGMEA was used as a solvent It carried out similarly to 9, and obtained the resin composition for partitions (P-12).

Example 13 Resin composition for partition walls (P-13)

10.0 g of a polysiloxane (PSL-1) solution as a resin and 0.15 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). 9.99 g of the pigment dispersion (MW-3) was added instead of the pigment dispersion (MW-1), the addition amount of the polysiloxane (PSL-1) solution was changed to 15.16 g, and the addition amount of PGMEA was changed from 4.20 g to 0.11 g Except that, it carried out similarly to Example 1, and obtained the resin composition (P-13) for partitions.

Example 14 Resin composition for bulkheads (P-14)

1.85 g of a 10% DAA solution of bis(acetylacetonato)palladium was used as an organometallic compound instead of the organometallic compound solution (OM-1), the addition amount of the polysiloxane (PSL-1) solution was changed to 1.34g, and the solvent was Except having changed PGMEA 4.20g into PGMEA 3.85g as a slab, it carried out similarly to Example 1, and obtained the resin composition (P-14) for partitions.

Example 15 Resin composition for bulkheads (P-15)

The partition wall in the same manner as in Example 1, except that the photobase generator WPBG-266 was not added, the amount of polysiloxane (PSL-1) solution added was changed to 1.21 g, and PGMEA 4.20 g was changed to PGMEA 4.07 g as a solvent. A resin composition (P-15) for use was obtained.

Example 16 Resin composition for bulkheads (P-16)

Without adding a 40 wt% PGMEA dilution solution of the liquid repellent compound RS-76-E, the amount of polysiloxane (PSL-1) solution added was changed to 2.01 g, and 4.20 g of PGMEA as a solvent was changed to 4.17 g of PGMEA, It carried out similarly to Example 1, and obtained the resin composition (P-16) for partitions.

Comparative Example 1 Resin composition for partition walls (P-17)

Instead of the organometallic compound solution (OM-1), 0.867 g of an organometallic compound solution (OM-5) obtained by using 1.861 g of triphenylphosphine and 8.139 g of DAA as a coordinating compound having a phosphorus atom was added, and polysiloxane (PSL-1) Except having changed the addition amount of the solution into 1.41 g and having changed the addition amount of PGMEA into 4.76 g from 4.20 g, it carried out similarly to Example 1, and obtained the resin composition (P-17) for partitions.

Comparative Example 2 Resin composition for partition walls (P-18)

5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to disperse the pigment dispersion (MW -4) was obtained. Next, 10.02 g of the pigment dispersion (MW-4), 1.73 g of the polysiloxane (PSL-1) solution, 0.050 g of OXE-02 as a photopolymerization initiator, 0.400 g of IC-819, and WPBG as a photobase generator 0.10 g of -266, 1.20 g of DPHA as a photopolymerizable compound, 1.00 g of a 40 wt% PGMEA diluted solution of RS-76-E as a liquid repellent compound, 0.100 g of Celoxide (registered trademark) 2021P, IRGANOX (registered trademark) 0.030 g of 1010, 0.100 g of a 10 wt% dilution solution of BYK-352 of BYK-352 as a surfactant, and 5.31 g of PGMEA as a solvent were mixed and stirred. The obtained mixture was filtered with a filter of 5.0 micrometers, and the resin composition for partitions (P-18) was obtained.

Comparative Example 3 Resin composition for partition walls (P-19)

5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of zirconium nitride as a black pigment were mixed, and dispersed using a mill-type disperser filled with zirconia beads to disperse the pigment dispersion (MW -5) was obtained. Except having used the pigment dispersion liquid (MW-5) instead of the pigment dispersion liquid (MW-4), it carried out similarly to the comparative example 2, and obtained the resin composition for partitions (P-19).

Comparative Example 4 Resin composition for partition walls (P-20)

5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.05 g of a mixed pigment of 60/40 weight ratio of red pigment PR254 and blue pigment PB64 as a black pigment were mixed, and zirconia beads were It was dispersed using a packed mill-type disperser to obtain a pigment dispersion (MW-6). Except having used the pigment dispersion liquid (MW-6) instead of the pigment dispersion liquid (MW-4), it carried out similarly to the comparative example 2, and obtained the resin composition for partitions (P-20).

Comparative Example 5 Resin composition for partition walls (P-21)

An organometallic compound solution (OM-5) was prepared in the same manner as the organometallic compound solution (OM-1), except that tris(acetylacetonato)iron was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-5) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partitions (P-21).

Comparative Example 6 Resin composition for partition walls (P-22)

An organometallic compound solution (OM-5) was prepared in the same manner as the organometallic compound solution (OM-1), except that bis(acetylacetonato)nickel was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-6) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partitions (P-22).

The compositions of Examples 1 to 16 and Comparative Examples 1 to 6 are collectively shown in Tables 2 to 3.

Preparation Example 1 Color conversion light emitting material composition (CL-1)

20 parts by weight of a 0.5% by weight toluene solution of a green quantum dot material (Lumidot 640 CdSe/ZnS, average particle diameter 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, "Irgacure" (registered trademark) 907 (BASF Japan) Co., Ltd.), 166 parts by weight of a 30% by weight PGMEA solution of an acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.) and 97 parts by weight of toluene were mixed and stirred, uniformly dissolved. The obtained mixture was filtered with a syringe filter of 0.45 µm to prepare a color conversion luminescent material composition (CL-1)

Preparation Example 2 Color Conversion Light-Emitting Material Composition (CL-2)

A color conversion luminescent material composition (CL-) was carried out in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 5 was used instead of the green quantum dot material, and the amount of toluene was changed to 117 parts by weight. 2) was prepared

Preparation Example 3 Color Conversion Light-emitting Material Composition (CL-3)

The color conversion luminescent material composition (CL-) was carried out in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 6 was used instead of the green quantum dot material, and the amount of toluene was changed to 117 parts by weight. 3) was prepared

Preparation Example 4 Color filter forming material (CF-1)

90 g of C.I. Pigment Green 59, 60 g of C.I. Pigment Yellow 150, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name), manufactured by Big Chemi (hereinafter referred to as “BYK-6919”))), a binder resin (" 100 g of Adeka Arcles (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.) and 675 g of PGMEA were mixed to prepare a slurry. The beaker into which the slurry was placed was connected with a dyno mill and a tube, and using zirconia beads having a diameter of 0.5 mm as a medium, dispersion treatment was performed at a circumferential speed of 14 m/s for 8 hours to prepare a Pigment Green 59 dispersion (GD-1).

Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin ("Cyclomer" (registered trademark) P(ACA)Z250 (trade name) Daicel Allnex Co., Ltd. (hereinafter "P(ACA)Z250") )) 3.14 g, DPHA 2.64 g, photopolymerization initiator (“Optoma” (registered trademark) NCI-831 (trade name) manufactured by ADEKA Corporation (hereinafter “NCI-831”)) 0.330 g, surfactant (“BYK”) (registered trademark)-333 (trade name) BYK-333 (hereinafter referred to as “BYK-333”)) was mixed with 0.04 g, BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent were mixed, and a color filter forming material (CF- 1) was prepared.

Preparation Example 5 Resin composition for light-shielding barrier ribs

A slurry was prepared by mixing 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Co., Ltd.), 75 g of a polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. The beaker into which the slurry was placed was connected with a dyno mill and a tube, and using zirconia beads having a diameter of 0.5 mm as a medium, dispersion treatment was performed at a peripheral speed of 14 m/s for 8 hours to prepare a pigment dispersion (MB-1).

56.54 g of pigment dispersion (MB-1), 3.14 g of P(ACA)Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, 0.01 g of tert-butylcatechol as a polymerization inhibitor, and 37.30 g of PGMEA was mixed to prepare a resin composition for light-shielding barrier ribs.

Preparation Example 6 Low-refractive-index layer-forming material

After mixing 5.350 g of silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 6, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA, filtration with a syringe filter of 0.45 μm and low refractive index A layer-forming material was prepared.

Preparation Example 7 Yellow organic protective layer forming material (YL-1)

150 g of C.I. Pigment Yellow, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name), manufactured by Big Chemi (hereinafter “BYK-6919”))), and 75 g of binder resin (“Adeca Arcles” (registered trademark) ) WR301 (trade name) manufactured by ADEKA Co., Ltd. (100 g) and PGMEA (675 g) were mixed to prepare a slurry. The beaker into which the slurry was placed was connected with a dyno mill and a tube, and using zirconia beads having a diameter of 0.5 mm as a medium, dispersion treatment was performed at a peripheral speed of 14 m/s for 8 hours to prepare a Pigment Yellow 150 dispersion (YD-1).

An organometallic compound solution prepared using 3.09 g of Pigment Yellow 150 dispersion (YD-1), 23.54 g of a polysiloxane (PSL-1) solution as a resin, 6.02 g of DPHA as a photopolymerizable compound, and silver neodecanoate as an organometallic compound. (OM-2) 6.02 g, OXE-02 as a photoinitiator 0.20 g, IC-819 0.40 g, IRGANOX (registered trademark) 1010 0.060 g, and BYK-352 PGMEA 10% by weight diluted solution 0.050 g (concentration) 500 ppm) was dissolved in 61.15 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 µm filter to obtain a yellow organic protective layer forming material (YL-1).

(Examples 17 to 20, Examples 22 to 28, Examples 38 to 45, Comparative Examples 7 to 9)

A square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness of 0.7 mm) was used as the base substrate. The resin compositions for partition walls shown in Tables 4 to 5 were spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Seijo Co., Ltd.) to produce a dry film. did The prepared dry film was exposed using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source and an exposure amount of 200 mJ/cm 2 (i-line) through a photomask. Thereafter, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045 wt% aqueous potassium hydroxide solution, and then 30 seconds using water. Rinse for a second. In addition, using an oven (trade name IHPS-222, manufactured by SPEC Co., Ltd.), heated at an air temperature of 230 ° C. for 30 minutes, and on a glass substrate, a barrier rib having a height of 10 µm and a width of 20 µm is 30 µm on the short side, The barrier ribs formed in a grid pattern with a pitch interval of 150 μm on the long side were formed.

The color conversion luminescent material compositions shown in Tables 4 to 5 were applied to a region separated by the barrier ribs of the obtained barrier rib substrate under a nitrogen atmosphere using an inkjet method, and dried at 100° C. for 30 minutes to form a 5.0 μm-thick pixel formed, and a substrate with barrier ribs having the configuration shown in FIG. 2 was obtained.

(Example 21)

A square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness of 0.7 mm) was used as the base substrate. The resin composition for barrier ribs shown in Table 4 was spin-coated thereon, and dried at a temperature of 90°C for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screenseijo Co., Ltd.) to prepare a dry film. The prepared dry film was exposed using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source and an exposure amount of 200 mJ/cm 2 (i-line) through a photomask. Thereafter, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was carried out for 90 seconds with a 2.38 wt% aqueous tetramethylammonium hydroxide solution, followed by rinsing with water for 30 seconds. . Then, it bleached by exposing at an exposure amount of 500 mJ/cm<2> (i line|wire) without interposing a photomask similarly to the previous one. In addition, using an oven (trade name IHPS-222, manufactured by SPEC Co., Ltd.), heated for 30 minutes at an air temperature of 230 ° C. The barrier ribs formed in a grid pattern with a pitch interval of 150 μm on the long side were formed.

The color conversion luminescent material compositions shown in Tables 4 to 5 were applied to a region separated by the barrier ribs of the obtained barrier rib substrate under a nitrogen atmosphere by an inkjet method, dried at 100° C. for 30 minutes, and a pixel having a thickness of 5.0 μm was formed to obtain a substrate with barrier ribs having the configuration shown in FIG. 2 .

(Example 29)

A low-refractive-index layer-forming material was spin-coated on the barrier rib-bearing substrate after pixel formation in the same manner as in Example 18, and a hot plate (trade name: SCW-636, manufactured by Dainippon Screenseijo Co., Ltd.) was used to heat the temperature. A dry film was prepared by drying at 90° C. for 2 minutes. Further, using an oven (trade name: IHPS-222, manufactured by SPEC Co., Ltd.), the low-refractive-index layer was formed by heating at an air temperature of 90°C for 30 minutes to obtain a substrate with barrier ribs having the configuration shown in FIG. 3 .

(Example 30)

A film corresponding to the inorganic protective layer I having a thickness of 50 to 1,000 nm using a plasma CVD apparatus (PD-220NL, manufactured by Samco Corporation) on the low refractive index layer of the barrier rib-bearing substrate having the low refractive index layer obtained in Example 29 A 300 nm-thick silicon nitride film was formed to obtain a substrate with barrier ribs having the configuration shown in FIG. 4 .

(Example 31)

On the substrate with barrier ribs obtained in Example 18, using a plasma CVD apparatus (PD-220NL, manufactured by Samco Corporation), a 300 nm thick silicon nitride film, equivalent to 50 to 1,000 nm thick inorganic protective layer II, is formed on the upper pixel layer did Thereafter, on the inorganic protective layer II, a low refractive index layer having a thickness of 1.0 µm was formed in the same manner as in Example 29 using the low-index layer-forming material obtained in Preparation Example 6, and having the configuration shown in FIG. A substrate with barrier ribs was obtained.

(Example 32)

The color filter forming material (CF-1) obtained by the preparation example 4 so that the film thickness after hardening might be set to 2.5 micrometers in the area|region spaced apart by the partition of the board|substrate with partitions before pixel formation obtained by the method similar to Example 17. was applied and vacuum dried. A photomask designed to be exposed in the region of the opening of the substrate with barrier ribs was interposed and exposed at an exposure dose of 40 mJ/cm 2 (i-line). After development was performed for 50 seconds in a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230°C for 30 minutes to form a color filter having a thickness of 2.5 µm and a width of 50 µm in an area separated by a partition wall. Thereafter, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied on the color filter by an inkjet method in a nitrogen atmosphere under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. It formed and obtained the board|substrate with a partition wall of the structure shown in FIG.

(Example 33)

A plasma CVD apparatus (PD-220NL, manufactured by Samco Corporation) was used on the color filter of the barrier rib substrate before pixel formation, on which the color filter having a thickness of 2.5 μm and a width of 50 μm was formed by the method similar to Example 32, and the thickness was applied. A silicon nitride film having a thickness of 300 nm, which corresponds to the inorganic protective layer III of 50 to 1,000 nm, was formed. Further, on the inorganic protective layer III, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied using an inkjet method in a nitrogen atmosphere, dried at 100°C for 30 minutes, and a pixel having a thickness of 5.0 µm was formed to obtain a substrate with barrier ribs having the configuration shown in FIG. 7 .

(Example 34)

A square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness of 0.7 mm) was used as the base substrate. A silicon nitride film having a thickness of 300 nm was formed thereon using a plasma CVD apparatus (PD-220NL, manufactured by Samco Corporation), which corresponds to the inorganic protective layer IV having a thickness of 50 to 1,000 nm. A partition-walled substrate having the configuration shown in Fig. 8 was obtained in the same manner as in Example 31 except that the substrate was used in place of the 10 cm square alkali-free glass substrate.

(Example 35)

The yellow organic protective layer forming material obtained in Preparation Example 7 (YL- 1) was applied and vacuum dried. A photomask designed to be exposed in the region of the opening of the substrate with barrier ribs was interposed and exposed at an exposure dose of 40 mJ/cm 2 (i-line). After developing for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230°C for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 µm and a width of 50 µm. Further, on the yellow organic protective layer, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied using the inkjet method in a nitrogen atmosphere, dried at 100°C for 30 minutes, and a pixel having a thickness of 5.0 µm was formed to obtain a substrate with barrier ribs having the configuration shown in FIG. 7 .

(Example 36)

A square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness of 0.7 mm) was used as the base substrate. On it, the yellow organic protective layer forming material (YL-1) obtained by Preparation Example 7 was apply|coated, and it vacuum-dried. After exposing the dry film to an exposure dose of 40 mJ/cm 2 (i-line) without interposing a photomask, development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, followed by heat curing at 230° C. for 30 minutes to achieve a thickness of 1.0 μm. A yellow organic protective layer of A partition-walled substrate having the configuration shown in Fig. 8 was obtained in the same manner as in Example 31 except that the substrate was used in place of the 10 cm square alkali-free glass substrate.

(Example 37)

A square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness of 0.7 mm) was used as the base substrate. The light-shielding barrier rib forming material obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Seijo Co., Ltd.) to prepare a dry film. . Using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Co., Ltd.), the prepared dry film was exposed to an ultra-high pressure mercury lamp as a light source and an exposure amount of 40 mJ/cm 2 (i-line) through a photomask. Thereafter, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, and then 30 seconds using water. Rinse for a second. In addition, using an oven (trade name: IHPS-222, manufactured by SPEC Co., Ltd.), heated at an air temperature of 230°C for 30 minutes, and on a glass substrate, the OD value per 2.0 µm in height, 20 µm in width, and 1.0 µm in thickness was obtained. A substrate with light-shielding barrier ribs was obtained in which the barrier ribs of 2.0 were formed in a grid pattern with a pitch interval of 30 µm on the short side and 150 µm on the long side. Thereafter, in the same manner as in Example 17, the barrier ribs having a height of 10 µm and a width of 20 µm were formed in the same grid pattern as the light-shielding barrier ribs having a pitch interval of 30 µm on the short side and 150 µm on the long side on the light-shielding barrier ribs. A substrate with barrier ribs was obtained. The color conversion luminescent material composition (CL-2) obtained in Preparation Example 22 was applied to a region separated by the barrier ribs of the obtained barrier rib substrate using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to have a thickness of 5.0 A micrometer pixel was formed, and the board|substrate with a partition wall of the structure shown in FIG. 9 was obtained.

The structures of each Example and Comparative Example are shown in Tables 4 to 5.

The evaluation method in each Example and a comparative example is shown below.

<Refractive index of white pigment>

With respect to the white pigment used in each Example and Comparative Example, method B (immersion method using a microscope (Bekesson method)) The refractive index was measured by The measurement wavelength was 550 nm. However, instead of the immersion liquid used in JIS K7142-2014, "contact liquid" manufactured by Shimadzu Device Seijo Co., Ltd. was used, and the measurement was performed under conditions of immersion liquid temperature: 20°C. A polarizing microscope "Optiphoto" (manufactured by Nikon Corporation) was used as a microscope. 30 samples of the white pigment were prepared, each refractive index was measured, and the average value was made into the refractive index.

<Refractive index of polysiloxane and low refractive index layer>

Polysiloxane, which is a raw material of the barrier rib-forming resin composition used in Examples and Comparative Examples, and the low-refractive-index layer-forming material obtained in Preparation Example 26 were respectively coated on a silicon wafer with a spinner, and a hot plate (trade name: SCW-636, It dried for 2 minutes at the temperature of 90 degreeC using Dainippon Screen Seijo Co., Ltd. product). Then, using an oven (IHPS-222; manufactured by SPEC Co., Ltd.), it heated at 230 degreeC in air for 30 minutes, and produced the cured film. Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), the refractive index is measured by irradiating light with a wavelength of 550 nm from a direction perpendicular to the cured film surface under atmospheric pressure at 20° C., and the third decimal place was rounded off.

<Resolution>

Using a spin coater (trade name: 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for barrier ribs used in Examples and Comparative Examples was applied to a 10 cm square alkali-free glass substrate on a heated film It spin-coated so that it might become 10 micrometers in thickness, and it dried for 2 minutes at 90 degreeC using the hotplate (trade name SCW-636, Dainippon Screen Seijo Co., Ltd. product), and the 10 micrometers-thick dried film was produced.

Using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Co., Ltd.), the prepared dry film was made using an ultra-high pressure mercury lamp as a light source, and 100 µm, 80 µm, 60 µm, 50 µm, 40 µm, 30 µm and Exposure was carried out with a gap of 100 µm at an exposure amount of 200 mJ/cm 2 (i-line) through a mask having a line & space pattern of each width of 20 µm. Thereafter, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045 wt% aqueous potassium hydroxide solution, and then 30 seconds using water. Rinse for a second.

The pattern after development was magnified and observed using a microscope adjusted to a magnification of 100 times, and the narrowest line width among the patterns in which no residue was seen in the unexposed part was used as the resolution. However, it was set as ">100 micrometers" when there was a residue also in the unexposed part near the pattern of 100 micrometers width.

<Reflectance>

The partition-forming resin composition used in each Example and Comparative Example was processed under the same conditions as in each Example and Comparative Example except that the whole was exposed without interposing a photomask at the time of exposure, and a solid film on a glass substrate produced. Using the obtained solid film as a model for the barrier ribs of the barrier rib substrates obtained in each Example and Comparative Example, the glass substrate having the solid film was solid using a spectrophotometer (trade name: CM-2600d, manufactured by Konica Minolta Co., Ltd.). The reflectance in wavelength 550nm was measured in SCI mode from the film|membrane side. However, when cracks occurred in the solid film, since an accurate value could not be obtained due to cracks or the like, the reflectance was not measured.

<crack resistance>

The barrier rib formation resin composition used in each Example and Comparative Example was spin-coated so that the film thickness after heating might be set to 5 micrometers, 10 micrometers, 15 micrometers, and 20 micrometers, respectively. About the subsequent process, except having exposed the whole without interposing a photomask at the time of exposure, it processed under the same conditions as each Example and a comparative example, and produced the solid film on the glass substrate. The obtained solid film was made into the barrier rib model of the board|substrate with barrier ribs obtained by each Example and the comparative example, the glass substrate with a solid film was visually observed, and the presence or absence of the crack of the solid film was evaluated. When even one crack was confirmed, it was judged that there is no crack resistance in the film thickness. For example, when there was no crack in the film thickness of 15 micrometers and there was a crack in the film thickness of 20 micrometers, the crack-resistant film thickness was determined as "≥15 micrometers". In addition, the crack resistance in the case of no crack even at 20 μm was determined as “≥ 20 μm”, and the crack resistance film thickness in the case of cracking even at 5 μm was determined as “<5 μm”, respectively, and the crack resistance was determined.

<OD value>

As a model of the partition of the board|substrate with a partition obtained by each Example and the comparative example, the solid film was produced on the glass substrate similarly to evaluation of a reflectance. With respect to the obtained glass substrate having a solid film, the intensity of the incident light and transmitted light was measured using an optical densitometer (361T (visual); manufactured by X-rite), and the OD value was calculated by the above formula (1). In addition, about the OD value, the solid film before a heating process and OD value after a heating process were measured, respectively, the difference was included and it described in Tables 6-7.

Moreover, with respect to Example 37, the solid film was similarly produced on the glass substrate as a model of the light-shielding barrier rib A-2. With respect to the obtained glass substrate having a solid film, the intensity of the incident light and transmitted light was measured using an optical densitometer (361T (visual); manufactured by X-rite), and it was calculated by the above formula (1).

<Taper angle>

In each Example and Comparative Example, an arbitrary cross section of the substrate with barrier ribs before pixel formation was observed using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi Seisakusho Co., Ltd.) at an acceleration voltage of 3.0 kV. , the taper angle was measured.

<Surface contact angle>

As a model of the partition wall in the board|substrate with a partition wall obtained by each Example and the comparative example, the solid film was produced on the glass substrate similarly to evaluation of a reflectance. With respect to the surface of the obtained solid film, DM-700 manufactured by Kyowa Chemical Co., Ltd., micro-syringe: Teflon (registered trademark) coating needle 22G made by Kyowa Chemical Co., Ltd. for contact angle meter was used, 25 The surface contact angle was measured based on the wettability test method of the substrate glass surface prescribed|regulated to JIS R3257 (enactment date = 1999/04/20) in the air|atmosphere in degreeC and air|atmosphere. However, using propylene glycol monomethyl ether acetate instead of water, the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet applicability>

In the partition wall-bearing substrate obtained by each Example and the comparative example before forming a pixel, PGMEA was used as an ink with respect to the pixel part surrounded by the grid-like partition wall, and an inkjet coating device (InkjetLabo, Cluster Technology Co., Ltd. product) was used for inkjet coating. 160pL of PGMEA per one grid pattern was applied, and the presence or absence of defects (a phenomenon in which ink crosses over the partition wall and mixes into adjacent pixel portions) was observed, and inkjet applicability was evaluated according to the following criteria. It shows that liquid repellency performance is so high that there are few defects, and it is excellent in inkjet applicability|paintability.

A: Ink did not overflow in the pixel.

B: In one part, the ink overflowed from the inside of the pixel to the upper surface of the partition wall.

C: Ink overflowed from the inside of the pixel to the upper surface of the partition in the entire surface.

<thickness>

For the barrier rib-bearing substrates obtained in each Example and Comparative Example, the height of the structure before and after the formation of the pixel B was measured using a surfcom stylus film thickness measuring device, and the difference was calculated for the pixel (B) was measured. About Examples 29-31, the film thickness of the low-refractive-index layer (C) was further, About Examples 32-36, the film thickness of a color filter further, About Example 37, the thickness (height) of a light-shielding partition further. were measured in the same way, respectively.

Further, in Examples 30 to 31 and 33 to 34, by using a polishing apparatus such as a cross section polisher to expose a cross section perpendicular to the underlying substrate, and by magnifying and observing the cross section with a scanning electron microscope or a transmission electron microscope. , the thickness of the inorganic protective layers I to IV were measured, respectively.

<Brightness>

A commercially available area light-emitting device equipped with a LED backlight (peak wavelength 465 nm) was used as a light source, and the barrier rib-bearing substrates obtained in Examples and Comparative Examples were provided so that the pixel portion was on the light source side. A current of 30 mA was passed through the area light emitting device to light the LED element, and the luminance (unit: cd/m 2 ) based on the CIE1931 standard was measured using a spectroradiometer (CS-1000, manufactured by Konica Minolta), and the initial was made with luminance. However, evaluation of luminance was performed by the relative value which makes the initial luminance of Example 45 the standard 100.

Moreover, after lighting the LED element at room temperature (23 degreeC) for 48 hours, the brightness|luminance was similarly measured and the time-dependent change of brightness|luminance was evaluated. However, evaluation of luminance was performed by the relative value which makes the initial luminance of Example 45 the standard 100.

<Color Characteristics>

On a commercially available white reflecting plate, the board|substrate with a partition obtained by each Example and the comparative example was installed so that a pixel might be arrange|positioned on the white reflecting plate side. Using a spectrophotometer (CM-2600d, Konica Minolta Co., Ltd. make, measurement diameter (phi) 8 mm), light was irradiated from the base substrate side of the board|substrate with a barrier rib, and the spectrum into which the specular reflection light entered was measured.

The color gamut determined by the color standard BT.2020, which can reproduce almost natural colors, defines red, green, and blue as three primary colors on the spectral locus shown in the chromaticity diagram, and the wavelengths of red, green, and blue are 630 nm, 532 nm, and It is equivalent to 467 nm. From the reflectance (R) of the three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the emission color of the pixel was evaluated according to the following criteria.

A: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )≥0.55

B: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )<0.55.

<display characteristics>

The display characteristics of the display apparatus produced by combining the board|substrate with a partition obtained by each Example and the comparative example, and organic electroluminescent element were evaluated based on the following reference|standard.

A: A green display is a display device with very vivid colors and excellent contrast.

B: Although the colors are slightly unnatural, it is a display device without a problem.

<mix color>

In the barrier rib-bearing substrate obtained by each Example and Comparative Example before forming the pixel, the color conversion luminescent material composition (CL-2) is applied to a part of the pixel portion surrounded by the grid-like barrier ribs using an inkjet method, It was dried at 100° C. for 30 minutes to form a pixel having a thickness of 5.0 μm. Thereafter, the color conversion luminescent material composition (CL-3) is applied to a region adjacent to the region to which the color conversion light emitting material composition (CL-2) is applied among the pixel portions surrounded by the grid-like partition walls using an inkjet method, and 100 It was dried at ℃ for 30 minutes to form a pixel having a thickness of 5.0 μm.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by the grid-like barrier ribs is produced, the above-described barrier rib-bearing substrate is opposed to the blue organic EL cell, and the blue organic EL cell is bonded with a sealing agent to display the configuration shown in FIG. got the device.

Among the blue organic EL cells 11 in Fig. 10, only the blue organic EL cells bonded directly under the pixel 3 (CL-2) formed of the color conversion light-emitting material composition (CL-2) are turned on, About the pixel 3 (CL-3) part formed with the color conversion luminescent material composition (CL-3), the light absorption intensity A in wavelength 630nm using the microspectrophotometer LVmicro-V (Lambda Vision Co., Ltd. product) (630 nm) was measured. The smaller the value of the absorption intensity A (630 nm), the more difficult it is to cause color mixture. Color mixture was judged according to the following criteria.

A: A(630nm)<0.01

B: 0.01≤A(630nm)≤0.5

C: 0.5<A (630 nm).

The evaluation results of each Example and Comparative Example are shown in Tables 6 to 7.

1: not substrate
2: bulkhead
3: Pixel
3 (CL-2): a pixel formed of the color conversion light-emitting material composition (CL-2)
3 (CL-3): a pixel formed of the color conversion light-emitting material composition (CL-3)
4: low refractive index layer
5: Inorganic protective layer I
6: Inorganic Protection Layer II
7: color filter
8: inorganic protective layer III and/or yellow organic protective layer
9: Inorganic protective layer IV and/or yellow organic protective layer
10: light-shielding bulkhead
11: Blue organic EL cell
H: thickness of bulkhead
L: width of bulkhead
θ: taper angle

Claims (11)

(A-1) A barrier rib substrate having barrier ribs patterned on a base substrate, wherein the reflectance per 10 µm in a wavelength of 550 nm is 20% to 60% and an OD value per 10 µm in thickness is 1.0 to 3.0. . The partition wall according to claim 1, wherein the (A-1) patterned barrier rib is at least one selected from the group consisting of a resin, a white pigment, palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver. A barrier rib-bearing substrate containing particles containing a metal oxide or metal of a species. The barrier rib-attached substrate according to claim 1, wherein the (A-1) patterned barrier rib further contains a liquid repellent compound, and (A-1) the content of the liquid repellent compound in the patterned barrier rib is 0.01 wt% to 10 wt%. The substrate with barrier ribs according to claim 1, wherein the surface contact angle of the patterned barrier ribs with respect to propylene glycol monomethyl ether acetate (A-1) is 10° to 70°. The barrier rib-bearing substrate according to claim 1, wherein the (A-1) pattern-formed barrier rib has a taper angle of 45° to 110°. The substrate with a barrier rib having a patterned light-shielding barrier rib according to claim 1, wherein the OD value per 1.0 µm in thickness is 0.5 or more between the base substrate and (A-1) the patterned barrier rib further (A-2). The barrier rib-bearing substrate according to claim 1, further comprising (B) pixels containing the color conversion light emitting material arranged to be spaced apart by the (A-1) patterned barrier ribs. The substrate with barrier ribs according to claim 7, wherein the color conversion luminescent material contains a phosphor selected from quantum dots and pyromethene derivatives. The barrier rib-bearing substrate according to claim 7, further comprising a color filter having a thickness of 1 to 5 m between the base substrate and (B) the pixel containing the color conversion light emitting material. 10. The method according to claim 9, further comprising: an inorganic protective layer with a thickness of 50 to 1,000 nm on the base substrate or between the color filter having a thickness of 1 to 5 μm and (B) a pixel layer containing a color conversion light emitting material; / or a substrate with barrier ribs having a yellow organic protective layer. A display device comprising: the substrate with barrier ribs according to any one of claims 1 to 10; and a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

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